KR970023643A - 도전성 은/중합체 복합체의 부식 및 용해 방지 구조물 - Google Patents

도전성 은/중합체 복합체의 부식 및 용해 방지 구조물 Download PDF

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Publication number
KR970023643A
KR970023643A KR1019960038605A KR19960038605A KR970023643A KR 970023643 A KR970023643 A KR 970023643A KR 1019960038605 A KR1019960038605 A KR 1019960038605A KR 19960038605 A KR19960038605 A KR 19960038605A KR 970023643 A KR970023643 A KR 970023643A
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South Korea
Prior art keywords
polymer
organic compound
silver particles
conductive composite
heterocyclic organic
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KR1019960038605A
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English (en)
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KR100215181B1 (ko
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블라스타 아그네스 브루직
주디쓰 마리 롤단
라비 에프. 사라프
Original Assignee
제프리 엘, 포맨
인터내셔널 비지네스 머신즈 코포레이션
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Publication of KR970023643A publication Critical patent/KR970023643A/ko
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Publication of KR100215181B1 publication Critical patent/KR100215181B1/ko

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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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Abstract

본 발명은 은 입자들과 이 은 입자들을 덮는 중합체를 함유하는 도전성 복합체에 관한 것으로, 본 발명에 따라서, 벤조트리아졸(BTA)과 같은 질소 함유 헤테로고리 유기 화합물을 더 포함시켜 불수용성 Ag 이온 착물을 형성시킴으로써 Ag 용해및 이온 이동도를 감소시킨다. 본 발명은 습기와 전기장이 존재할 때에 통상의 높은 Ag 이온 이동도 때문에 도전성 복합체의 은 용해나 부식 현상이 생기는 문제를 해소한다.

Description

도전성은 충합체 복합체의 부식 및 용해 방지 구조물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도 8은 전도성 복합체와 이 복합체에 피복되어 리드 프레임 내의 집적 회로칩가 인쇄 회로 기판에 무부식 표면 실장(conosion 卄ee surface mounting)될 수 있도록 하는 코팅재에 대한 개략도.

Claims (6)

  1. 습기에 노출될 시에 Ag의 전기 화학적 이동도가 감소되는 구조물에 있어서,기판 표면 상에 제1 도전 영역을 갖는 제1 기판,은 입자들 및 적어도 하나 이상의 중합체를 함유하되, 상기 제1 도전 영역상에 전기적으로 접촉된 상태로 위치한 도전성 복합체(conductive composite), 및 상기 도전성 복합체 상에 위치한 질소 함유 헤테로고리 유기 화합물(heterocychc organic Compound)을 함유한 코팅재를 포함하며, 상기 헤테로고리 유기 화합물의 분자들이 상기 중합체 내에 분포된 것을 특징으로 하는 Ag의 전기 화학적 이동도 감소 구조물.
  2. 제 1 항에 있어서, 상기 헤테로고리 유기 화합물의 분자 농도가 코팅재로부터 농도 기울기(concentrationgradient)를 형성하도록 상기 중합체 내에 분포된 것을 특징으로 하는 Ag의 전기 화학적 이동도 감소 구조물.
  3. 습기 존재시에 Ag의 전기 화학적 이동도가 감소되는 구조물에 있어서,서로 공간적으로 분리된 제1 및 제2의 전기 접촉부,은 입자들 및 적어도 하나 이상의 중합체를 함유하되, 상기 제1 및 제2 전기접촉부 사이에 전기적으로 접촉된 상태로 위치한 도전성 복합체 및 상기 도전성 복합체와 물리적으로 접촉한 질소 함유 헤테로고리 유기 화합물로 된코팅재를 포함하며,상기 도전성 복합체가 유기 밀봉체로 밀봉된 것을 특깅으로 하는 Ag의 전기화학적 이동도 감소 구조물.
  4. 제 3 항에 있어서, 상기 유기 밀봉체는 에폭시 수지와 열경화성 수지로 이루어진 그룹에서 선택되는 것을특징으로 하는 Ag의 전기 화학적 이동도 감소 구조물.
  5. 제 3 항에 있어서, 상기 헤테로고리 유기 화합물이 상기 중합체를 통해 상기 은 입자들에 확산되는 것을 특징으로 하는 Ag의 전기 화학적 이동도 감소 구조물.
  6. 고체 물질을 형성하도록 경화된 중합체, 도전성을 나타내도록 침투 임계치(percolation threshold)를 초과하는 충분한 체적을 갖는 상기 중합체 내의 은 입자들,상기 중합체 내에 분포된 헤테로고리 유기 고리 화합물의 분자들,및 상기 중합체 내에 형성되며, 상기 은 입자들로부터 형성된 이온들을 갖는 Ag 헤테로고리 유기 화합물 착물들(Ag-heterocychc organic compound complexes) 을 포함하는 것을 특징으로 하는 도전성 복합체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960038605A 1995-10-06 1996-09-06 도전성 은/증합체 복합체의 부식 및 용해 방지구조물 KR100215181B1 (ko)

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EP1045437A3 (en) * 1999-04-13 2004-09-01 Matsushita Electric Industrial Co., Ltd. Mounting structure for electronic component, method of producing the same, and electrically conductive adhesive used therein
EP1187518A3 (en) * 2000-09-07 2004-09-01 Matsushita Electric Industrial Co., Ltd. Conductive adhesive agent, packaging structure, and method for manufacturing the same structure

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US6849806B2 (en) * 2001-11-16 2005-02-01 Texas Instruments Incorporated Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor
US6900525B2 (en) * 2003-05-21 2005-05-31 Kyocera America, Inc. Semiconductor package having filler metal of gold/silver/copper alloy
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US9193880B2 (en) * 2006-12-19 2015-11-24 Dow Global Technologies Llc Adhesion promotion additives and methods for improving coating compositions
US7939161B2 (en) * 2006-12-19 2011-05-10 Dow Global Technologies Llc Encapsulated panel assemblies and methods for making same
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KR20080108767A (ko) * 2007-06-11 2008-12-16 삼성에스디아이 주식회사 전극 단자부 코팅재 및 이를 구비한 플라즈마 디스플레이패널
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EP1045437A3 (en) * 1999-04-13 2004-09-01 Matsushita Electric Industrial Co., Ltd. Mounting structure for electronic component, method of producing the same, and electrically conductive adhesive used therein
EP1187518A3 (en) * 2000-09-07 2004-09-01 Matsushita Electric Industrial Co., Ltd. Conductive adhesive agent, packaging structure, and method for manufacturing the same structure

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