GB2285002B - High volume electronic circuit production - Google Patents

High volume electronic circuit production

Info

Publication number
GB2285002B
GB2285002B GB9326239A GB9326239A GB2285002B GB 2285002 B GB2285002 B GB 2285002B GB 9326239 A GB9326239 A GB 9326239A GB 9326239 A GB9326239 A GB 9326239A GB 2285002 B GB2285002 B GB 2285002B
Authority
GB
United Kingdom
Prior art keywords
electronic circuit
high volume
circuit production
volume electronic
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9326239A
Other versions
GB9326239D0 (en
GB2285002A (en
Inventor
Alexander Palatianos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PHISILOG RES Ltd
Original Assignee
PHISILOG RES Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PHISILOG RES Ltd filed Critical PHISILOG RES Ltd
Priority to GB9326239A priority Critical patent/GB2285002B/en
Priority to BE9301485A priority patent/BE1005972A6/en
Publication of GB9326239D0 publication Critical patent/GB9326239D0/en
Publication of GB2285002A publication Critical patent/GB2285002A/en
Application granted granted Critical
Publication of GB2285002B publication Critical patent/GB2285002B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
GB9326239A 1993-12-23 1993-12-23 High volume electronic circuit production Expired - Lifetime GB2285002B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB9326239A GB2285002B (en) 1993-12-23 1993-12-23 High volume electronic circuit production
BE9301485A BE1005972A6 (en) 1993-12-23 1993-12-30 Method for producing high quantities of electronic circuits.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9326239A GB2285002B (en) 1993-12-23 1993-12-23 High volume electronic circuit production
BE9301485A BE1005972A6 (en) 1993-12-23 1993-12-30 Method for producing high quantities of electronic circuits.

Publications (3)

Publication Number Publication Date
GB9326239D0 GB9326239D0 (en) 1994-02-23
GB2285002A GB2285002A (en) 1995-06-28
GB2285002B true GB2285002B (en) 1996-08-28

Family

ID=25662851

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9326239A Expired - Lifetime GB2285002B (en) 1993-12-23 1993-12-23 High volume electronic circuit production

Country Status (2)

Country Link
BE (1) BE1005972A6 (en)
GB (1) GB2285002B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4461800A (en) * 1981-11-27 1984-07-24 Yamauchi Rubber Industry Co., Ltd. Press pad for forming press
US4489487A (en) * 1981-02-10 1984-12-25 Robert Bosch Gmbh Electronic component and adhesive strip combination, and method of attachment of component to a substrate
US4872937A (en) * 1988-07-14 1989-10-10 Gte Products Corporation Electrical component and method of mounting same
US4908936A (en) * 1987-03-06 1990-03-20 Sharp Kabushiki Kaisha Manufacturing method for a tuner
EP0415527A2 (en) * 1989-08-28 1991-03-06 Hewlett-Packard Company Printed circuit board fixture
US5137936A (en) * 1989-07-26 1992-08-11 Matsushita Electric Industrial Co., Ltd. Method for packaging electronic parts and adhesive for use in said method
US5242100A (en) * 1991-12-23 1993-09-07 Motorola, Inc. Plated-through interconnect solder thief
WO1993024313A1 (en) * 1992-05-29 1993-12-09 M-Rad Electromagnetic Technology Ltd. Printed circuit substrates

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4489487A (en) * 1981-02-10 1984-12-25 Robert Bosch Gmbh Electronic component and adhesive strip combination, and method of attachment of component to a substrate
US4461800A (en) * 1981-11-27 1984-07-24 Yamauchi Rubber Industry Co., Ltd. Press pad for forming press
US4908936A (en) * 1987-03-06 1990-03-20 Sharp Kabushiki Kaisha Manufacturing method for a tuner
US4872937A (en) * 1988-07-14 1989-10-10 Gte Products Corporation Electrical component and method of mounting same
US5137936A (en) * 1989-07-26 1992-08-11 Matsushita Electric Industrial Co., Ltd. Method for packaging electronic parts and adhesive for use in said method
EP0415527A2 (en) * 1989-08-28 1991-03-06 Hewlett-Packard Company Printed circuit board fixture
US5242100A (en) * 1991-12-23 1993-09-07 Motorola, Inc. Plated-through interconnect solder thief
WO1993024313A1 (en) * 1992-05-29 1993-12-09 M-Rad Electromagnetic Technology Ltd. Printed circuit substrates

Also Published As

Publication number Publication date
GB9326239D0 (en) 1994-02-23
GB2285002A (en) 1995-06-28
BE1005972A6 (en) 1994-03-15

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20111103 AND 20111109

PE20 Patent expired after termination of 20 years

Expiry date: 20131222