MX372954B - Dispositivo de deteccion de posicion de substrato. - Google Patents

Dispositivo de deteccion de posicion de substrato.

Info

Publication number
MX372954B
MX372954B MX2019000751A MX2019000751A MX372954B MX 372954 B MX372954 B MX 372954B MX 2019000751 A MX2019000751 A MX 2019000751A MX 2019000751 A MX2019000751 A MX 2019000751A MX 372954 B MX372954 B MX 372954B
Authority
MX
Mexico
Prior art keywords
recognition mark
recognition
position detection
base board
processing
Prior art date
Application number
MX2019000751A
Other languages
English (en)
Other versions
MX2019000751A (es
Inventor
Kensuke TAKAMURA
Nobuyuki Umemura
Takahiro Ninomiya
Original Assignee
Ckd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Corp filed Critical Ckd Corp
Publication of MX2019000751A publication Critical patent/MX2019000751A/es
Publication of MX372954B publication Critical patent/MX372954B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

Se proporciona un dispositivo de detección de posición de placa base que permite un aumento en la velocidad de detección de una posición de placa base, y supresión de una caída en productividad, o similares. Antes de iniciar la inspección, el dispositivo de inspección de impresión de soldadura (dispositivo de detección de posición de placa base) lleva a cabo procesamiento de detección de posición de placa base impresa. En el procesamiento de detección de posición, primero, se crean imágenes de una primera marca de reconocimiento sobre la placa base impresa. Después de eso, aunque la unidad de inspección (cámara) se está sometiendo a movimiento relativo a una posición que corresponde a una segunda marca de reconocimiento, procesamiento de reconocimiento para la primera marca de reconocimiento se ejecuta sobre la base de datos de imagen obtenidos en la primera formación de imágenes. Después de eso, se forman imágenes de la segunda marca de reconocimiento, y el segundo procesamiento de reconocimiento de marca de reconocimiento se lleva a cabo sobre la base de los datos de imagen. Si el reconocimiento de al menos una de la primera marca de reconocimiento y la segunda marca de reconocimiento ha fallado, se ejecuta procesamiento de reintento.
MX2019000751A 2016-07-28 2017-04-13 Dispositivo de deteccion de posicion de substrato. MX372954B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016148230A JP6276809B2 (ja) 2016-07-28 2016-07-28 基板位置検出装置
PCT/JP2017/015137 WO2018020752A1 (ja) 2016-07-28 2017-04-13 基板位置検出装置

Publications (2)

Publication Number Publication Date
MX2019000751A MX2019000751A (es) 2019-05-20
MX372954B true MX372954B (es) 2020-04-01

Family

ID=61016986

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019000751A MX372954B (es) 2016-07-28 2017-04-13 Dispositivo de deteccion de posicion de substrato.

Country Status (7)

Country Link
US (1) US10743448B2 (es)
JP (1) JP6276809B2 (es)
CN (1) CN109315090B (es)
DE (1) DE112017003765T5 (es)
MX (1) MX372954B (es)
TW (1) TWI635786B (es)
WO (1) WO2018020752A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3735121B1 (en) * 2017-12-28 2025-08-20 Fuji Corporation Tracing device
JP7063995B2 (ja) * 2018-07-18 2022-05-09 株式会社Fuji 部品認識装置および部品認識方法
JP7226854B2 (ja) * 2019-07-22 2023-02-21 国立大学法人 東京大学 処理システム、マーキング方法、当該方法において検出されるマーカー、及びマーキングプログラム
EP4142436A4 (en) * 2020-04-24 2023-05-17 Fuji Corporation CIRCUIT MANUFACTURING METHOD AND CIRCUIT MANUFACTURING DEVICE
CN116342458A (zh) * 2021-12-17 2023-06-27 合肥欣奕华智能机器股份有限公司 一种电路板表面零件视觉检测方法和设备及系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11261299A (ja) * 1998-03-16 1999-09-24 Matsushita Electric Ind Co Ltd 部品実装方法
JP4590272B2 (ja) * 2004-01-30 2010-12-01 日本特殊陶業株式会社 配線基板の製造方法
KR100792525B1 (ko) * 2006-08-11 2008-01-09 삼성전기주식회사 인쇄회로기판 제조방법
KR20090118915A (ko) * 2007-02-21 2009-11-18 파나소닉 주식회사 전자부품 실장용 장치에 있어서의 촬상용 조명장치
JP5145894B2 (ja) * 2007-11-20 2013-02-20 ソニー株式会社 信号処理装置
JP2009182280A (ja) * 2008-01-31 2009-08-13 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置におけるマーク認識方法
JP4724756B2 (ja) * 2009-01-07 2011-07-13 日置電機株式会社 基板検査用カメラのための照明装置を備える基板検査装置
JP5066110B2 (ja) * 2009-01-30 2012-11-07 株式会社日立ハイテクノロジーズ 蛍光分析装置、及び蛍光分析方法
JP5370625B1 (ja) * 2012-05-15 2013-12-18 パナソニック株式会社 モータ制御システム、モータ制御装置およびブラシレスモータ
CN105473979B (zh) * 2013-08-22 2018-09-28 富士机械制造株式会社 基板的生产作业方法、基板的拍摄条件决定方法及基板的生产作业装置
US10564518B2 (en) * 2014-11-24 2020-02-18 John R. Tindall Environmental lighting system and method

Also Published As

Publication number Publication date
WO2018020752A1 (ja) 2018-02-01
TWI635786B (zh) 2018-09-11
CN109315090B (zh) 2020-09-08
CN109315090A (zh) 2019-02-05
US20190174662A1 (en) 2019-06-06
JP6276809B2 (ja) 2018-02-07
DE112017003765T5 (de) 2019-04-18
JP2018018962A (ja) 2018-02-01
MX2019000751A (es) 2019-05-20
TW201817305A (zh) 2018-05-01
US10743448B2 (en) 2020-08-11

Similar Documents

Publication Publication Date Title
MX372954B (es) Dispositivo de deteccion de posicion de substrato.
MY200756A (en) Method for controlling camera and electronic device therefor
ATE497146T1 (de) Verfahren und anordnung zur abbildung von entfernungssensordaten auf bildsensordaten
EP2778623A3 (en) Position detection apparatus, lens apparatus, image pickup system, and machine tool apparatus
MX387233B (es) Aparato de impresión de latas y dispositivo de inspección de latas.
MY193819A (en) Electronic device and operating method thereof
JP2014241578A5 (es)
EP3079346A3 (en) Apparatus and method for setting camera
EP4336403A3 (en) Systems and methods for reading machine-readable marks on racks and receptacles
TW201130067A (en) Electronic component mounting apparatus and method of mounting electronic component
JP2017181094A5 (es)
GB2532642A (en) A laser line probe having improved high dynamic range
EP2654393A3 (en) Inspection machine for printed circuit board
EP2669739A3 (en) Measuring method, and exposure method and apparatus
JP2015090298A5 (es)
JP2013185832A5 (es)
EP2722714A3 (en) Detection device, exposure apparatus and device manufacturing method using such an exposure apparatus
JP2017126870A5 (es)
EP3379333A3 (en) Detection apparatus, pattern forming apparatus, obtaining method, detection method, and article manufacturing method
EP2889806A3 (en) Image processing device, image processing system, mobile object control apparatus, image recognition method, and carrier means
TW201518711A (zh) 影像定位方法及裝置
JP2015138806A5 (es)
JP2013062688A5 (es)
JP6912993B2 (ja) 部品実装装置
SG10201800619TA (en) Processing method of workpiece

Legal Events

Date Code Title Description
FG Grant or registration