MX375025B - Dispositivo de inspección de estampado con soldadura. - Google Patents

Dispositivo de inspección de estampado con soldadura.

Info

Publication number
MX375025B
MX375025B MX2018013966A MX2018013966A MX375025B MX 375025 B MX375025 B MX 375025B MX 2018013966 A MX2018013966 A MX 2018013966A MX 2018013966 A MX2018013966 A MX 2018013966A MX 375025 B MX375025 B MX 375025B
Authority
MX
Mexico
Prior art keywords
surface inspection
printed board
inspection
range
predetermined
Prior art date
Application number
MX2018013966A
Other languages
English (en)
Other versions
MX2018013966A (es
Inventor
Manabu Okuda
Nobuyuki Umemura
Original Assignee
Ckd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Corp filed Critical Ckd Corp
Publication of MX2018013966A publication Critical patent/MX2018013966A/es
Publication of MX375025B publication Critical patent/MX375025B/es

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2518—Projection by scanning of the object
    • G01B11/2527—Projection by scanning of the object with phase change by in-plane movement of the patern
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/44—Caliper-like sensors with detectors on both sides of the object to be measured
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Quality & Reliability (AREA)
  • Optics & Photonics (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Se proporciona un dispositivo para la inspección del estampado con soldadura configurado para inspeccionar el estado de la pasta de soldadura con la que se rellenó un orificio de paso más confiablemente y más fácilmente. Un dispositivo para la inspección del estampado con soldadura P13 incluye un mecanismo de transporte 2 configurado para, por ejemplo, el transporte y posicionamiento sobre una placa de circuito impreso 1; y una unidad de inspección de la cara inferior 4 configurada para inspeccionar u lado en una cara inferior de la placa de circuito impreso 1. La unidad de inspección de la cara inferior 4 incluye un primer iluminador de inspección de la cara inferior 4A y un segundo iluminador de inspección de la cara inferior 4B configurado para irradiar un intervalo de inspección predeterminado en la cara inferior de la placa de circuito impreso 1 oblicuamente hacia arriba con una luz predeterminada para la medición tridimensional; y una cámara de inspección de la cara inferior 4C configurada para tomar una imagen del intervalo de inspección predeterminado en la cara inferior de la placa de circuito impreso 1 desde inmediatamente abajo. El dispositivo de inspección del estampado con soldadura P13 realiza la inspección con respecto a la pasta de soldadura en el intervalo de inspección, con base en los datos de la imagen con respecto al intervalo de inspección predeterminado en la cara inferior de la placa de circuito impreso 1 tomados por la cámara de inspección de la cara inferior 4C.
MX2018013966A 2016-06-14 2017-02-08 Dispositivo de inspección de estampado con soldadura. MX375025B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016118142A JP6225222B1 (ja) 2016-06-14 2016-06-14 半田印刷検査装置
PCT/JP2017/004569 WO2017217006A1 (ja) 2016-06-14 2017-02-08 半田印刷検査装置

Publications (2)

Publication Number Publication Date
MX2018013966A MX2018013966A (es) 2019-01-24
MX375025B true MX375025B (es) 2025-03-06

Family

ID=60206006

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018013966A MX375025B (es) 2016-06-14 2017-02-08 Dispositivo de inspección de estampado con soldadura.

Country Status (5)

Country Link
US (1) US10679332B2 (es)
JP (1) JP6225222B1 (es)
CN (1) CN109564087B (es)
MX (1) MX375025B (es)
WO (1) WO2017217006A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190084167A (ko) * 2017-12-21 2019-07-16 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체
KR102106349B1 (ko) * 2017-12-21 2020-05-04 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치, 솔더 페이스트 이상 감지 방법 및 컴퓨터 판독 가능한 기록 매체
JP7185842B2 (ja) * 2018-11-06 2022-12-08 大日本印刷株式会社 検査装置および検査方法
CN112974301B (zh) * 2019-12-02 2022-07-26 捷普电子(广州)有限公司 自动化判定以分拣托盘的方法及托盘分拣系统
JP7528499B2 (ja) * 2020-03-30 2024-08-06 横河電機株式会社 電子モジュールの製造方法
JP7157112B2 (ja) * 2020-10-07 2022-10-19 Ckd株式会社 半田印刷検査装置
TWM632463U (zh) * 2022-06-28 2022-09-21 德律科技股份有限公司 輸送模組及光學檢測裝置
WO2024257156A1 (ja) * 2023-06-12 2024-12-19 ヤマハ発動機株式会社 三次元計測装置、三次元計測方法、三次元計測プログラムおよび記録媒体

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652244B2 (ja) * 1986-11-14 1994-07-06 株式会社日立製作所 スル−ホ−ル充填状態検査方法
JP2771190B2 (ja) * 1988-10-07 1998-07-02 株式会社日立製作所 スルーホール充填状態検査方法およびその装置
JP2620992B2 (ja) * 1991-02-15 1997-06-18 松下電工株式会社 電子部品の半田付け部の検査方法
JPH11186738A (ja) * 1997-12-24 1999-07-09 Matsushita Electric Ind Co Ltd ビアホールを有する基板の検査方法
US6891967B2 (en) * 1999-05-04 2005-05-10 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
JP3878023B2 (ja) * 2002-02-01 2007-02-07 シーケーディ株式会社 三次元計測装置
JP4372719B2 (ja) 2005-05-09 2009-11-25 シーケーディ株式会社 部品搭載システム
US20070102478A1 (en) * 2005-11-10 2007-05-10 Speedline Technologies, Inc. Optimal imaging system and method for a stencil printer
JP4548314B2 (ja) * 2005-11-11 2010-09-22 株式会社デンソー はんだ付け状態検査方法及びはんだ付け状態検査装置
JP2007227624A (ja) 2006-02-23 2007-09-06 Toshiba Corp 半田品質検査システム、及び半田品質検査方法
JP4417400B2 (ja) * 2007-04-16 2010-02-17 アンリツ株式会社 はんだ検査ライン集中管理システム、及びそれに用いられる管理装置
JP2010073763A (ja) * 2008-09-17 2010-04-02 Panasonic Corp 半田印刷方法
KR101121994B1 (ko) * 2010-02-02 2012-03-09 주식회사 고영테크놀러지 검사 프로그램의 생성 방법
JP2011169791A (ja) 2010-02-19 2011-09-01 Mitsubishi Electric Corp Ｘ線検査方法及びｘ線検査装置
JP2013055296A (ja) * 2011-09-06 2013-03-21 Toyota Motor Corp はんだ印刷機及びはんだ付け方法
JP5820424B2 (ja) * 2013-04-16 2015-11-24 Ckd株式会社 半田印刷検査装置

Also Published As

Publication number Publication date
US20190114764A1 (en) 2019-04-18
WO2017217006A1 (ja) 2017-12-21
JP2017223509A (ja) 2017-12-21
CN109564087A (zh) 2019-04-02
JP6225222B1 (ja) 2017-11-01
CN109564087B (zh) 2020-10-09
US10679332B2 (en) 2020-06-09
MX2018013966A (es) 2019-01-24

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