MX349112B - Formulaciones de aislamiento. - Google Patents

Formulaciones de aislamiento.

Info

Publication number
MX349112B
MX349112B MX2013013272A MX2013013272A MX349112B MX 349112 B MX349112 B MX 349112B MX 2013013272 A MX2013013272 A MX 2013013272A MX 2013013272 A MX2013013272 A MX 2013013272A MX 349112 B MX349112 B MX 349112B
Authority
MX
Mexico
Prior art keywords
epoxy resin
cured product
formulation composition
divinylarene dioxide
insulation
Prior art date
Application number
MX2013013272A
Other languages
English (en)
Spanish (es)
Other versions
MX2013013272A (es
Inventor
Esseghir Mohamed
J Harris William
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of MX2013013272A publication Critical patent/MX2013013272A/es
Publication of MX349112B publication Critical patent/MX349112B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
MX2013013272A 2011-05-13 2012-04-13 Formulaciones de aislamiento. MX349112B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161485841P 2011-05-13 2011-05-13
PCT/US2012/033417 WO2012158291A1 (en) 2011-05-13 2012-04-13 Insulation formulations

Publications (2)

Publication Number Publication Date
MX2013013272A MX2013013272A (es) 2014-07-09
MX349112B true MX349112B (es) 2017-07-12

Family

ID=46001815

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013013272A MX349112B (es) 2011-05-13 2012-04-13 Formulaciones de aislamiento.

Country Status (10)

Country Link
US (1) US20140079953A1 (enExample)
EP (1) EP2707411B1 (enExample)
JP (1) JP6030125B2 (enExample)
KR (1) KR101901473B1 (enExample)
CN (1) CN103649158B (enExample)
BR (1) BR112013029224B1 (enExample)
CA (1) CA2835651A1 (enExample)
MX (1) MX349112B (enExample)
TW (1) TWI540146B (enExample)
WO (1) WO2012158291A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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WO2012158292A1 (en) * 2011-05-13 2012-11-22 Dow Global Technologies Llc Insulation formulations
BR112015008431A2 (pt) * 2012-10-19 2017-07-04 Dow Global Technologies Llc composição de resina curável, processo para preparar uma composição de resina curável, composição de resina curada e artigo
DE102013205117A1 (de) * 2013-03-22 2014-09-25 Siemens Aktiengesellschaft Vergussmasse, Verwendung der Vergussmasse, thermisch gehärteter Komposit erhältlich aus der Vergussmasse und elektrische Maschine mit der Vergussmasse
JP6321934B2 (ja) * 2013-09-30 2018-05-09 マツダ株式会社 エンジン燃焼室に臨む部材表面の断熱層の製造方法
JP5991445B2 (ja) * 2014-07-18 2016-09-14 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、及びプリント配線板
CN104200876A (zh) * 2014-08-09 2014-12-10 张传良 一种防火电缆用氧化镁填充料的制备方法
KR101808176B1 (ko) * 2016-04-07 2018-01-18 (주)창성 연자성몰딩액을 이용한 코일매립형인덕터의 제조방법 및 이를 이용하여 제조된 코일매립형인덕터
JP6748032B2 (ja) * 2017-06-06 2020-08-26 三菱電機株式会社 静止誘導器
KR102094296B1 (ko) * 2018-07-05 2020-03-27 (주)제니스월드 정전척용 흑색 세라믹 페이스트 조성물 및 이를 이용한 정전척
US12538649B2 (en) * 2018-09-03 2026-01-27 Lg Chem, Ltd. Encapsulation film, organic electronic element comprising the same, and method for manufacturing thereof
CN109401200A (zh) * 2018-10-29 2019-03-01 江苏宏鹏电气科技有限公司 一种用于母线槽内绝缘衬垫材料的制备配方
CN109687360B (zh) * 2018-11-27 2021-05-25 广东中讯通讯设备实业有限公司 一种绝缘性能好的硅芯管及其制备方法
EP3958305B1 (en) * 2020-08-17 2023-09-27 Infineon Technologies AG Power semiconductor module arrangement and method for producing the same
KR102876018B1 (ko) * 2024-04-03 2025-10-23 김주영 고강도 물성을 갖는 저점도의 진공함침 절연용 에폭시 수지조성물

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Also Published As

Publication number Publication date
CA2835651A1 (en) 2012-11-22
JP6030125B2 (ja) 2016-11-24
EP2707411A1 (en) 2014-03-19
TW201307421A (zh) 2013-02-16
EP2707411B1 (en) 2015-09-30
KR20140040150A (ko) 2014-04-02
BR112013029224B1 (pt) 2021-03-09
MX2013013272A (es) 2014-07-09
CN103649158A (zh) 2014-03-19
US20140079953A1 (en) 2014-03-20
TWI540146B (zh) 2016-07-01
WO2012158291A1 (en) 2012-11-22
CN103649158B (zh) 2016-04-06
BR112013029224A2 (pt) 2017-03-14
JP2014520172A (ja) 2014-08-21
KR101901473B1 (ko) 2018-09-21

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