JP4739842B2 - 表面実装型led - Google Patents
表面実装型led Download PDFInfo
- Publication number
- JP4739842B2 JP4739842B2 JP2005214703A JP2005214703A JP4739842B2 JP 4739842 B2 JP4739842 B2 JP 4739842B2 JP 2005214703 A JP2005214703 A JP 2005214703A JP 2005214703 A JP2005214703 A JP 2005214703A JP 4739842 B2 JP4739842 B2 JP 4739842B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- light
- resin
- led chip
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
2 パッケージ
3 カップ
4 内周面
5、5a、5b LEDチップ
6 ボンディングワイヤ
7 透光性樹脂
8 ダイシング面
9 背面
10 底面
11 前面
12 側面
13 上面光出射面
14 実装基板
15a、15b 回路パターン
16 はんだフィレット
17 界面
18 端面光出射面
Claims (6)
- 略平坦な内底面と該内底面から立上がって上方に開口を有する内周面とからなる凹形状のカップを形成した樹脂パッケージの前記カップ内に透光性樹脂が充填された構造体を、前記透光性樹脂を通り前記内底面に略垂直な面で切断した形状の本体を有し、前記本体のカップ内底面に露出した一対のリードフレームの一方に少なくとも1個以上のLEDチップが搭載され、前記本体の切断面に対向する前記樹脂パッケージの背面から外部に突出した前記一対のリードフレームが前記パッケージの背面側から底面側を経て前記本体の切断面側まで回り込んでいることを特徴とする表面実装型LED。
- 請求項1において、前記本体の切断面側に回り込んだ前記一対のリードフレームが更に延びて前記パッケージの側面側まで回り込んでいることを特徴とする請求項1に記載の表面実装型LED。
- 前記パッケージを形成する樹脂は、反射性を有することを特徴とする請求項1又は2の何れか1項に記載の表面実装型LED。
- 前記リードフレームは、少なくとも表面が光反射性を有することを特徴とする請求項1〜3の何れか1項に記載の表面実装型LED。
- 前記カップ内に充填する透光性樹脂は、エポキシ系樹脂又はシリコーン系樹脂であることを特徴とする請求項1〜4何れか1項に記載の表面実装型LED。
- 前記透光性樹脂には、LED チップからの光を波長変換する蛍光物質が少なくとも1種類以上混入されていることを特徴とする請求項5に記載の表面実装型LED。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005214703A JP4739842B2 (ja) | 2005-07-25 | 2005-07-25 | 表面実装型led |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005214703A JP4739842B2 (ja) | 2005-07-25 | 2005-07-25 | 表面実装型led |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007035794A JP2007035794A (ja) | 2007-02-08 |
JP4739842B2 true JP4739842B2 (ja) | 2011-08-03 |
Family
ID=37794701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005214703A Expired - Fee Related JP4739842B2 (ja) | 2005-07-25 | 2005-07-25 | 表面実装型led |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4739842B2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008193018A (ja) * | 2007-02-08 | 2008-08-21 | Wen-Gung Sung | サイド発光ダイオードの製造方法及びその構造 |
JP4759527B2 (ja) | 2007-02-16 | 2011-08-31 | 東海ゴム工業株式会社 | 制振装置 |
US9022632B2 (en) * | 2008-07-03 | 2015-05-05 | Samsung Electronics Co., Ltd. | LED package and a backlight unit unit comprising said LED package |
JP5217800B2 (ja) | 2008-09-03 | 2013-06-19 | 日亜化学工業株式会社 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
KR101662487B1 (ko) * | 2009-10-27 | 2016-10-17 | 삼성전자주식회사 | 백라이트 유닛 |
JP5381684B2 (ja) * | 2009-12-22 | 2014-01-08 | 日亜化学工業株式会社 | 発光装置の製造方法 |
US20130049058A1 (en) * | 2010-04-30 | 2013-02-28 | Rohm Co., Ltd. | Led module |
JP5528900B2 (ja) * | 2010-04-30 | 2014-06-25 | ローム株式会社 | 発光素子モジュール |
JP5535750B2 (ja) * | 2010-04-30 | 2014-07-02 | ローム株式会社 | 発光素子モジュール |
CN102299221A (zh) * | 2011-09-15 | 2011-12-28 | 东莞市晨彩照明科技有限公司 | 一种led双色灯封装方法 |
TW201517323A (zh) | 2013-08-27 | 2015-05-01 | Glo Ab | 模製發光二極體封裝及其製造方法 |
US8999737B2 (en) | 2013-08-27 | 2015-04-07 | Glo Ab | Method of making molded LED package |
US9142745B2 (en) | 2013-08-27 | 2015-09-22 | Glo Ab | Packaged LED device with castellations |
JP6303344B2 (ja) * | 2013-09-05 | 2018-04-04 | 日亜化学工業株式会社 | 発光装置 |
KR102374529B1 (ko) * | 2015-05-29 | 2022-03-17 | 엘지디스플레이 주식회사 | 발광 다이오드 패키지와 그의 제조 방법, 이를 이용한 백라이트 유닛과 액정 표시 장치 |
DE102015115824A1 (de) | 2015-09-18 | 2017-03-23 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05315651A (ja) * | 1992-05-08 | 1993-11-26 | Rohm Co Ltd | 側面発光型の半導体発光素子を製造する方法 |
JPH08306501A (ja) * | 1994-12-24 | 1996-11-22 | Temic Telefunken Microelectron Gmbh | 表面取付け可能な多極電子構成要素 |
JPH11330131A (ja) * | 1998-05-20 | 1999-11-30 | Rohm Co Ltd | 半導体装置 |
JP2001057444A (ja) * | 1999-08-19 | 2001-02-27 | Rohm Co Ltd | 半導体発光装置の製造方法 |
JP2002223002A (ja) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | パッケージ成形体と発光装置 |
JP2002246652A (ja) * | 2001-02-21 | 2002-08-30 | Nippon Leiz Co Ltd | 光源装置 |
JP2002299698A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Electric Ind Ltd | 発光装置 |
JP2005019838A (ja) * | 2003-06-27 | 2005-01-20 | Nippon Leiz Co Ltd | 光源装置および光源装置の製造方法 |
-
2005
- 2005-07-25 JP JP2005214703A patent/JP4739842B2/ja not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05315651A (ja) * | 1992-05-08 | 1993-11-26 | Rohm Co Ltd | 側面発光型の半導体発光素子を製造する方法 |
JPH08306501A (ja) * | 1994-12-24 | 1996-11-22 | Temic Telefunken Microelectron Gmbh | 表面取付け可能な多極電子構成要素 |
JPH11330131A (ja) * | 1998-05-20 | 1999-11-30 | Rohm Co Ltd | 半導体装置 |
JP2001057444A (ja) * | 1999-08-19 | 2001-02-27 | Rohm Co Ltd | 半導体発光装置の製造方法 |
JP2002223002A (ja) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | パッケージ成形体と発光装置 |
JP2002246652A (ja) * | 2001-02-21 | 2002-08-30 | Nippon Leiz Co Ltd | 光源装置 |
JP2002299698A (ja) * | 2001-03-30 | 2002-10-11 | Sumitomo Electric Ind Ltd | 発光装置 |
JP2005019838A (ja) * | 2003-06-27 | 2005-01-20 | Nippon Leiz Co Ltd | 光源装置および光源装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2007035794A (ja) | 2007-02-08 |
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