ES8703710A1 - Un metodo de formacion de una placa de circuito de multiplescapas - Google Patents

Un metodo de formacion de una placa de circuito de multiplescapas

Info

Publication number
ES8703710A1
ES8703710A1 ES547790A ES547790A ES8703710A1 ES 8703710 A1 ES8703710 A1 ES 8703710A1 ES 547790 A ES547790 A ES 547790A ES 547790 A ES547790 A ES 547790A ES 8703710 A1 ES8703710 A1 ES 8703710A1
Authority
ES
Spain
Prior art keywords
plating
substrates
conductive material
circuit board
plating resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES547790A
Other languages
English (en)
Other versions
ES547790A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METTLER ROLLIN W
Original Assignee
METTLER ROLLIN W
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by METTLER ROLLIN W filed Critical METTLER ROLLIN W
Publication of ES8703710A1 publication Critical patent/ES8703710A1/es
Publication of ES547790A0 publication Critical patent/ES547790A0/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Medicines Containing Antibodies Or Antigens For Use As Internal Diagnostic Agents (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Sampling And Sample Adjustment (AREA)

Abstract

METODO PARA LA FORMACION DE PLACAS DE CIRCUITO DE MULTIPLES CAPAS. COMPRENDE LAS SIGUIENTES OPERACIONES: PRIMERA, SE PROPORCIONA UN PRIMER MOLDE DE INYECCION CERRADO DESTINADO A FORMAR UN PRIMER SUSTRATO DE PLACA DE CIRCUITO QUE TIENE ESPIGAS DE INTERCONEXION QUE SE PROYECTAN FUERA DE LA SUPERFICIE DEL SUSTRATO; SEGUNDA, SE PROPORCIONA UN SEGUNDO MOLDE DE INYECCION CERRADO DESTINADO A FORMAR UN SEGUNDO SUSTRATO DE PLACA DE CIRCUITO, QUE ESTA CONFIGURADO PARA COINCIDIR CON EL PRIMER SUSTRATO, Y QUE TIENE AGUJEROS DE INTERCONEXION PARA RECIBIR LAS ESPIGAS DE INTERCONEXION DEL PRIMER SUSTRATO, Y QUE TIENE AGUJEROS DE INTERCONEXION PARA RECIBIR LAS ESPIGAS DE INTERCONEXION DEL PRIMER SUSTRATO; TERCERA, SE PLICA MATERIAL CONDUCTOR ELECTRICO SOBRE DETERMINADAS PARTES DE LAS SUPERFICIES DE LOS SUSTRATOS PRIMERO Y SEGUNDO.
ES547790A 1984-10-12 1985-10-11 Un metodo de formacion de una placa de circuito de multiplescapas Expired ES8703710A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66049584A 1984-10-12 1984-10-12
US06/771,134 US4591220A (en) 1984-10-12 1985-08-28 Injection molded multi-layer circuit board and method of making same

Publications (2)

Publication Number Publication Date
ES8703710A1 true ES8703710A1 (es) 1987-02-16
ES547790A0 ES547790A0 (es) 1987-02-16

Family

ID=27098104

Family Applications (2)

Application Number Title Priority Date Filing Date
ES547790A Expired ES8703710A1 (es) 1984-10-12 1985-10-11 Un metodo de formacion de una placa de circuito de multiplescapas
ES1986296837U Expired ES296837Y (es) 1984-10-12 1986-01-27 Una placa de circuitos de multiples capas

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES1986296837U Expired ES296837Y (es) 1984-10-12 1986-01-27 Una placa de circuitos de multiples capas

Country Status (12)

Country Link
US (1) US4591220A (es)
EP (1) EP0198053A4 (es)
AU (1) AU572437B2 (es)
BR (1) BR8506952A (es)
CA (1) CA1228932A (es)
DK (1) DK234586D0 (es)
ES (2) ES8703710A1 (es)
GB (1) GB2183921B (es)
HK (1) HK1289A (es)
NO (1) NO862358D0 (es)
PH (1) PH22124A (es)
WO (1) WO1986002518A1 (es)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159793A (ja) * 1984-12-31 1986-07-19 株式会社　アサヒ化学研究所 基板に導電回路を形成する方法
US4685210A (en) * 1985-03-13 1987-08-11 The Boeing Company Multi-layer circuit board bonding method utilizing noble metal coated surfaces
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
US4689103A (en) * 1985-11-18 1987-08-25 E. I. Du Pont De Nemours And Company Method of manufacturing injection molded printed circuit boards in a common planar array
US4801489A (en) * 1986-03-13 1989-01-31 Nintendo Co., Ltd. Printed circuit board capable of preventing electromagnetic interference
JPH0648404B2 (ja) * 1986-06-12 1994-06-22 コニカ株式会社 現像装置
US4770921A (en) * 1986-09-11 1988-09-13 Insulating Materials Incorporated Self-shielding multi-layer circuit boards
US4847446A (en) * 1986-10-21 1989-07-11 Westinghouse Electric Corp. Printed circuit boards and method for manufacturing printed circuit boards
US5114518A (en) * 1986-10-23 1992-05-19 International Business Machines Corporation Method of making multilayer circuit boards having conformal Insulating layers
US4918574A (en) * 1986-10-23 1990-04-17 International Business Machines Corporation Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities
GB2212333A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Method of fabricating multi-layer circuits
US5036431A (en) * 1988-03-03 1991-07-30 Ibiden Co., Ltd. Package for surface mounted components
US4894016A (en) * 1988-06-27 1990-01-16 Gte Products Corporation Electrical connector
US4861534A (en) * 1988-06-29 1989-08-29 International Business Machines Corporation Method and apparatus for the injection molding of circuit boards
EP0399161B1 (en) * 1989-04-17 1995-01-11 International Business Machines Corporation Multi-level circuit card structure
GB2242317A (en) * 1989-09-11 1991-09-25 Itt Ind Ltd Electrical connecting arrangement
US4979090A (en) * 1989-12-11 1990-12-18 Sundstrand Corporation Power converter circuit board
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
US5127838A (en) * 1990-02-23 1992-07-07 General Electric Company Plated electrical connectors
US5156552A (en) * 1990-02-23 1992-10-20 General Electric Company Circuit board edge connector
US5158465A (en) * 1990-02-23 1992-10-27 General Electric Company Audio jack connector
US4985116A (en) * 1990-02-23 1991-01-15 Mint-Pac Technologies, Inc. Three dimensional plating or etching process and masks therefor
JP2747113B2 (ja) * 1990-11-28 1998-05-06 北川工業株式会社 導電線内蔵筐体
JPH0779191B2 (ja) * 1991-04-08 1995-08-23 株式会社東芝 立体配線板の製造方法
US5259110A (en) * 1992-04-03 1993-11-09 International Business Machines Corporation Method for forming a multilayer microelectronic wiring module
US5455741A (en) * 1993-10-26 1995-10-03 Pulse Engineering, Inc. Wire-lead through hole interconnect device
US5619018A (en) * 1995-04-03 1997-04-08 Compaq Computer Corporation Low weight multilayer printed circuit board
US5914534A (en) * 1996-05-03 1999-06-22 Ford Motor Company Three-dimensional multi-layer molded electronic device and method for manufacturing same
US5938455A (en) * 1996-05-15 1999-08-17 Ford Motor Company Three-dimensional molded circuit board having interlocking connections
US5819401A (en) * 1996-06-06 1998-10-13 Texas Instruments Incorporated Metal constrained circuit board side to side interconnection technique
US6005463A (en) * 1997-01-30 1999-12-21 Pulse Engineering Through-hole interconnect device with isolated wire-leads and component barriers
DE10023736A1 (de) * 2000-05-15 2001-11-22 Harting Elektrooptische Bauteile Gmbh & Co Kg Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte
US7981703B2 (en) * 2007-05-29 2011-07-19 Occam Portfolio Llc Electronic assemblies without solder and methods for their manufacture
FI20070910A0 (fi) * 2007-11-27 2007-11-27 Kimmo Olavi Paananen Menetelmä piirilevyjen panelisointiin
US8623689B2 (en) * 2010-07-07 2014-01-07 Ineffable Cellular Limited Liability Company Package process of backside illumination image sensor
US9247649B2 (en) 2013-05-06 2016-01-26 Globalfoundries Inc. Printed circuit boards fabricated using congruent molds
CN104159399B (zh) * 2014-08-01 2017-12-15 深圳市华星光电技术有限公司 一种电路板及显示面板
JP6436296B2 (ja) * 2014-10-24 2018-12-12 パナソニックＩｐマネジメント株式会社 立体回路基板および当該立体回路基板を用いたセンサモジュール

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GB784516A (en) * 1954-07-02 1957-10-09 Beck S Inc Electric circuits and methods of making same
US3028573A (en) * 1959-05-01 1962-04-03 Automatic Elect Lab Cross-connecting board
US3201851A (en) * 1960-10-05 1965-08-24 Sanders Associates Inc Method of making interconnecting multilayer circuits
US3350250A (en) * 1962-03-21 1967-10-31 North American Aviation Inc Method of making printed wire circuitry
US3276106A (en) * 1963-07-01 1966-10-04 North American Aviation Inc Preparation of multilayer boards for electrical connections between layers
US3322881A (en) * 1964-08-19 1967-05-30 Jr Frederick W Schneble Multilayer printed circuit assemblies
US3465435A (en) * 1967-05-08 1969-09-09 Ibm Method of forming an interconnecting multilayer circuitry
US3680209A (en) * 1969-05-07 1972-08-01 Siemens Ag Method of forming stacked circuit boards
US3880486A (en) * 1973-03-05 1975-04-29 Epis Corp Apparatus and system for interconnecting circuits and electronic components
US3934335A (en) * 1974-10-16 1976-01-27 Texas Instruments Incorporated Multilayer printed circuit board
US4191800A (en) * 1976-05-27 1980-03-04 Bell Telephone Laboratories, Incorporated Devices employing flexible substrates and method for making same
SU834950A1 (ru) * 1979-08-24 1981-05-30 Предприятие П/Я А-3759 Устройство дл соединени печатныхплАТ
DE2949184A1 (de) * 1979-12-06 1981-07-23 Siemens AG, 1000 Berlin und 8000 München Elektrische leiterplatte
DE3014041C2 (de) * 1980-04-11 1982-04-08 Braun Ag, 6000 Frankfurt Verfahren zur Aufbringung von elektrisch leitenden Bahnen auf einen Träger aus Isolierstoff

Also Published As

Publication number Publication date
GB2183921B (en) 1988-03-16
DK234586A (da) 1986-05-20
HK1289A (en) 1989-01-13
ES296837U (es) 1988-02-16
DK234586D0 (da) 1986-05-20
PH22124A (en) 1988-06-01
CA1228932A (en) 1987-11-03
GB2183921A (en) 1987-06-10
GB8614547D0 (en) 1986-07-23
NO862358L (no) 1986-06-12
ES296837Y (es) 1988-11-16
WO1986002518A1 (en) 1986-04-24
US4591220A (en) 1986-05-27
AU572437B2 (en) 1988-05-05
EP0198053A1 (en) 1986-10-22
ES547790A0 (es) 1987-02-16
EP0198053A4 (en) 1988-02-08
BR8506952A (pt) 1986-12-23
NO862358D0 (no) 1986-06-12
AU4867185A (en) 1986-05-02

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