JPH08509578A - 直接的に金属化するための導電性合成樹脂によるプリント基板の貫通接触法 - Google Patents
直接的に金属化するための導電性合成樹脂によるプリント基板の貫通接触法Info
- Publication number
- JPH08509578A JPH08509578A JP6523886A JP52388694A JPH08509578A JP H08509578 A JPH08509578 A JP H08509578A JP 6523886 A JP6523886 A JP 6523886A JP 52388694 A JP52388694 A JP 52388694A JP H08509578 A JPH08509578 A JP H08509578A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- solution
- conductive
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0611—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only one nitrogen atom in the ring, e.g. polypyrroles
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemically Coating (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 内因的導電性のあるポリマー層をプリント基板の非導電部に固着させ、そ の上に金属層を設ける 直接的に金属化する為に導電性合成樹脂によりプリント基板を貫通接触させる方 法において、 ポリマー層をプリント基板の基板材料の上に直接的に設け、その際に ― 最初の方法段階でプリント基板の全表面並びに貫通接触用孔(スルーホー ル)をポリマー形成性モノマーを含有する溶液で濡らし、中でも貫通接触用孔の 壁に吸着させ、 ― 第二方法段階でモノマーを酸化性物質を含む酸性の水溶液の作用下に重合 し、その際に溶液をプリント基板に向けて流し、そして ― 第三方法段階でプリント基板の導電性の場所にゆるく付着するポリマーを 除くことを特徴とする、上記方法。 2. 水平加工法を用いる請求項1に記載の方法。 3. 第三方法段階でプリント基板の導電性部分からのポリマー層の除去を、第 二方法段階で使用されるのと同じ酸性水溶液を注ぎかけるかまたは立ち波をかけ ることで行う請求項1または2に記載の方法。 4. 貫通接触用孔を打抜きまたは穿孔によって造る請求項1〜3のいずれか一 つに記載の方法。 5. 金属層が銅、ニッケル、金、パラジウム、亜鉛、鉛または亜鉛/鉛の群か ら選択される金属より成る請求項1〜4のいずれか一つに記載の方法。 6. 最初の方法段階を実施するために、モノマー、有機溶剤および水を含有す る溶液を使用する請求項1〜5のいずれか一つに記載の方法。 7. 最初の方法段階を実施するための溶液が1〜20%のモノマー並びに50 〜99%の有機溶剤または水または50〜99%の、有機溶剤と水との混合物を 含有している請求項6に記載の方法。 8. 用いるモノマーがピロールである請求項1〜7のいずれか一つに記載の方 法。 9. 第二方法段階を実施するための溶液が1〜20%の硫酸または塩酸または 燐酸、1〜20%のアルカリ金属過硫酸塩および/または2〜10%のH2O2、 残量の水を含有する請求項1〜8のいずれか一つに記載の方法。 10.方法を実施するために、両側が金属メッキされておりそして基材FR2、 FR3またはCEMより成るプリント基板を使用することおよび基材FR4を用 いる場合には最初の方法段階の前に有機溶剤で非導電性位置を膨潤させ、特に最 初の方法段階の後で溶液中で使用される有機溶剤を使用する、請求項1〜9のい ずれか一つに記載の方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4314259.1 | 1993-04-30 | ||
DEP4314259.1 | 1993-04-30 | ||
DE4314259A DE4314259C2 (de) | 1993-04-30 | 1993-04-30 | Verfahren zur Durchkontaktierung von Leiterplatten mittels leitfähiger Kunststoffe zur direkten Metallisierung |
PCT/EP1994/001340 WO1994026082A1 (de) | 1993-04-30 | 1994-04-28 | Verfahren zur durchkontaktierung von leiterplatten mittels leitfähiger kunststoffe zur direkten metallisierung |
Publications (3)
Publication Number | Publication Date |
---|---|
JPH08509578A true JPH08509578A (ja) | 1996-10-08 |
JP3635293B2 JP3635293B2 (ja) | 2005-04-06 |
JP3635293B6 JP3635293B6 (ja) | 2005-06-15 |
Family
ID=
Also Published As
Publication number | Publication date |
---|---|
ATE155636T1 (de) | 1997-08-15 |
EP0696410A1 (de) | 1996-02-14 |
DE59403401D1 (de) | 1997-08-21 |
KR960702258A (ko) | 1996-03-28 |
JP3635293B2 (ja) | 2005-04-06 |
WO1994026082A1 (de) | 1994-11-10 |
DE4314259A1 (de) | 1994-11-03 |
AU6649794A (en) | 1994-11-21 |
DE4314259C2 (de) | 1997-04-10 |
EP0696410B1 (de) | 1997-07-16 |
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