MY100402A - Injection molded multi - layer circuit board and method of making same. - Google Patents
Injection molded multi - layer circuit board and method of making same.Info
- Publication number
- MY100402A MY100402A MYPI88000261A MYPI19880261A MY100402A MY 100402 A MY100402 A MY 100402A MY PI88000261 A MYPI88000261 A MY PI88000261A MY PI19880261 A MYPI19880261 A MY PI19880261A MY 100402 A MY100402 A MY 100402A
- Authority
- MY
- Malaysia
- Prior art keywords
- plating
- substrates
- conductive material
- circuit board
- plating resist
- Prior art date
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
A MULTI-LAYER CIRCUIT BOARD COMPRISED OF TWO OR MORE CIRCUIT BOARD SUBSTRATES (10, 12) SHAPED BY INJECTION MOLDING WITH MATING INTERCONNECTING PINS (22) AND HOLES (26) AND BANDED TOGETHER WITH AN ELECTRICALLY INSULATED ADHESIVE MATERIAL (28). CIRCUIT LEADS (14-20) ARE PROVIDED ON BOTH SIDES OF EACH SUBSTRATE RECESSED INTO CHANNELS FORMED IN THE SURFACE OF THE SUBSTRATE DURING THE MOLDING PROCESS.ELECTRICAL INTERCONNECTION OF THE LAYERS OF CIRCUITRY OCCURS WHERE THE CONDUCTIVE MATERIALS OF THE CIRCUIT LEADS PASSES DOWN THROUGH COMPONENT LEAD HOLE (26) AXIALLY LOCATED IN THE INTERCONNECTING PINS AND AROUND THE EXTERIOR OF THE INTERCONNECTING PINS WHERE CONTACT IS MADE WITH THE CONDUCTIVE MATERIAL COATING ON THE INTERIOR OF THE INTERCONNECTING HOLES.A METHOD OF MAKING THE MULTI-LAYER BOARD INCLUDES INJECTION MOLDING THE SUBSTRATES IN THE SUITABLE SHAPED MOLD (74, 76), PLATING SUBSTANTIALLY ALL OF THE SURFACE OF THE SUBSTRATES WITH THE CONDUCTIVE MATERIAL (82), MASKING WITH A PLATING RESIST (84), PLATING AGAIN WITH CONDUCTIVE MATERIAL (86), PLATING WITH AN ETCH RESISTANT CONTACT MATERIAL (88), REMOVING THE PLATING RESIST AND FLASH-ETCHING TO REMOVE THE CONDUCTIVE MATERIAL INITIALLY PLATED AND MASKED BY THE PLATING RESIST SO AS TO DEFINE THE CIRCUIT LEADS (14-20). THE PREFERRED METHOD USES A ROLLER TO APPLY THE PLATING RESIST TO SOME SURFACES OF THE SUBSTRATES. (FIG.1)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66049584A | 1984-10-12 | 1984-10-12 | |
US06/771,134 US4591220A (en) | 1984-10-12 | 1985-08-28 | Injection molded multi-layer circuit board and method of making same |
GB2183921 | 1985-10-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY100402A true MY100402A (en) | 1990-09-17 |
Family
ID=79909451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI88000261A MY100402A (en) | 1984-10-12 | 1988-03-14 | Injection molded multi - layer circuit board and method of making same. |
Country Status (1)
Country | Link |
---|---|
MY (1) | MY100402A (en) |
-
1988
- 1988-03-14 MY MYPI88000261A patent/MY100402A/en unknown
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