FR2728726B1 - Composant electronique multipolaire, pouvant etre monte sur une surface - Google Patents

Composant electronique multipolaire, pouvant etre monte sur une surface

Info

Publication number
FR2728726B1
FR2728726B1 FR9515350A FR9515350A FR2728726B1 FR 2728726 B1 FR2728726 B1 FR 2728726B1 FR 9515350 A FR9515350 A FR 9515350A FR 9515350 A FR9515350 A FR 9515350A FR 2728726 B1 FR2728726 B1 FR 2728726B1
Authority
FR
France
Prior art keywords
electronic component
circuit board
housing
foil
contact surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9515350A
Other languages
English (en)
Other versions
FR2728726A1 (fr
Inventor
Heinz Nather
Peter Muhleck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Temic Telefunken Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temic Telefunken Microelectronic GmbH filed Critical Temic Telefunken Microelectronic GmbH
Publication of FR2728726A1 publication Critical patent/FR2728726A1/fr
Application granted granted Critical
Publication of FR2728726B1 publication Critical patent/FR2728726B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H01F2027/295—Surface mounted devices with flexible terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Multi-Conductor Connections (AREA)
  • Led Device Packages (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Devices (AREA)
  • Details Of Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
FR9515350A 1994-12-24 1995-12-22 Composant electronique multipolaire, pouvant etre monte sur une surface Expired - Fee Related FR2728726B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4446566A DE4446566A1 (de) 1994-12-24 1994-12-24 Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement

Publications (2)

Publication Number Publication Date
FR2728726A1 FR2728726A1 (fr) 1996-06-28
FR2728726B1 true FR2728726B1 (fr) 1998-03-13

Family

ID=6537096

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9515350A Expired - Fee Related FR2728726B1 (fr) 1994-12-24 1995-12-22 Composant electronique multipolaire, pouvant etre monte sur une surface

Country Status (7)

Country Link
US (1) US5706177A (fr)
JP (1) JPH08306501A (fr)
DE (1) DE4446566A1 (fr)
FR (1) FR2728726B1 (fr)
GB (1) GB2296602B (fr)
IT (1) IT1276178B1 (fr)
TW (1) TW365106B (fr)

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Also Published As

Publication number Publication date
IT1276178B1 (it) 1997-10-27
US5706177A (en) 1998-01-06
GB2296602A (en) 1996-07-03
JPH08306501A (ja) 1996-11-22
FR2728726A1 (fr) 1996-06-28
TW365106B (en) 1999-07-21
GB9525989D0 (en) 1996-02-21
ITMI952508A1 (it) 1997-05-30
ITMI952508A0 (fr) 1995-11-30
GB2296602B (en) 1998-09-16
DE4446566A1 (de) 1996-06-27

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ST Notification of lapse