KR960702258A - 직접적인 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판을 관통 도금하는 공정(process for throughplating printed circuit boards using conductive plastics for direct plating) - Google Patents

직접적인 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판을 관통 도금하는 공정(process for throughplating printed circuit boards using conductive plastics for direct plating)

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Publication number
KR960702258A
KR960702258A KR1019950704661A KR19950704661A KR960702258A KR 960702258 A KR960702258 A KR 960702258A KR 1019950704661 A KR1019950704661 A KR 1019950704661A KR 19950704661 A KR19950704661 A KR 19950704661A KR 960702258 A KR960702258 A KR 960702258A
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KR
South Korea
Prior art keywords
printed wiring
wiring board
method step
solution
monolith
Prior art date
Application number
KR1019950704661A
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English (en)
Inventor
게르하르트 뢰쉬
발터 스툭크만
Original Assignee
칼 헤인즈 비에란드 · 베르너 드레이코른-린드너
그룬디히 이.엠.브이. 엘렉트로-미캐니쉬 베르슈흐산쉬탈트 맥스 그룬디히 홀랜드 쉬티프통 운트 코 케이지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 칼 헤인즈 비에란드 · 베르너 드레이코른-린드너, 그룬디히 이.엠.브이. 엘렉트로-미캐니쉬 베르슈흐산쉬탈트 맥스 그룬디히 홀랜드 쉬티프통 운트 코 케이지 filed Critical 칼 헤인즈 비에란드 · 베르너 드레이코른-린드너
Publication of KR960702258A publication Critical patent/KR960702258A/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0611—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only one nitrogen atom in the ring, e.g. polypyrroles
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

본 발명은 직접 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판들을 관통도금하는 공정에 관한 것으로, 고유의 전기전도성을 갖는 중합체 필름이 프린트 배선판들의 비전도성 영역들위에 접착되게 침전되고, 그 위에 금속필름이 가해진다. 중합체 필름의 선택적 생산은 이전에는 프린트 배선판의 산화전 처리를 필요로 하는 것으로 알려져 왔는데, 비록 이것이 그 공정의 또다른 과정에 부정적으로 영향을 미칠 수 있는데로 말이다. 본 발명에 있어서 잠재적인 부정적 영역들은 산화전처리를 없앰으로써 제거된다.

Description

직접적인 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판을 관통 도금하는 공정(PROCESS FOR THROUGHPLATING PRINTED CIRCUIT BOARDS USING CONDUCTIVE PLASTICS FOR DIRECT PLATING)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (10)

  1. 직접도금을 위해 전도성 플라스틱을 사용하며, 고유 전기 전도성을 갖는 중합체층이 이 도금을 이용하여 린트 배선판의 비전도 위치에 결합되고, 그위에 금속층이 쌓이는 프린트 배선판들을 관통도금하는 방법에 있어서, 중합체층이 프린트 배선판의 기질물질위에 직접 침전되어, -제1방법단계에서, 관통도금구멍들의 전체표면 뿐만아니라 프린트 배선판의 전체표면이 중합체를 형성하는 단일체를 포함하며, 특히 관통도금구멍들의 벽들에 흡수되는 용액으로 적셔지고, -제2방법단계에서, 산성의 수용성 산화물질을 포함하는 용액의 영향하에 단일체가 중합되어, 이 용액이 프린트 배선판들에 대해 유속을 나타내고, -제3방법단계에서, 프린트 배선판의 전도위치들에 헐겁게 결합된 중합체가 제거되는 것을 특징으로 하는 프린트 배선판을 관통도금하는 방법.
  2. 제1항에 있어서, 수평처리기술을 이용하는 것이 특징인 방법.
  3. 제1 또는 2항에 있어서, 제2방법단계에 사용되는 똑같은 산성수액으로 분무하거나 범람시킴으로써 제3방법단계에서 프린트 배선판의 전도위치들로부터 중합체층이 제거되는 것을 특징으로 하는 방법.
  4. 제1∼3항 중 한 항에 있어서, 스탬핑(stamping) 또는 드릴링에 의해서 관통도금구멍들이 형성되는 것을 특징으로 하는 방법.
  5. 제1∼4항 중 한 항에 있어서, 금속층이 금속구리, 니켈, 금, 팔라듐, 주석, 납 또는 주석/납중 하나로 구성되는 것을 특징으로 하는 방법.
  6. 제1∼5항 중 한 항에 있어서, 단일체, 유기용매 및 물을 함유하는 용액이 제1방법단계를 수행하는데 사용되는 것을 특징으로 하는 방법.
  7. 제6항에 있어서, 제1방법단계를 수행하는 용매가 50-99% 유기용매 또는 물 또는 유기용매와 물의 50-99% 혼합물 뿐만 아니라 1-20% 단일체를 함유하는 것을 특징으로 하는 방법.
  8. 제1∼7항 중 한 항에 있어서, 이용되는 단일체가 피롤인 것을 특징으로 하는 방법.
  9. 제1∼8항 중 한 항에 있어서, 제2방법단계를 수행하는 용액이 1-20% 황산, 염산 또는 인산, 1-20%알칼리 과황산염 그리고/또는 2-10% H202, 그리고 나머지로는 물을 포함하는 것을 특징으로 하는 방법.
  10. 제1∼9항 중 한 항에 있어서, 양측이 금속으로 덮히고 기질물질들(FR2,FR3 또는 CEM)중의 하나를 포함하며 기질물질(FR4)을 사용할때 비전도위치들이 제1방법 단계에 앞서 유기 용매로 적셔져서 특히, 제1방법단계에 따른 용액에 사용된 유기용매가 가해지는 프린트 배선판들이 이 방법을 수행하는데 사용되는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950704661A 1993-04-30 1994-04-28 직접적인 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판을 관통 도금하는 공정(process for throughplating printed circuit boards using conductive plastics for direct plating) KR960702258A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4314259A DE4314259C2 (de) 1993-04-30 1993-04-30 Verfahren zur Durchkontaktierung von Leiterplatten mittels leitfähiger Kunststoffe zur direkten Metallisierung
DEP4314259.1 1993-04-30
PCT/EP1994/001340 WO1994026082A1 (de) 1993-04-30 1994-04-28 Verfahren zur durchkontaktierung von leiterplatten mittels leitfähiger kunststoffe zur direkten metallisierung

Publications (1)

Publication Number Publication Date
KR960702258A true KR960702258A (ko) 1996-03-28

Family

ID=6486824

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950704661A KR960702258A (ko) 1993-04-30 1994-04-28 직접적인 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판을 관통 도금하는 공정(process for throughplating printed circuit boards using conductive plastics for direct plating)

Country Status (6)

Country Link
EP (1) EP0696410B1 (ko)
KR (1) KR960702258A (ko)
AT (1) ATE155636T1 (ko)
AU (1) AU6649794A (ko)
DE (2) DE4314259C2 (ko)
WO (1) WO1994026082A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100515535B1 (ko) * 1996-09-12 2006-01-27 바이엘 악티엔게젤샤프트 강성및연성회로의제조방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4150160B2 (ja) 1997-07-25 2008-09-17 ツィッパーリンク ケスラー ウント コー．（ゲーエムベーハー ウント コー．） 固有導電性ポリマーと金属との化合物
EP1630252A1 (de) * 2004-08-27 2006-03-01 ATOTECH Deutschland GmbH Verfahren zur beschichtung von Substraten enthaltend Antimonverbindungen mit Zinn und Zinnlegierungen
CN102833963B (zh) * 2012-09-03 2015-04-01 高德（无锡）电子有限公司 一种改善盲钻孔工件在电镀软金时孔底露铜的水平前处理方法

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
WO1989008375A1 (en) * 1988-03-03 1989-09-08 Blasberg-Oberflächentechnik Gmbh New through-hole plated printed circuit board and process for manufacturing same
DE3806884C1 (en) * 1988-03-03 1989-09-21 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De Through-plated contact printed circuit and method for fabricating it
DE3821885A1 (de) * 1988-06-29 1990-02-08 Basf Ag Verbundmaterialien aus einem traegermaterial und elektrisch leitfaehigen polymerfilmen
FR2649126B1 (fr) * 1989-06-30 1992-04-10 Commissariat Energie Atomique Procede de depot electrochimique sur un support en materiau isolant electrique
DE3928832C2 (de) * 1989-08-31 1995-04-20 Blasberg Oberflaechentech Verfahren zur Herstellung von durchkontaktierten Leiterplatten und Leiterplatten-Halbzeug
ES2095227T3 (es) * 1989-09-14 1997-02-16 Atotech Deutschland Gmbh Procedimiento para la metalizacion directa de placas de circuitos impresos.
DE3935831A1 (de) * 1989-10-27 1991-05-02 Hoellmueller Maschbau H Anlage zur herstellung von durchkontaktierten leiterplatten und multilayern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100515535B1 (ko) * 1996-09-12 2006-01-27 바이엘 악티엔게젤샤프트 강성및연성회로의제조방법

Also Published As

Publication number Publication date
DE4314259C2 (de) 1997-04-10
DE59403401D1 (de) 1997-08-21
WO1994026082A1 (de) 1994-11-10
JPH08509578A (ja) 1996-10-08
JP3635293B2 (ja) 2005-04-06
EP0696410B1 (de) 1997-07-16
EP0696410A1 (de) 1996-02-14
DE4314259A1 (de) 1994-11-03
ATE155636T1 (de) 1997-08-15
AU6649794A (en) 1994-11-21

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