MX2019000751A - Dispositivo de deteccion de posicion de substrato. - Google Patents

Dispositivo de deteccion de posicion de substrato.

Info

Publication number
MX2019000751A
MX2019000751A MX2019000751A MX2019000751A MX2019000751A MX 2019000751 A MX2019000751 A MX 2019000751A MX 2019000751 A MX2019000751 A MX 2019000751A MX 2019000751 A MX2019000751 A MX 2019000751A MX 2019000751 A MX2019000751 A MX 2019000751A
Authority
MX
Mexico
Prior art keywords
base board
recognition mark
position detection
recognition
board position
Prior art date
Application number
MX2019000751A
Other languages
English (en)
Inventor
NINOMIYA Takahiro
Takamura Kensuke
Umemura Nobuyuki
Original Assignee
Ckd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ckd Corp filed Critical Ckd Corp
Publication of MX2019000751A publication Critical patent/MX2019000751A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components

Abstract

Se proporciona un dispositivo de detección de posición de placa base que permite un aumento en la velocidad de detección de una posición de placa base, y supresión de una caída en productividad, o similares. Antes de iniciar la inspección, el dispositivo de inspección de impresión de soldadura (dispositivo de detección de posición de placa base) lleva a cabo procesamiento de detección de posición de placa base impresa. En el procesamiento de detección de posición, primero, se crean imágenes de una primera marca de reconocimiento sobre la placa base impresa. Después de eso, aunque la unidad de inspección (cámara) se está sometiendo a movimiento relativo a una posición que corresponde a una segunda marca de reconocimiento, procesamiento de reconocimiento para la primera marca de reconocimiento se ejecuta sobre la base de datos de imagen obtenidos en la primera formación de imágenes. Después de eso, se forman imágenes de la segunda marca de reconocimiento, y el segundo procesamiento de reconocimiento de marca de reconocimiento se lleva a cabo sobre la base de los datos de imagen. Si el reconocimiento de al menos una de la primera marca de reconocimiento y la segunda marca de reconocimiento ha fallado, se ejecuta procesamiento de reintento.
MX2019000751A 2016-07-28 2017-04-13 Dispositivo de deteccion de posicion de substrato. MX2019000751A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016148230A JP6276809B2 (ja) 2016-07-28 2016-07-28 基板位置検出装置
PCT/JP2017/015137 WO2018020752A1 (ja) 2016-07-28 2017-04-13 基板位置検出装置

Publications (1)

Publication Number Publication Date
MX2019000751A true MX2019000751A (es) 2019-05-20

Family

ID=61016986

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2019000751A MX2019000751A (es) 2016-07-28 2017-04-13 Dispositivo de deteccion de posicion de substrato.

Country Status (7)

Country Link
US (1) US10743448B2 (es)
JP (1) JP6276809B2 (es)
CN (1) CN109315090B (es)
DE (1) DE112017003765T5 (es)
MX (1) MX2019000751A (es)
TW (1) TWI635786B (es)
WO (1) WO2018020752A1 (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3735121A4 (en) * 2017-12-28 2020-12-23 Fuji Corporation TRACING DEVICE
WO2021015077A1 (ja) * 2019-07-22 2021-01-28 国立大学法人東京大学 処理システム、マーキング方法、当該方法において検出されるマーカー、及びマーキングプログラム
WO2021214973A1 (ja) * 2020-04-24 2021-10-28 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11261299A (ja) * 1998-03-16 1999-09-24 Matsushita Electric Ind Co Ltd 部品実装方法
JP4590272B2 (ja) * 2004-01-30 2010-12-01 日本特殊陶業株式会社 配線基板の製造方法
KR100792525B1 (ko) * 2006-08-11 2008-01-09 삼성전기주식회사 인쇄회로기판 제조방법
US8845114B2 (en) * 2007-02-21 2014-09-30 Panasonic Corporation Lighting device for image capturing in electronic component mounting apparatus
JP5145894B2 (ja) * 2007-11-20 2013-02-20 ソニー株式会社 信号処理装置
JP2009182280A (ja) * 2008-01-31 2009-08-13 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置におけるマーク認識方法
JP4724756B2 (ja) * 2009-01-07 2011-07-13 日置電機株式会社 基板検査用カメラのための照明装置を備える基板検査装置
JP5066110B2 (ja) * 2009-01-30 2012-11-07 株式会社日立ハイテクノロジーズ 蛍光分析装置、及び蛍光分析方法
JP5370625B1 (ja) * 2012-05-15 2013-12-18 パナソニック株式会社 モータ制御システム、モータ制御装置およびブラシレスモータ
JP6109317B2 (ja) * 2013-08-22 2017-04-05 富士機械製造株式会社 基板の生産作業方法、基板の撮像条件決定方法、および基板の生産作業装置
US10564518B2 (en) * 2014-11-24 2020-02-18 John R. Tindall Environmental lighting system and method

Also Published As

Publication number Publication date
TW201817305A (zh) 2018-05-01
US10743448B2 (en) 2020-08-11
TWI635786B (zh) 2018-09-11
CN109315090A (zh) 2019-02-05
JP6276809B2 (ja) 2018-02-07
US20190174662A1 (en) 2019-06-06
CN109315090B (zh) 2020-09-08
JP2018018962A (ja) 2018-02-01
DE112017003765T5 (de) 2019-04-18
WO2018020752A1 (ja) 2018-02-01

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