JP2014520172A5 - - Google Patents

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Publication number
JP2014520172A5
JP2014520172A5 JP2014511369A JP2014511369A JP2014520172A5 JP 2014520172 A5 JP2014520172 A5 JP 2014520172A5 JP 2014511369 A JP2014511369 A JP 2014511369A JP 2014511369 A JP2014511369 A JP 2014511369A JP 2014520172 A5 JP2014520172 A5 JP 2014520172A5
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JP
Japan
Prior art keywords
epoxy resin
filler
product
electrical
electrical device
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JP2014511369A
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English (en)
Japanese (ja)
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JP6030125B2 (ja
JP2014520172A (ja
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Priority claimed from PCT/US2012/033417 external-priority patent/WO2012158291A1/en
Publication of JP2014520172A publication Critical patent/JP2014520172A/ja
Publication of JP2014520172A5 publication Critical patent/JP2014520172A5/ja
Application granted granted Critical
Publication of JP6030125B2 publication Critical patent/JP6030125B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014511369A 2011-05-13 2012-04-13 絶縁配合物 Active JP6030125B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161485841P 2011-05-13 2011-05-13
US61/485,841 2011-05-13
PCT/US2012/033417 WO2012158291A1 (en) 2011-05-13 2012-04-13 Insulation formulations

Publications (3)

Publication Number Publication Date
JP2014520172A JP2014520172A (ja) 2014-08-21
JP2014520172A5 true JP2014520172A5 (enExample) 2016-07-21
JP6030125B2 JP6030125B2 (ja) 2016-11-24

Family

ID=46001815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014511369A Active JP6030125B2 (ja) 2011-05-13 2012-04-13 絶縁配合物

Country Status (10)

Country Link
US (1) US20140079953A1 (enExample)
EP (1) EP2707411B1 (enExample)
JP (1) JP6030125B2 (enExample)
KR (1) KR101901473B1 (enExample)
CN (1) CN103649158B (enExample)
BR (1) BR112013029224B1 (enExample)
CA (1) CA2835651A1 (enExample)
MX (1) MX349112B (enExample)
TW (1) TWI540146B (enExample)
WO (1) WO2012158291A1 (enExample)

Families Citing this family (14)

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Publication number Priority date Publication date Assignee Title
WO2012158292A1 (en) * 2011-05-13 2012-11-22 Dow Global Technologies Llc Insulation formulations
BR112015008431A2 (pt) * 2012-10-19 2017-07-04 Dow Global Technologies Llc composição de resina curável, processo para preparar uma composição de resina curável, composição de resina curada e artigo
DE102013205117A1 (de) * 2013-03-22 2014-09-25 Siemens Aktiengesellschaft Vergussmasse, Verwendung der Vergussmasse, thermisch gehärteter Komposit erhältlich aus der Vergussmasse und elektrische Maschine mit der Vergussmasse
JP6321934B2 (ja) * 2013-09-30 2018-05-09 マツダ株式会社 エンジン燃焼室に臨む部材表面の断熱層の製造方法
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CN104200876A (zh) * 2014-08-09 2014-12-10 张传良 一种防火电缆用氧化镁填充料的制备方法
KR101808176B1 (ko) * 2016-04-07 2018-01-18 (주)창성 연자성몰딩액을 이용한 코일매립형인덕터의 제조방법 및 이를 이용하여 제조된 코일매립형인덕터
JP6748032B2 (ja) * 2017-06-06 2020-08-26 三菱電機株式会社 静止誘導器
KR102094296B1 (ko) * 2018-07-05 2020-03-27 (주)제니스월드 정전척용 흑색 세라믹 페이스트 조성물 및 이를 이용한 정전척
US12538649B2 (en) * 2018-09-03 2026-01-27 Lg Chem, Ltd. Encapsulation film, organic electronic element comprising the same, and method for manufacturing thereof
CN109401200A (zh) * 2018-10-29 2019-03-01 江苏宏鹏电气科技有限公司 一种用于母线槽内绝缘衬垫材料的制备配方
CN109687360B (zh) * 2018-11-27 2021-05-25 广东中讯通讯设备实业有限公司 一种绝缘性能好的硅芯管及其制备方法
EP3958305B1 (en) * 2020-08-17 2023-09-27 Infineon Technologies AG Power semiconductor module arrangement and method for producing the same
KR102876018B1 (ko) * 2024-04-03 2025-10-23 김주영 고강도 물성을 갖는 저점도의 진공함침 절연용 에폭시 수지조성물

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