JP6436296B2 - 立体回路基板および当該立体回路基板を用いたセンサモジュール - Google Patents
立体回路基板および当該立体回路基板を用いたセンサモジュール Download PDFInfo
- Publication number
- JP6436296B2 JP6436296B2 JP2014217581A JP2014217581A JP6436296B2 JP 6436296 B2 JP6436296 B2 JP 6436296B2 JP 2014217581 A JP2014217581 A JP 2014217581A JP 2014217581 A JP2014217581 A JP 2014217581A JP 6436296 B2 JP6436296 B2 JP 6436296B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- wiring pattern
- light receiving
- base portion
- sensor module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
- G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
- H01L2924/15159—Side view
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
Description
本実施形態にかかるセンサモジュール10は、図1に示すような携帯電話機(携帯端末装置)1に実装されるものである。
本実施形態にかかるセンサモジュール10Aは、基本的に上記第1実施形態で示したセンサモジュール10とほぼ同様の構成をしている。すなわち、センサモジュール10Aは、図7に示すように、回路基板(基板)80に実装可能に形成された立体回路基板20を用いて形成されている。
本実施形態にかかるセンサモジュール10Bは、基本的に上記第1実施形態で示したセンサモジュール10とほぼ同様の構成をしている。すなわち、センサモジュール10Bは、図8に示すように、回路基板(基板)80に実装可能に形成された立体回路基板20を用いて形成されている。
20 立体回路基板
21 基体部
22 外面
23 搭載面
28 実装面
29 凹所
31 嵌合突起(嵌合部)
40 配線パターン
50 発光素子(電子部品:センサ素子)
60 受光素子(電子部品:センサ素子)
80 回路基板(基板)
82 嵌合孔(被嵌合部)
83 半田
Claims (6)
- 基板に実装可能に形成された立体回路基板であって、
基体部と、
前記基体部の外面に形成された配線パターンと、
を備え、
前記基体部の外面は、
前記基板への実装時に当該基板に対面する実装面と、
前記実装面とは異なる面で、電子部品を搭載可能な搭載面と、
を有し、
前記基体部の前記実装面側に凹所が形成され、
前記搭載面に第1の凹部が形成され、
前記第1の凹部は、底面と、第1の側面を介して前記底面と連設する第1段差面と、第2の側面を介して前記第1段差面と連設する第2段差面と、を有し、
前記第1段差面は、前記配線パターンのうちボンディングワイヤが接続される部位が形成され、前記第2段差面は、レンズを載置可能なレンズ載置面を有していることを特徴とする立体回路基板。 - 前記配線パターンが前記搭載面および前記凹所の内表面に形成されていることを特徴とする請求項1に記載の立体回路基板。
- 前記基体部は、前記基板に形成された被嵌合部に嵌合可能に形成された嵌合部を備え、
前記嵌合部は、前記被嵌合部に係止可能な爪部を有していることを特徴とする請求項1または請求項2に記載の立体回路基板。 - 前記嵌合部には、前記基板に半田付けするための配線パターンが形成されていることを特徴とする請求項3に記載の立体回路基板。
- 前記基板の厚み方向から視た際に、前記搭載面と前記実装面とが重なっていることを特徴とする請求項1〜4のうちいずれか1項に記載の立体回路基板。
- 請求項1〜5に記載の立体回路基板を用いたことを特徴とするセンサモジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014217581A JP6436296B2 (ja) | 2014-10-24 | 2014-10-24 | 立体回路基板および当該立体回路基板を用いたセンサモジュール |
PCT/JP2015/005028 WO2016063466A1 (ja) | 2014-10-24 | 2015-10-02 | 立体回路基板および当該立体回路基板を用いたセンサモジュール |
CN201580052160.3A CN106717133B (zh) | 2014-10-24 | 2015-10-02 | 立体电路基板以及利用了该立体电路基板的传感器模块 |
US15/518,797 US10004140B2 (en) | 2014-10-24 | 2015-10-02 | Three-dimensional circuit substrate and sensor module using three-dimensional circuit substrate |
EP15852745.7A EP3211975A4 (en) | 2014-10-24 | 2015-10-02 | Three-dimensional circuit substrate and sensor module using three-dimensional circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014217581A JP6436296B2 (ja) | 2014-10-24 | 2014-10-24 | 立体回路基板および当該立体回路基板を用いたセンサモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016086068A JP2016086068A (ja) | 2016-05-19 |
JP6436296B2 true JP6436296B2 (ja) | 2018-12-12 |
Family
ID=55760527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014217581A Active JP6436296B2 (ja) | 2014-10-24 | 2014-10-24 | 立体回路基板および当該立体回路基板を用いたセンサモジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US10004140B2 (ja) |
EP (1) | EP3211975A4 (ja) |
JP (1) | JP6436296B2 (ja) |
CN (1) | CN106717133B (ja) |
WO (1) | WO2016063466A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11355427B2 (en) * | 2016-07-01 | 2022-06-07 | Intel Corporation | Device, method and system for providing recessed interconnect structures of a substrate |
TWI678953B (zh) | 2016-07-07 | 2019-12-01 | 美商莫仕有限公司 | 模塑互連元件及製造其的方法 |
JP7318863B2 (ja) * | 2019-02-09 | 2023-08-01 | 株式会社ウイルダイフレックス | モジュール基板及び電子機器ユニット |
US11089672B1 (en) * | 2019-08-13 | 2021-08-10 | Radiation Detection and Imaging Technologies, LLC | Radiation beam window assembly comprising fiber bound core panels and methods for the same |
DE102020102983A1 (de) * | 2020-02-05 | 2021-08-05 | Harting Ag | Bauteilträger zur Anordnung elektrischer Bauteile auf einer Leiterkarte |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4591220A (en) * | 1984-10-12 | 1986-05-27 | Rollin Mettler | Injection molded multi-layer circuit board and method of making same |
JPH03145790A (ja) * | 1989-10-31 | 1991-06-20 | Hitachi Chem Co Ltd | 立体的配線基板 |
US5914534A (en) | 1996-05-03 | 1999-06-22 | Ford Motor Company | Three-dimensional multi-layer molded electronic device and method for manufacturing same |
JP4241184B2 (ja) * | 2002-07-25 | 2009-03-18 | パナソニック電工株式会社 | 光電素子部品 |
JP3956920B2 (ja) | 2003-08-26 | 2007-08-08 | 松下電工株式会社 | コネクタ |
US7613010B2 (en) * | 2004-02-02 | 2009-11-03 | Panasonic Corporation | Stereoscopic electronic circuit device, and relay board and relay frame used therein |
JP4258432B2 (ja) * | 2004-05-21 | 2009-04-30 | パナソニック株式会社 | 基板接合部材ならびにそれを用いた三次元接続構造体 |
JP2011009438A (ja) * | 2009-06-25 | 2011-01-13 | Panasonic Electric Works Co Ltd | 3次元立体回路基板およびこれを用いた回路モジュール |
JP2012150022A (ja) | 2011-01-20 | 2012-08-09 | Rohm Co Ltd | 近接センサ |
US9130109B2 (en) | 2011-01-20 | 2015-09-08 | Rohm Co., Ltd. | Optical apparatus |
US8742570B2 (en) | 2011-09-09 | 2014-06-03 | Qualcomm Mems Technologies, Inc. | Backplate interconnect with integrated passives |
JP2013128013A (ja) * | 2011-12-16 | 2013-06-27 | Panasonic Corp | 立体回路基板の製造方法、立体回路基板、近接センサ及び発光装置 |
JP2015060988A (ja) * | 2013-09-19 | 2015-03-30 | 日置電機株式会社 | 基板搬送装置 |
CN203827603U (zh) * | 2014-05-04 | 2014-09-10 | 常熟开关制造有限公司(原常熟开关厂) | 一种线路板间的固定结构 |
-
2014
- 2014-10-24 JP JP2014217581A patent/JP6436296B2/ja active Active
-
2015
- 2015-10-02 EP EP15852745.7A patent/EP3211975A4/en not_active Withdrawn
- 2015-10-02 WO PCT/JP2015/005028 patent/WO2016063466A1/ja active Application Filing
- 2015-10-02 US US15/518,797 patent/US10004140B2/en active Active
- 2015-10-02 CN CN201580052160.3A patent/CN106717133B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN106717133A (zh) | 2017-05-24 |
EP3211975A1 (en) | 2017-08-30 |
EP3211975A4 (en) | 2017-11-22 |
US20170238415A1 (en) | 2017-08-17 |
WO2016063466A1 (ja) | 2016-04-28 |
US10004140B2 (en) | 2018-06-19 |
CN106717133B (zh) | 2019-12-24 |
JP2016086068A (ja) | 2016-05-19 |
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