KR960702258A - 직접적인 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판을 관통 도금하는 공정(process for throughplating printed circuit boards using conductive plastics for direct plating) - Google Patents
직접적인 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판을 관통 도금하는 공정(process for throughplating printed circuit boards using conductive plastics for direct plating)Info
- Publication number
- KR960702258A KR960702258A KR1019950704661A KR19950704661A KR960702258A KR 960702258 A KR960702258 A KR 960702258A KR 1019950704661 A KR1019950704661 A KR 1019950704661A KR 19950704661 A KR19950704661 A KR 19950704661A KR 960702258 A KR960702258 A KR 960702258A
- Authority
- KR
- South Korea
- Prior art keywords
- printed wiring
- wiring board
- method step
- solution
- monolith
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0611—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only one nitrogen atom in the ring, e.g. polypyrroles
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
본 발명은 직접 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판들을 관통도금하는 공정에 관한 것으로, 고유의 전기전도성을 갖는 중합체 필름이 프린트 배선판들의 비전도성 영역들위에 접착되게 침전되고, 그 위에 금속필름이 가해진다. 중합체 필름의 선택적 생산은 이전에는 프린트 배선판의 산화전 처리를 필요로 하는 것으로 알려져 왔는데, 비록 이것이 그 공정의 또다른 과정에 부정적으로 영향을 미칠 수 있는데로 말이다. 본 발명에 있어서 잠재적인 부정적 영역들은 산화전처리를 없앰으로써 제거된다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- 직접도금을 위해 전도성 플라스틱을 사용하며, 고유 전기 전도성을 갖는 중합체층이 이 도금을 이용하여 린트 배선판의 비전도 위치에 결합되고, 그위에 금속층이 쌓이는 프린트 배선판들을 관통도금하는 방법에 있어서, 중합체층이 프린트 배선판의 기질물질위에 직접 침전되어, -제1방법단계에서, 관통도금구멍들의 전체표면 뿐만아니라 프린트 배선판의 전체표면이 중합체를 형성하는 단일체를 포함하며, 특히 관통도금구멍들의 벽들에 흡수되는 용액으로 적셔지고, -제2방법단계에서, 산성의 수용성 산화물질을 포함하는 용액의 영향하에 단일체가 중합되어, 이 용액이 프린트 배선판들에 대해 유속을 나타내고, -제3방법단계에서, 프린트 배선판의 전도위치들에 헐겁게 결합된 중합체가 제거되는 것을 특징으로 하는 프린트 배선판을 관통도금하는 방법.
- 제1항에 있어서, 수평처리기술을 이용하는 것이 특징인 방법.
- 제1 또는 2항에 있어서, 제2방법단계에 사용되는 똑같은 산성수액으로 분무하거나 범람시킴으로써 제3방법단계에서 프린트 배선판의 전도위치들로부터 중합체층이 제거되는 것을 특징으로 하는 방법.
- 제1∼3항 중 한 항에 있어서, 스탬핑(stamping) 또는 드릴링에 의해서 관통도금구멍들이 형성되는 것을 특징으로 하는 방법.
- 제1∼4항 중 한 항에 있어서, 금속층이 금속구리, 니켈, 금, 팔라듐, 주석, 납 또는 주석/납중 하나로 구성되는 것을 특징으로 하는 방법.
- 제1∼5항 중 한 항에 있어서, 단일체, 유기용매 및 물을 함유하는 용액이 제1방법단계를 수행하는데 사용되는 것을 특징으로 하는 방법.
- 제6항에 있어서, 제1방법단계를 수행하는 용매가 50-99% 유기용매 또는 물 또는 유기용매와 물의 50-99% 혼합물 뿐만 아니라 1-20% 단일체를 함유하는 것을 특징으로 하는 방법.
- 제1∼7항 중 한 항에 있어서, 이용되는 단일체가 피롤인 것을 특징으로 하는 방법.
- 제1∼8항 중 한 항에 있어서, 제2방법단계를 수행하는 용액이 1-20% 황산, 염산 또는 인산, 1-20%알칼리 과황산염 그리고/또는 2-10% H202, 그리고 나머지로는 물을 포함하는 것을 특징으로 하는 방법.
- 제1∼9항 중 한 항에 있어서, 양측이 금속으로 덮히고 기질물질들(FR2,FR3 또는 CEM)중의 하나를 포함하며 기질물질(FR4)을 사용할때 비전도위치들이 제1방법 단계에 앞서 유기 용매로 적셔져서 특히, 제1방법단계에 따른 용액에 사용된 유기용매가 가해지는 프린트 배선판들이 이 방법을 수행하는데 사용되는 것을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP4314259.1 | 1993-04-30 | ||
DE4314259A DE4314259C2 (de) | 1993-04-30 | 1993-04-30 | Verfahren zur Durchkontaktierung von Leiterplatten mittels leitfähiger Kunststoffe zur direkten Metallisierung |
PCT/EP1994/001340 WO1994026082A1 (de) | 1993-04-30 | 1994-04-28 | Verfahren zur durchkontaktierung von leiterplatten mittels leitfähiger kunststoffe zur direkten metallisierung |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960702258A true KR960702258A (ko) | 1996-03-28 |
Family
ID=6486824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950704661A KR960702258A (ko) | 1993-04-30 | 1994-04-28 | 직접적인 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판을 관통 도금하는 공정(process for throughplating printed circuit boards using conductive plastics for direct plating) |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0696410B1 (ko) |
KR (1) | KR960702258A (ko) |
AT (1) | ATE155636T1 (ko) |
AU (1) | AU6649794A (ko) |
DE (2) | DE4314259C2 (ko) |
WO (1) | WO1994026082A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100515535B1 (ko) * | 1996-09-12 | 2006-01-27 | 바이엘 악티엔게젤샤프트 | 강성및연성회로의제조방법 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6632380B1 (en) | 1997-07-25 | 2003-10-14 | Zipperling Kessler & Co. (Gmbh & Co.) | Chemical compounds made of intrinsically conductive polymers and metals |
EP1630252A1 (de) * | 2004-08-27 | 2006-03-01 | ATOTECH Deutschland GmbH | Verfahren zur beschichtung von Substraten enthaltend Antimonverbindungen mit Zinn und Zinnlegierungen |
CN102833963B (zh) * | 2012-09-03 | 2015-04-01 | 高德(无锡)电子有限公司 | 一种改善盲钻孔工件在电镀软金时孔底露铜的水平前处理方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3806884C1 (en) * | 1988-03-03 | 1989-09-21 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | Through-plated contact printed circuit and method for fabricating it |
AU622650B2 (en) * | 1988-03-03 | 1992-04-16 | Blasberg-Oberflachentechnik Gmbh | New through-hole plated printed circuit board and process for manufacturing same |
DE3821885A1 (de) * | 1988-06-29 | 1990-02-08 | Basf Ag | Verbundmaterialien aus einem traegermaterial und elektrisch leitfaehigen polymerfilmen |
FR2649126B1 (fr) * | 1989-06-30 | 1992-04-10 | Commissariat Energie Atomique | Procede de depot electrochimique sur un support en materiau isolant electrique |
DE3928832C2 (de) * | 1989-08-31 | 1995-04-20 | Blasberg Oberflaechentech | Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug |
ES2095227T3 (es) * | 1989-09-14 | 1997-02-16 | Atotech Deutschland Gmbh | Procedimiento para la metalizacion directa de placas de circuitos impresos. |
DE3935831A1 (de) * | 1989-10-27 | 1991-05-02 | Hoellmueller Maschbau H | Anlage zur herstellung von durchkontaktierten leiterplatten und multilayern |
-
1993
- 1993-04-30 DE DE4314259A patent/DE4314259C2/de not_active Expired - Fee Related
-
1994
- 1994-04-28 EP EP94915137A patent/EP0696410B1/de not_active Expired - Lifetime
- 1994-04-28 AU AU66497/94A patent/AU6649794A/en not_active Abandoned
- 1994-04-28 WO PCT/EP1994/001340 patent/WO1994026082A1/de active IP Right Grant
- 1994-04-28 KR KR1019950704661A patent/KR960702258A/ko not_active Application Discontinuation
- 1994-04-28 AT AT94915137T patent/ATE155636T1/de not_active IP Right Cessation
- 1994-04-28 DE DE59403401T patent/DE59403401D1/de not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100515535B1 (ko) * | 1996-09-12 | 2006-01-27 | 바이엘 악티엔게젤샤프트 | 강성및연성회로의제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JPH08509578A (ja) | 1996-10-08 |
DE59403401D1 (de) | 1997-08-21 |
DE4314259A1 (de) | 1994-11-03 |
JP3635293B2 (ja) | 2005-04-06 |
WO1994026082A1 (de) | 1994-11-10 |
EP0696410A1 (de) | 1996-02-14 |
EP0696410B1 (de) | 1997-07-16 |
DE4314259C2 (de) | 1997-04-10 |
AU6649794A (en) | 1994-11-21 |
ATE155636T1 (de) | 1997-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR880004724A (ko) | 금속 기판 및 그 제조 방법 | |
MX9409531A (es) | Circuitos impresos plasticos y contactos y metodo para realizarlos. | |
KR890004423A (ko) | Ic칩의 전기적 접속방법, 이에 사용된 수지범프 형성 조성물 및 이에 의해 전기적으로 접속된 액정 표시장치 | |
DE69413436D1 (de) | Herstellungsverfahren eines Musters von einem elektrisch leitfähigen Polymer auf einer Substratoberfläche und Metallisierung eines solchen Musters | |
DE69923205D1 (de) | Leiterplattenanordnung und verfahren zu ihrer herstellung | |
KR900004226A (ko) | 관통공에서 전기적 접속하는 가요성 양면 회로 기판 제조방법 | |
IS5704A (is) | Aðferð til að húða undirlag með málmum | |
ATE311592T1 (de) | Nachweis und entfernen von kupfer aus abwässern bei der herstellung von halbleitern und leiterplatten | |
KR960702258A (ko) | 직접적인 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판을 관통 도금하는 공정(process for throughplating printed circuit boards using conductive plastics for direct plating) | |
KR970023643A (ko) | 도전성 은/중합체 복합체의 부식 및 용해 방지 구조물 | |
KR950024971A (ko) | 산화구리용 화학적 환원액 | |
EP0248683A3 (en) | Composition and process for the electrolytic coating of circuit boards without an electroless metal coating | |
KR880002413A (ko) | 프린트배선판의 제조방법 | |
GB9809281D0 (en) | Printed circuit and printed wiring boards and methods of manufacture | |
DE60131906D1 (de) | Träger für integrierte schaltungen mit aussparungen | |
ATE247376T1 (de) | Bedruckte schaltträger | |
KR970073240A (ko) | 절연도료, 이 도료의 도포막을 갖는 프린트 배선기판, 이 도료를 사용하는 절연성 저하예방법 및 절연성 회복법(Insulating coating material, a printed circuit board having a coating film of the same coating material, and a method of prevention a fall of the insulation and a method of recovery a insulation using of the same coating material) | |
KR920011299A (ko) | 프린트 기판의 제조방법 | |
KR830007032A (ko) | 프린트 배선판의 제조방법 | |
ATE235796T1 (de) | Nachbehandlung von kupfer auf gedruckten schaltungsplatten | |
EP0214573A2 (de) | Verfahren zur Integration von Widerständen in chemisch abgeschiedene Leiternetzwerke | |
KR860003755A (ko) | 인쇄회로 기판의 제조방법 | |
KR870011823A (ko) | 인쇄회로 기판의 페인팅 방법 | |
DE59902678D1 (de) | An kontaktflächen eines schaltungssubstrats verlötbares, aus blech geformtes elektrisches bauelement mit lötstop | |
ES2124177A1 (es) | Proceso de fabricacion de circuitos mixtos de 105 a 400 y de 17 a 105 micras. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
N231 | Notification of change of applicant | ||
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |