JPH0242792A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH0242792A JPH0242792A JP19326788A JP19326788A JPH0242792A JP H0242792 A JPH0242792 A JP H0242792A JP 19326788 A JP19326788 A JP 19326788A JP 19326788 A JP19326788 A JP 19326788A JP H0242792 A JPH0242792 A JP H0242792A
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- glass powder
- resist layer
- cavity
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000011521 glass Substances 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 15
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 7
- 239000000057 synthetic resin Substances 0.000 claims abstract description 7
- 230000000873 masking effect Effects 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 14
- 238000001746 injection moulding Methods 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 239000002253 acid Substances 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 3
- 150000007513 acids Chemical class 0.000 abstract description 2
- 238000010924 continuous production Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、回路用金属からなる回路パターンが絶縁基材
表面に設けられたプリント配線板を、効率的に得ること
のできる製法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for efficiently producing a printed wiring board in which a circuit pattern made of a circuit metal is provided on the surface of an insulating base material.
（従来の技術およびその課題）
絶縁基材表面に所定の回路パターンを形成したプリント
配線板の製法としては、銅張り積層板を用いて、回路パ
ターンをレジストで保護してがら不要部分の銅箔をエツ
チング除去するサブトラクティブ法や、絶縁基材表面に
無電解メッキにより回路パターンを選択的に形成するア
ディティブ法が主に行なわれている。(Prior art and its problems) A method for manufacturing printed wiring boards with a predetermined circuit pattern formed on the surface of an insulating substrate is to use a copper-clad laminate, protect the circuit pattern with a resist, and remove copper foil from unnecessary areas. The main methods used are the subtractive method, which involves etching away the circuit pattern, and the additive method, which selectively forms a circuit pattern on the surface of an insulating substrate by electroless plating.
このような方法では、絶縁基材の成形と回路パターンの
形成が別工程のために工程が煩雑になるという問題があ
り、その解決手段として、金型キャビティー内表面に電
気メッキにより回路パターンを形成した後、キャビティ
ー内に合成樹脂を射出し、基材を形成すると同時に回路
パターンを基材上に転写する方法が提案されている。This method has the problem that the molding of the insulating base material and the formation of the circuit pattern are separate processes, making the process complicated. As a solution to this problem, the circuit pattern is formed on the inner surface of the mold cavity by electroplating. A method has been proposed in which after the circuit pattern is formed, a synthetic resin is injected into the cavity to form the base material and simultaneously transfer the circuit pattern onto the base material.
ここで、上記金型キャビティー内表面に回路パターンを
形成する方法として、通常非メッキ部分にエポキシ樹脂
等からなるレジスト層を設けた後、メッキを行なうこと
がなされるが、このようなレジスト層では、メッキ工程
で使用する強酸や・射出成形時での高温高圧のために、
レジスト層が破壊されやすく、射出成形のショット回数
が少ないうちにレジスト層を形成し直す必要があり、連
続的な生産が困難であった。Here, as a method of forming a circuit pattern on the inner surface of the mold cavity, plating is usually performed after providing a resist layer made of epoxy resin or the like on the non-plated parts. Because of the strong acids used in the plating process and the high temperature and pressure during injection molding,
The resist layer was easily destroyed, and it was necessary to re-form the resist layer before the number of injection molding shots was small, making continuous production difficult.
本発明は、上記問題点を解消したプリント配線板の製法
を提供することを目的としている。An object of the present invention is to provide a method for manufacturing a printed wiring board that eliminates the above-mentioned problems.
く問題点を解決するための手段）
上記目的を達成するために本発明の製法では、上記レジ
スト層として、ガラス粉末を焼成してなる無機レジスト
層を形成するものである。Means for Solving the Problems) In order to achieve the above object, in the manufacturing method of the present invention, an inorganic resist layer formed by firing glass powder is formed as the resist layer.
以下本発明を図面を参照して具体的に説明する。The present invention will be specifically described below with reference to the drawings.
第１図乃至第３図は本発明方法の一連の工程を示した工
程概略図である。ここで第１図はレジスト形成工程、第
２図はメッキ工程、第３図は成形工程を示している。1 to 3 are process schematic diagrams showing a series of steps of the method of the present invention. Here, FIG. 1 shows a resist forming process, FIG. 2 shows a plating process, and FIG. 3 shows a molding process.
本発明における金型１は、キャビティーを有する射出成
形用の金型であって、図面には回路パターン形成側の一
部分を示した。材質は良好な導電性とメッキ液に対する
耐腐食性を有する金属、例えばステンレス鋼等が好適に
使用できる。A mold 1 according to the present invention is an injection molding mold having a cavity, and a part of the mold on the circuit pattern forming side is shown in the drawing. As the material, a metal having good conductivity and corrosion resistance against the plating solution, such as stainless steel, can be suitably used.
本発明においては、まず第１図のレジスト形成工程に示
すように、金型１表面の非回路パターン部分にマスキン
グ用レジスト層２を形成する必要がある。このレジスト
層２はガラス粉末を、焼成して設けるものであり、例え
ばガラス粉末を有機ビヒクルや溶剤に分散させたガラス
粉末ペーストを使用することができ、ペーストの粘度と
しては印刷適性等の点から１０００ボイズ（２３°Ｃ）
程度に調整したものが好適に使用できる。ガラス粉末と
しては、ホウケイ酸系ガラス等が使用でき、要求により
バリウム、鉛等を含有するものも使用できる。In the present invention, first, as shown in the resist forming step of FIG. 1, it is necessary to form a masking resist layer 2 on the non-circuit pattern portion of the surface of the mold 1. This resist layer 2 is provided by firing glass powder. For example, a glass powder paste in which glass powder is dispersed in an organic vehicle or solvent can be used, and the viscosity of the paste is determined from the viewpoint of printing suitability. 1000 voices (23°C)
Those adjusted to a certain degree can be suitably used. As the glass powder, borosilicate glass or the like can be used, and if required, one containing barium, lead, etc. can also be used.
上記ガラス粉末を金型表面へ設ける方法には種々の方法
があるが、ガラス粉末を用いて印刷により設ける場合、
通常のスクリーン印刷法等により所定のパターンを印刷
すればよい、印刷後、焼成し硬化させる。焼成温度は使
用するガラスの組成等により異なるが６００〜９５０℃
程度で加熱すればよい、上記レジスト層２は耐熱性が良
好であり、また繰返しによる耐衝撃性に優れているとい
う利点がある。There are various methods for applying the glass powder to the mold surface, but when applying it by printing using glass powder,
A predetermined pattern may be printed by a normal screen printing method, etc. After printing, it is baked and hardened. The firing temperature varies depending on the composition of the glass used, but is 600-950℃.
The resist layer 2, which only needs to be heated at a moderate temperature, has the advantage of having good heat resistance and excellent impact resistance due to repeated use.
ついで、第２図のメッキ工程に示すように、キャビティ
ー内面に電気メッキを施して、レジスト層以外に所定の
回路パターン３を形成する。メッキ用の金属としては、
メッキの目的等により異なるが、電気メッキが可能な銅
、ニッケル、亜鉛等適宜使用でき、メッキ膜の厚みは数
μ乃至５０μ程度が金型表面からの剥離性等が良く好ま
しい。Next, as shown in the plating step of FIG. 2, electroplating is applied to the inner surface of the cavity to form a predetermined circuit pattern 3 on a portion other than the resist layer. As a metal for plating,
Although it varies depending on the purpose of plating, etc., copper, nickel, zinc, etc. that can be electroplated can be used as appropriate, and the thickness of the plating film is preferably about several microns to about 50 microns because it has good releasability from the mold surface.
電気メッキ法としては、種々の方法があるが、金型を電
極とし、電気メッキ液、例えば１ｉＪＥ酸銅液を金型面
上に循環させ、電気メッキ液中の金属イオンを電極の金
型表面に析出付着させ回路パターンを形成する方法がメ
ッキ効率等が良好で好ましい。There are various methods for electroplating, but a mold is used as an electrode, and an electroplating solution, such as a 1iJE acid copper solution, is circulated over the mold surface, and the metal ions in the electroplating solution are transferred to the electrode mold surface. A method in which a circuit pattern is formed by depositing and adhering the metal to the metal is preferable because the plating efficiency and the like are good.
ついで金型キャビティー内に溶融した絶縁性合成樹脂を
射出することにより第３図に示すように成形工程で、回
路パターン３をプラスチック成形品４の表面へ転写して
プリント配線板が得られる。Then, by injecting the molten insulating synthetic resin into the mold cavity, the circuit pattern 3 is transferred to the surface of the plastic molded product 4 in a molding process as shown in FIG. 3, thereby obtaining a printed wiring board.
絶縁性合成樹脂としては、種夕の樹脂が使用できる。例
えばポリ塩化ビニル樹脂、ＡＢＳ樹脂、ＰＥ、ＰＰ等の
通常の熱可塑性樹脂やポリカーボネート（ＰＣ）、ポリ
エーテルサルフオン（ＰＥＳ）、ポリエーテルイミド（
ＰＥ Ｉ ） 、ポリフェニレンサルファイド（ＰＰＳ
）、ポリエーテルエーテルケトン（ＰＥＥＫ）等の耐熱
性熱可塑性樹脂、及びエポキシ系、フェノール系等の熱
硬化性樹脂でもよく、使用目的や成形加工方法等によっ
て適宜選択することができる。As the insulating synthetic resin, resins of various types can be used. For example, ordinary thermoplastic resins such as polyvinyl chloride resin, ABS resin, PE, PP, polycarbonate (PC), polyether sulfonate (PES), polyetherimide (
PEI), polyphenylene sulfide (PPS
), heat-resistant thermoplastic resins such as polyetheretherketone (PEEK), and thermosetting resins such as epoxy and phenolic resins, which can be appropriately selected depending on the purpose of use, molding method, etc.
本発明では射出成形法により金型表面に溶融したプラス
チックが押圧されるために樹脂と金属膜との密着がより
強固となる。In the present invention, the molten plastic is pressed onto the mold surface by the injection molding method, so that the adhesion between the resin and the metal film becomes stronger.
以下、本発明を実施例にて説明する。The present invention will be explained below with reference to Examples.
（実施例）
第１図乃至第３図に示した各工程に従い下記条件にて、
射出成形法により回路パターンを有する絶縁性合成樹脂
としてＰＰＳを使用したプリント配線板（１，５０１１
＋１Ｘ ２００１１１１Ｘ ２１１１１１１）を得た。(Example) According to each process shown in Figures 1 to 3, under the following conditions,
Printed wiring board (1,5011
+1X 2001111X 2111111) was obtained.
レジスト工程：金型の材質・・・ステンレス鋼。Resist process: Mold material: stainless steel.
レジスト層・・・ガラス粉末ペースト （溶剤＝ブチルカルピトールアセテ ート、粘度＝１０００ポイズ／２３ ℃）を用いシルク印刷法により金型 表面に設け７１０℃で焼成した。Resist layer...Glass powder paste (Solvent = Butyl carpitol acetate Viscosity = 1000 poise/23 Mold by silk printing method using It was placed on the surface and fired at 710°C.
メッキ工程；電気メッキ法 メッキ液・・・硫酸銅。Plating process; electroplating method Plating solution: Copper sulfate.
銅メッキの厚み・・・３０μ、線幅・・・・・・０．５
ｉｎ。Copper plating thickness: 30μ, line width: 0.5
in.
上述した方法により回路パターンが良好に形成されたプ
リント配線板が得られ、繰り返し射出成形（５０回）を
行なってもレジスト層の剥離等は見られなかった。A printed wiring board with a well-formed circuit pattern was obtained by the method described above, and no peeling of the resist layer was observed even after repeated injection molding (50 times).
（発明の効果〉
上述したように本発明によれば、ガラス粉末ベーストか
らなるレジスト層を金型内にマスキング用として使用す
るので耐熱性、１Ｉｉｌｆｉ撃性に優れており、射出成
形法によって連続的に絶縁性合成樹脂表面に回路パター
ンを容易に形成することができる。得られた成形品はプ
リント配線板での利用性が大である。(Effects of the Invention) As described above, according to the present invention, a resist layer made of a glass powder base is used for masking in the mold, so it has excellent heat resistance and impact resistance, and can be made continuously by injection molding. A circuit pattern can be easily formed on the surface of an insulating synthetic resin.The resulting molded product has great utility in printed wiring boards.
第１図乃至第３図は本発明方法の一例を示した工程概略
図である。
１・・・・・・金型
２・・・・・・マスキング用レジスト層３・・・・・・
回路パターン1 to 3 are process schematic diagrams showing an example of the method of the present invention. 1... Mold 2... Masking resist layer 3...
circuit pattern
Claims (1)
した後、キャビティー内へ合成樹脂を射出して、絶縁基
材を射出成形するとともに、絶縁基材上へ上記回路パタ
ーンを転写させ一体化するプリント配線板の製法におい
て、金型キャビティー側内面の回路パターンに対応する
表面部分以外の非回路パターン部分にガラス粉末を焼成
してマスキング用レジスト層（２）を形成した後、金型
キャビティー側内面へ電気メッキを施し、回路パターン
（３）を形成した後、キャビティー内へ絶縁性合成樹脂
を射出することを特徴とするプリント配線板の製法。After forming a circuit pattern on the inner surface of the cavity side of the mold (1), a synthetic resin is injected into the cavity to injection mold an insulating base material, and the circuit pattern is transferred onto the insulating base material and integrated. In the manufacturing method of printed wiring boards that is becoming increasingly popular, after baking glass powder to form a masking resist layer (2) on the non-circuit pattern area other than the surface area corresponding to the circuit pattern on the inner surface of the mold cavity side, the mold A method for manufacturing a printed wiring board characterized by electroplating the inner surface of the cavity side to form a circuit pattern (3), and then injecting an insulating synthetic resin into the cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19326788A JPH0242792A (en) | 1988-08-02 | 1988-08-02 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19326788A JPH0242792A (en) | 1988-08-02 | 1988-08-02 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242792A true JPH0242792A (en) | 1990-02-13 |
Family
ID=16305099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19326788A Pending JPH0242792A (en) | 1988-08-02 | 1988-08-02 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242792A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150180A (en) * | 2005-11-30 | 2007-06-14 | Matsushita Electric Ind Co Ltd | Flexible circuit board and its production process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6021393A (en) * | 1983-07-12 | 1985-02-02 | Sumitomo Electric Ind Ltd | Manufacture of printed wiring board |
| JPS6346793A (en) * | 1986-08-14 | 1988-02-27 | 三菱樹脂株式会社 | Manufacture of printed wiring board |
| JPS6351691A (en) * | 1986-08-21 | 1988-03-04 | 大日本印刷株式会社 | Manufacture of molded unit with circuit |
-
1988
- 1988-08-02 JP JP19326788A patent/JPH0242792A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6021393A (en) * | 1983-07-12 | 1985-02-02 | Sumitomo Electric Ind Ltd | Manufacture of printed wiring board |
| JPS6346793A (en) * | 1986-08-14 | 1988-02-27 | 三菱樹脂株式会社 | Manufacture of printed wiring board |
| JPS6351691A (en) * | 1986-08-21 | 1988-03-04 | 大日本印刷株式会社 | Manufacture of molded unit with circuit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150180A (en) * | 2005-11-30 | 2007-06-14 | Matsushita Electric Ind Co Ltd | Flexible circuit board and its production process |
| JP4720462B2 (en) * | 2005-11-30 | 2011-07-13 | パナソニック株式会社 | Flexible circuit board and manufacturing method thereof |
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