MX345330B - Formulaciones de aislamiento. - Google Patents

Formulaciones de aislamiento.

Info

Publication number
MX345330B
MX345330B MX2013013273A MX2013013273A MX345330B MX 345330 B MX345330 B MX 345330B MX 2013013273 A MX2013013273 A MX 2013013273A MX 2013013273 A MX2013013273 A MX 2013013273A MX 345330 B MX345330 B MX 345330B
Authority
MX
Mexico
Prior art keywords
epoxy resin
filler
cured product
formulation composition
resin formulation
Prior art date
Application number
MX2013013273A
Other languages
English (en)
Other versions
MX2013013273A (es
Inventor
Esseghir Mohamed
J Harris William
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of MX2013013273A publication Critical patent/MX2013013273A/es
Publication of MX345330B publication Critical patent/MX345330B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B19/00—Apparatus or processes specially adapted for manufacturing insulators or insulating bodies
    • H01B19/04—Treating the surfaces, e.g. applying coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

Una composición de formulación de resina epóxica curable útil como aislamiento para un aparato eléctrico incluyendo (a) al menos una resina epóxica líquida; (b) al menos un endurecedor de anhídrido cíclico líquido; (c) al menos un relleno térmicamente conductor y eléctricamente aislante, en donde el relleno incluye un relleno tratado con epoxi-silano; y (d) al menos un catalizador de curado sin hidrógenos de amina; en donde la composición de formulación de resina epóxica sobre curado proporciona un producto curado con un balance requerido de propiedades eléctricas, mecánicas y térmicas, tales como Tg, fuerza de tensión, fuerza dieléctrica, y resistividad de volumen, de manera que el producto curado puede ser usado en aplicaciones operadas a una temperatura mayor que o igual a 120°C.
MX2013013273A 2011-05-13 2012-04-13 Formulaciones de aislamiento. MX345330B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161485843P 2011-05-13 2011-05-13
PCT/US2012/033424 WO2012158292A1 (en) 2011-05-13 2012-04-13 Insulation formulations

Publications (2)

Publication Number Publication Date
MX2013013273A MX2013013273A (es) 2014-07-09
MX345330B true MX345330B (es) 2017-01-25

Family

ID=45976562

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013013273A MX345330B (es) 2011-05-13 2012-04-13 Formulaciones de aislamiento.

Country Status (10)

Country Link
US (1) US9196412B2 (es)
EP (1) EP2707412B1 (es)
JP (1) JP6030126B2 (es)
KR (1) KR102001688B1 (es)
CN (1) CN103649160B (es)
BR (1) BR112013029221B1 (es)
CA (1) CA2835658C (es)
MX (1) MX345330B (es)
TW (1) TWI540149B (es)
WO (1) WO2012158292A1 (es)

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US20180046076A1 (en) * 2015-03-23 2018-02-15 Dow Global Technologies Llc Photocurable Compositions for Three-Dimensional Printing
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CN111868844A (zh) * 2018-03-16 2020-10-30 亨斯迈先进材料许可(瑞士)有限公司 用于浸渍纸套管的固化性混合物
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FR3091406B1 (fr) * 2018-12-31 2021-01-15 Centre National De Recherche Scient Cnrs Matériau pour l’isolation électrique et procédé de fabrication
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DE202022106253U1 (de) * 2022-10-24 2022-12-01 Siemens Aktiengesellschaft Formulierung für ein Isolationssystem und Formkörper daraus
WO2024088848A1 (de) * 2022-10-24 2024-05-02 Siemens Aktiengesellschaft Formulierung für ein isolationssystem, verwendung dazu und formkörper
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Also Published As

Publication number Publication date
CN103649160B (zh) 2016-01-13
CN103649160A (zh) 2014-03-19
JP6030126B2 (ja) 2016-11-24
BR112013029221B1 (pt) 2021-03-09
KR20140040152A (ko) 2014-04-02
US9196412B2 (en) 2015-11-24
BR112013029221A2 (pt) 2017-03-14
KR102001688B1 (ko) 2019-07-18
CA2835658A1 (en) 2012-11-22
EP2707412A1 (en) 2014-03-19
US20140125439A1 (en) 2014-05-08
JP2014518921A (ja) 2014-08-07
TWI540149B (zh) 2016-07-01
MX2013013273A (es) 2014-07-09
CA2835658C (en) 2020-01-28
EP2707412B1 (en) 2016-01-06
WO2012158292A1 (en) 2012-11-22
TW201311756A (zh) 2013-03-16

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