ATE247376T1 - Bedruckte schaltträger - Google Patents

Bedruckte schaltträger

Info

Publication number
ATE247376T1
ATE247376T1 AT93911363T AT93911363T ATE247376T1 AT E247376 T1 ATE247376 T1 AT E247376T1 AT 93911363 T AT93911363 T AT 93911363T AT 93911363 T AT93911363 T AT 93911363T AT E247376 T1 ATE247376 T1 AT E247376T1
Authority
AT
Austria
Prior art keywords
printed
printed circuit
dielectric constant
dissipation factor
substrates
Prior art date
Application number
AT93911363T
Other languages
English (en)
Inventor
Joseph Maoz
Michael Kadishevitz
Original Assignee
M Rad Electromagnetic Technolo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M Rad Electromagnetic Technolo filed Critical M Rad Electromagnetic Technolo
Application granted granted Critical
Publication of ATE247376T1 publication Critical patent/ATE247376T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/046—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B32B2266/0221—Vinyl resin
    • B32B2266/0228—Aromatic vinyl resin, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Glass Compositions (AREA)
  • Impact Printers (AREA)
  • Electronic Switches (AREA)
AT93911363T 1992-05-29 1993-05-20 Bedruckte schaltträger ATE247376T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88990392A 1992-05-29 1992-05-29
PCT/US1993/004783 WO1993024313A1 (en) 1992-05-29 1993-05-20 Printed circuit substrates

Publications (1)

Publication Number Publication Date
ATE247376T1 true ATE247376T1 (de) 2003-08-15

Family

ID=25395973

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93911363T ATE247376T1 (de) 1992-05-29 1993-05-20 Bedruckte schaltträger

Country Status (11)

Country Link
EP (1) EP0642412B1 (de)
JP (1) JPH08501185A (de)
KR (1) KR100256154B1 (de)
AT (1) ATE247376T1 (de)
AU (1) AU680823B2 (de)
CA (1) CA2136855C (de)
DE (1) DE69333142T2 (de)
DK (1) DK0642412T3 (de)
ES (1) ES2204901T3 (de)
IL (1) IL105753A (de)
WO (1) WO1993024313A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2285002B (en) * 1993-12-23 1996-08-28 Phisilog Res Ltd High volume electronic circuit production
US5785787A (en) 1994-05-23 1998-07-28 General Electric Company Processing low dielectric constant materials for high speed electronics
US5449427A (en) * 1994-05-23 1995-09-12 General Electric Company Processing low dielectric constant materials for high speed electronics
DE102014210483A1 (de) 2014-06-03 2015-12-03 Conti Temic Microelectronic Gmbh Verfahren zum Herstellen einer Folienanordnung und entsprechende Folienanordnung
CN113677089B (zh) * 2021-08-11 2023-03-10 华为技术有限公司 一种印刷电路板、天线系统和电子设备
CN114552198B (zh) * 2022-04-25 2022-07-08 中国电子科技集团公司第二十九研究所 一种轻质高性能电路的精密制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3263023A (en) * 1964-04-09 1966-07-26 Westinghouse Electric Corp Printed circuits on honeycomb support with pierceable insulation therebetween
US4403107A (en) * 1980-12-15 1983-09-06 Amp Incorporated Stamped circuit board
FR2525849B1 (fr) * 1982-04-26 1985-08-09 Hutchinson Substrat de circuit imprime
JPS62251136A (ja) * 1986-04-25 1987-10-31 三菱樹脂株式会社 金属複合積層板
EP0257657B1 (de) * 1986-08-29 1994-07-13 Hitachi Chemical Co., Ltd. Substrat für Hochfrequenzschaltung und Verfahren zur Herstellung desselben
US4769370A (en) * 1986-09-24 1988-09-06 Merck & Co., Inc. (1,2-dichloro-8-oxo-5a-substituted-5a,6,7,8-tetrahydrodibenzofuran-3-yl)alkanoic acids and alkanimidamides
JPS63122194A (ja) * 1986-11-11 1988-05-26 旭化成株式会社 回路基板
JPH0712647B2 (ja) * 1987-06-18 1995-02-15 日立電線株式会社 ポリオレフィン金属積層板の製造方法
US4937585A (en) * 1987-09-09 1990-06-26 Phasar Corporation Microwave circuit module, such as an antenna, and method of making same
US4931354A (en) * 1987-11-02 1990-06-05 Murata Manufacturing Co., Ltd. Multilayer printed circuit board
EP0321977B1 (de) * 1987-12-23 1992-08-19 Mitsubishi Gas Chemical Company, Inc. Laminiermaterial für gedruckte Schaltungsplatte mit niedriger Dielektrizitätskonstanten
JPH02198838A (ja) * 1989-01-27 1990-08-07 Hitachi Chem Co Ltd 回路用基板

Also Published As

Publication number Publication date
ES2204901T3 (es) 2004-05-01
AU680823B2 (en) 1997-08-14
IL105753A0 (en) 1993-09-22
EP0642412B1 (de) 2003-08-13
DK0642412T3 (da) 2003-11-17
CA2136855A1 (en) 1993-12-09
JPH08501185A (ja) 1996-02-06
DE69333142D1 (de) 2003-09-18
AU4252693A (en) 1993-12-30
IL105753A (en) 1997-04-15
WO1993024313A1 (en) 1993-12-09
EP0642412A1 (de) 1995-03-15
CA2136855C (en) 2004-11-30
EP0642412A4 (de) 1995-06-21
DE69333142T2 (de) 2004-06-09
KR100256154B1 (ko) 2000-05-15

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