JP2014520172A5 - - Google Patents

Download PDF

Info

Publication number
JP2014520172A5
JP2014520172A5 JP2014511369A JP2014511369A JP2014520172A5 JP 2014520172 A5 JP2014520172 A5 JP 2014520172A5 JP 2014511369 A JP2014511369 A JP 2014511369A JP 2014511369 A JP2014511369 A JP 2014511369A JP 2014520172 A5 JP2014520172 A5 JP 2014520172A5
Authority
JP
Japan
Prior art keywords
epoxy resin
filler
product
electrical
electrical device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014511369A
Other languages
English (en)
Japanese (ja)
Other versions
JP6030125B2 (ja
JP2014520172A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2012/033417 external-priority patent/WO2012158291A1/en
Publication of JP2014520172A publication Critical patent/JP2014520172A/ja
Publication of JP2014520172A5 publication Critical patent/JP2014520172A5/ja
Application granted granted Critical
Publication of JP6030125B2 publication Critical patent/JP6030125B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014511369A 2011-05-13 2012-04-13 絶縁配合物 Active JP6030125B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161485841P 2011-05-13 2011-05-13
US61/485,841 2011-05-13
PCT/US2012/033417 WO2012158291A1 (en) 2011-05-13 2012-04-13 Insulation formulations

Publications (3)

Publication Number Publication Date
JP2014520172A JP2014520172A (ja) 2014-08-21
JP2014520172A5 true JP2014520172A5 (enExample) 2016-07-21
JP6030125B2 JP6030125B2 (ja) 2016-11-24

Family

ID=46001815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014511369A Active JP6030125B2 (ja) 2011-05-13 2012-04-13 絶縁配合物

Country Status (10)

Country Link
US (1) US20140079953A1 (enExample)
EP (1) EP2707411B1 (enExample)
JP (1) JP6030125B2 (enExample)
KR (1) KR101901473B1 (enExample)
CN (1) CN103649158B (enExample)
BR (1) BR112013029224B1 (enExample)
CA (1) CA2835651A1 (enExample)
MX (1) MX349112B (enExample)
TW (1) TWI540146B (enExample)
WO (1) WO2012158291A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6030126B2 (ja) * 2011-05-13 2016-11-24 ダウ グローバル テクノロジーズ エルエルシー 絶縁配合物
EP2909252B1 (en) * 2012-10-19 2017-06-21 Blue Cube IP LLC Toughened epoxy thermosets containing core shell rubbers and polyols
DE102013205117A1 (de) * 2013-03-22 2014-09-25 Siemens Aktiengesellschaft Vergussmasse, Verwendung der Vergussmasse, thermisch gehärteter Komposit erhältlich aus der Vergussmasse und elektrische Maschine mit der Vergussmasse
JP6321934B2 (ja) * 2013-09-30 2018-05-09 マツダ株式会社 エンジン燃焼室に臨む部材表面の断熱層の製造方法
US11161979B2 (en) * 2014-07-18 2021-11-02 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board
CN104200876A (zh) * 2014-08-09 2014-12-10 张传良 一种防火电缆用氧化镁填充料的制备方法
KR101808176B1 (ko) * 2016-04-07 2018-01-18 (주)창성 연자성몰딩액을 이용한 코일매립형인덕터의 제조방법 및 이를 이용하여 제조된 코일매립형인덕터
JP6748032B2 (ja) * 2017-06-06 2020-08-26 三菱電機株式会社 静止誘導器
KR102094296B1 (ko) * 2018-07-05 2020-03-27 (주)제니스월드 정전척용 흑색 세라믹 페이스트 조성물 및 이를 이용한 정전척
JP7195685B2 (ja) * 2018-09-03 2022-12-26 エルジー・ケム・リミテッド 封止フィルム
CN109401200A (zh) * 2018-10-29 2019-03-01 江苏宏鹏电气科技有限公司 一种用于母线槽内绝缘衬垫材料的制备配方
CN109687360B (zh) * 2018-11-27 2021-05-25 广东中讯通讯设备实业有限公司 一种绝缘性能好的硅芯管及其制备方法
EP3958305B1 (en) * 2020-08-17 2023-09-27 Infineon Technologies AG Power semiconductor module arrangement and method for producing the same
KR102876018B1 (ko) * 2024-04-03 2025-10-23 김주영 고강도 물성을 갖는 저점도의 진공함침 절연용 에폭시 수지조성물

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2924580A (en) 1957-08-08 1960-02-09 Union Carbide Corp Divinyl benzene dioxide compositions
US2982752A (en) * 1958-04-25 1961-05-02 Union Carbide Corp Composition comprising a polyepoxide and divinylbenzene dioxide
GB855025A (en) * 1958-10-11 1960-11-30 Union Carbide Corp Improvements in and relating to polymerisable epoxide compositions
NL259331A (enExample) * 1959-12-24
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
US5189080A (en) * 1989-04-25 1993-02-23 Robert Bosch Gmbh Epoxy resin composition for encapsulating electric circuit components
JP2524011B2 (ja) * 1991-05-23 1996-08-14 株式会社日立製作所 高圧コイル注型用熱硬化性樹脂組成物、該組成物で注型、硬化してなるモ―ルドコイル、パネル
US5340890A (en) * 1993-01-28 1994-08-23 Shell Oil Company Cyclobutene anhydride-cured epoxy resin composition
US5898991A (en) * 1997-01-16 1999-05-04 International Business Machines Corporation Methods of fabrication of coaxial vias and magnetic devices
AU711786B2 (en) * 1997-05-16 1999-10-21 National Starch And Chemical Investment Holding Corporation Reactive radiation- or thermally-initiated cationically- curable epoxide monomers and compositions made from those monomers
DE19828248A1 (de) 1998-06-25 1999-12-30 Abb Corporate Research Ltd Bad Bei niedriger Temperatur härtende Epoxidharzsysteme aus Aminoglycidylverbindungen und cyclischen Carbonsäureanhydriden
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
US6500529B1 (en) * 2001-09-14 2002-12-31 Tonoga, Ltd. Low signal loss bonding ply for multilayer circuit boards
ATE277103T1 (de) 2002-01-28 2004-10-15 Abb Research Ltd Vergussmasse auf der basis duroplastischer epoxidharze
US7311972B2 (en) * 2004-10-14 2007-12-25 Yazaki Corporation Filled epoxy resin compositions
US20060275608A1 (en) * 2005-06-07 2006-12-07 General Electric Company B-stageable film, electronic device, and associated process
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
CN101490124A (zh) 2006-07-20 2009-07-22 Abb研究有限公司 抗病毒面罩和过滤材料
EP2064268A4 (en) * 2006-09-12 2013-05-01 Henkel Ag & Co Kgaa METHOD FOR CHANGING THE RHEOLOGY IN FILLED RESIN SYSTEMS BY MEANS OF CAVITATION
JP5194030B2 (ja) * 2007-02-06 2013-05-08 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィ投影露光装置の照明系のマルチミラーアレイを監視するための方法および装置
JP5450386B2 (ja) * 2008-03-27 2014-03-26 新日鉄住金化学株式会社 エポキシ樹脂組成物及び硬化物
BRPI0918349A2 (pt) 2008-12-30 2015-08-11 Dow Global Technologies Llc Processo para preparar dióxido de divinilareno
CN102341426B (zh) * 2009-03-05 2013-07-24 新日铁住金化学株式会社 环氧树脂组合物
KR101716634B1 (ko) * 2009-03-31 2017-03-14 신닛테츠 수미킨 가가쿠 가부시키가이샤 에폭시수지, 에폭시수지 조성물 및 경화물
SG171555A1 (en) * 2009-11-23 2011-06-29 Dow Global Technologies Inc Epoxy resin formulations for underfill applications
WO2011071745A1 (en) * 2009-12-09 2011-06-16 Dow Global Technologies Llc Epoxy resin compositions
JP5390444B2 (ja) * 2010-03-23 2014-01-15 新日鉄住金化学株式会社 耐アンモニア性エポキシ樹脂組成物およびその成形硬化物
WO2011163154A2 (en) * 2010-06-25 2011-12-29 Dow Global Technologies Llc Polymer concrete composition
WO2011163282A2 (en) * 2010-06-25 2011-12-29 Dow Global Technologies Llc Curable epoxy resin compositions and composites made therefrom
JP6030126B2 (ja) * 2011-05-13 2016-11-24 ダウ グローバル テクノロジーズ エルエルシー 絶縁配合物
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge

Similar Documents

Publication Publication Date Title
EP2707411B1 (en) Insulation formulations
CN106103534B (zh) 芳香族胺树脂、马来酰亚胺树脂、固化性树脂组合物及其固化物
MX345330B (es) Formulaciones de aislamiento.
CN106084184B (zh) 组合物、环氧树脂固化剂、环氧树脂组合物、热固性组合物、固化物、半导体装置以及层间绝缘材料
CN101663344A (zh) 可固化环氧树脂组合物
WO2011095208A1 (en) Electrical insulation system
US20160042836A1 (en) Insulated Wire, Rotary Electric Machine, and Method for Manufacturing Insulated Wire
CN104292768B (zh) 一种用于高压电力绝缘的环氧树脂组合物及其制备方法
KR20160036770A (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 패키지
EP3430630A1 (en) A process for the preparation of insulation systems for electrical engineering, the articles obtained therefrom and the use thereof
CN105086362A (zh) 含有无机填料的环氧树脂固化物及使用其的层压板
WO2013123648A1 (en) Curable epoxy composition with milled glass fiber
CN102341427B (zh) 绝缘体用的铸模树脂体系
TW201516088A (zh) 薄膜用樹脂組成物、絕緣膜及半導體裝置
WO2014184863A1 (ja) 高電圧機器用の複合絶縁樹脂材及びそれを用いた高電圧機器
KR102802243B1 (ko) 저장 안정성 조성물 및 경화성 수지 조성물
CN105111647A (zh) 一种耐高温抗老化的电力绝缘材料及其制作方法
RU2468054C1 (ru) Способ получения компаунда
RU2474599C2 (ru) Компаунд и способ его получения
KR102467317B1 (ko) 열팽창성 조정제, 열팽창성 조정제로서의 사용, 열경화성 수지 조성물, 당해 열경화성 수지 조성물을 함유하는 절연재, 봉지제 및 도전 페이스트, 당해 열경화성 수지 조성물을 경화시킨 경화물, 당해 열경화성 수지 조성물을 갖는 기판 재료, 당해 열경화성 수지 조성물을 기재에 함침시킨 프리프레그, 당해 프리프레그의 열경화성 수지 조성물을 경화시킨 부재, 열팽창율의 조정 방법, 그리고 당해 조정 방법을 사용하여 제조된 부재
JP6867894B2 (ja) 組成物、エポキシ樹脂硬化剤、エポキシ樹脂組成物、熱硬化性組成物、硬化物、半導体装置、および層間絶縁材料
JP5830990B2 (ja) ナノコンポジット樹脂硬化物の製造方法
JP2013194094A (ja) 樹脂組成物、樹脂フィルム、及び硬化物
JP2018002901A (ja) 樹脂組成物及び樹脂硬化物並びに樹脂硬化物を含む高電圧機器
WO2016145647A1 (en) Epoxy molding compound using anhydride hardener, manufacturing process and use thereof