AU6649794A - Process for throughplating printed circuit boards using conductive plastics for direct plating - Google Patents

Process for throughplating printed circuit boards using conductive plastics for direct plating

Info

Publication number
AU6649794A
AU6649794A AU66497/94A AU6649794A AU6649794A AU 6649794 A AU6649794 A AU 6649794A AU 66497/94 A AU66497/94 A AU 66497/94A AU 6649794 A AU6649794 A AU 6649794A AU 6649794 A AU6649794 A AU 6649794A
Authority
AU
Australia
Prior art keywords
printed circuit
circuit boards
throughplating
conductive plastics
direct plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU66497/94A
Inventor
Gerhard Rosch
Walter Stuckmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Grundig EMV Elektromechanische Versuchsanstalt Max Grundig GmbH
Original Assignee
Grundig EMV Elektromechanische Versuchsanstalt Max Grundig GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grundig EMV Elektromechanische Versuchsanstalt Max Grundig GmbH filed Critical Grundig EMV Elektromechanische Versuchsanstalt Max Grundig GmbH
Publication of AU6649794A publication Critical patent/AU6649794A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0611—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only one nitrogen atom in the ring, e.g. polypyrroles
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H01B1/128—Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemically Coating (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsically electrical conductivity is adhesively deposited on nonconductive areas of the printed circuit boards, whereupon a metal film is applied. Selective production of the polymer film has previously been seen as requiring an oxidative pretreatment of the printed circuit board, though this can negatively affect the further course of the process. With the present invention the potential negative effects are avoided by forgoing the oxidative pretreatment.
AU66497/94A 1993-04-30 1994-04-28 Process for throughplating printed circuit boards using conductive plastics for direct plating Abandoned AU6649794A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4314259A DE4314259C2 (en) 1993-04-30 1993-04-30 Process for through-contacting printed circuit boards using conductive plastics for direct metallization
DE4314259 1993-04-30
PCT/EP1994/001340 WO1994026082A1 (en) 1993-04-30 1994-04-28 Process for throughplating printed circuit boards using conductive plastics for direct plating

Publications (1)

Publication Number Publication Date
AU6649794A true AU6649794A (en) 1994-11-21

Family

ID=6486824

Family Applications (1)

Application Number Title Priority Date Filing Date
AU66497/94A Abandoned AU6649794A (en) 1993-04-30 1994-04-28 Process for throughplating printed circuit boards using conductive plastics for direct plating

Country Status (6)

Country Link
EP (1) EP0696410B1 (en)
KR (1) KR960702258A (en)
AT (1) ATE155636T1 (en)
AU (1) AU6649794A (en)
DE (2) DE4314259C2 (en)
WO (1) WO1994026082A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19637018A1 (en) * 1996-09-12 1998-03-19 Bayer Ag Process for the production of rigid and flexible circuits
ATE283536T1 (en) 1997-07-25 2004-12-15 Ormecon Gmbh CHEMICAL COMPOUNDS OF INTRINSICALLY CONDUCTIVE POLYMERS WITH METALS
EP1630252A1 (en) * 2004-08-27 2006-03-01 ATOTECH Deutschland GmbH Process for coating antimony containing substrate with tin or tin alloys
CN102833963B (en) * 2012-09-03 2015-04-01 高德（无锡）电子有限公司 Horizontal pre-treatment method for improving copper exposing at bottom of blind drilling hole in soft gold electroplating

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3806884C1 (en) * 1988-03-03 1989-09-21 Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De Through-plated contact printed circuit and method for fabricating it
EP0402381B1 (en) * 1988-03-03 1994-09-07 Blasberg-Oberflächentechnik GmbH New through-hole plated printed circuit board and process for manufacturing same
DE3821885A1 (en) * 1988-06-29 1990-02-08 Basf Ag COMPOSITE MATERIALS FROM A CARRIER MATERIAL AND ELECTRICALLY CONDUCTIVE POLYMER FILMS
FR2649126B1 (en) * 1989-06-30 1992-04-10 Commissariat Energie Atomique METHOD OF ELECTROCHEMICAL DEPOSITION ON A SUPPORT OF ELECTRICALLY INSULATING MATERIAL
DE3928832C2 (en) * 1989-08-31 1995-04-20 Blasberg Oberflaechentech Process for the production of plated-through printed circuit boards and semi-finished printed circuit boards
ES2095227T3 (en) * 1989-09-14 1997-02-16 Atotech Deutschland Gmbh PROCEDURE FOR DIRECT METALLIZATION OF PRINTED CIRCUIT BOARDS.
DE3935831A1 (en) * 1989-10-27 1991-05-02 Hoellmueller Maschbau H SYSTEM FOR THE PRODUCTION OF CONTACTED CIRCUIT BOARDS AND MULTILAYERS

Also Published As

Publication number Publication date
ATE155636T1 (en) 1997-08-15
WO1994026082A1 (en) 1994-11-10
DE4314259A1 (en) 1994-11-03
JPH08509578A (en) 1996-10-08
EP0696410B1 (en) 1997-07-16
KR960702258A (en) 1996-03-28
DE59403401D1 (en) 1997-08-21
EP0696410A1 (en) 1996-02-14
JP3635293B2 (en) 2005-04-06
DE4314259C2 (en) 1997-04-10

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