KR20230098767A9 - 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치 - Google Patents
인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치Info
- Publication number
- KR20230098767A9 KR20230098767A9 KR1020230082926A KR20230082926A KR20230098767A9 KR 20230098767 A9 KR20230098767 A9 KR 20230098767A9 KR 1020230082926 A KR1020230082926 A KR 1020230082926A KR 20230082926 A KR20230082926 A KR 20230082926A KR 20230098767 A9 KR20230098767 A9 KR 20230098767A9
- Authority
- KR
- South Korea
- Prior art keywords
- electronic device
- elements disposed
- circuit board
- printed circuit
- circuit elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Signal Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020230082926A KR20230098767A9 (ko) | 2018-09-19 | 2023-06-27 | 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180112151A KR102550209B1 (ko) | 2018-09-19 | 2018-09-19 | 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치 |
KR1020230082926A KR20230098767A9 (ko) | 2018-09-19 | 2023-06-27 | 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180112151A Division KR102550209B1 (ko) | 2018-09-19 | 2018-09-19 | 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20230098767A KR20230098767A (ko) | 2023-07-04 |
KR20230098767A9 true KR20230098767A9 (ko) | 2024-03-21 |
Family
ID=69773247
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180112151A KR102550209B1 (ko) | 2018-09-19 | 2018-09-19 | 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치 |
KR1020230082926A KR20230098767A9 (ko) | 2018-09-19 | 2023-06-27 | 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020180112151A KR102550209B1 (ko) | 2018-09-19 | 2018-09-19 | 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치 |
Country Status (5)
Country | Link |
---|---|
US (4) | US10709043B2 (ko) |
EP (1) | EP3837932A4 (ko) |
KR (2) | KR102550209B1 (ko) |
CN (2) | CN112740846B (ko) |
WO (1) | WO2020060240A1 (ko) |
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KR102550209B1 (ko) | 2018-09-19 | 2023-06-30 | 삼성전자주식회사 | 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치 |
KR20210007217A (ko) | 2019-07-10 | 2021-01-20 | 삼성전자주식회사 | 인터포저를 포함하는 전자 장치 |
KR20210011144A (ko) | 2019-07-22 | 2021-02-01 | 삼성전자주식회사 | 기판 조립체를 포함하는 전자 장치 |
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KR20220022243A (ko) * | 2020-08-18 | 2022-02-25 | 삼성전자주식회사 | 회로 기판 모듈 및 이를 포함하는 전자 장치 |
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-
2018
- 2018-09-19 KR KR1020180112151A patent/KR102550209B1/ko active IP Right Grant
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2019
- 2019-09-19 US US16/575,679 patent/US10709043B2/en active Active
- 2019-09-19 CN CN201980061838.2A patent/CN112740846B/zh active Active
- 2019-09-19 WO PCT/KR2019/012165 patent/WO2020060240A1/en unknown
- 2019-09-19 EP EP19862455.3A patent/EP3837932A4/en active Pending
- 2019-09-19 CN CN202311401670.XA patent/CN117580348A/zh active Pending
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2020
- 2020-07-06 US US16/921,801 patent/US11277949B2/en active Active
-
2022
- 2022-03-14 US US17/694,529 patent/US11825639B2/en active Active
-
2023
- 2023-06-27 KR KR1020230082926A patent/KR20230098767A9/ko not_active Application Discontinuation
- 2023-11-20 US US18/514,331 patent/US20240107726A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP3837932A1 (en) | 2021-06-23 |
CN112740846A (zh) | 2021-04-30 |
US20200093040A1 (en) | 2020-03-19 |
US11825639B2 (en) | 2023-11-21 |
KR20230098767A (ko) | 2023-07-04 |
US20240107726A1 (en) | 2024-03-28 |
KR102550209B1 (ko) | 2023-06-30 |
US11277949B2 (en) | 2022-03-15 |
CN112740846B (zh) | 2023-11-14 |
CN117580348A (zh) | 2024-02-20 |
US20220210957A1 (en) | 2022-06-30 |
US10709043B2 (en) | 2020-07-07 |
KR20200032911A (ko) | 2020-03-27 |
WO2020060240A1 (en) | 2020-03-26 |
US20200337188A1 (en) | 2020-10-22 |
EP3837932A4 (en) | 2021-09-15 |
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