CN106008924A - 一种酸酐类环氧树脂固化配方 - Google Patents

一种酸酐类环氧树脂固化配方 Download PDF

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Publication number
CN106008924A
CN106008924A CN201610464326.9A CN201610464326A CN106008924A CN 106008924 A CN106008924 A CN 106008924A CN 201610464326 A CN201610464326 A CN 201610464326A CN 106008924 A CN106008924 A CN 106008924A
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epoxy resin
parts
resin curing
curing formula
type epoxy
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白健
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Liuzhou Qiangwei Forging Factory
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Liuzhou Qiangwei Forging Factory
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Priority to CN201610464326.9A priority Critical patent/CN106008924A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

本发明公开了一种酸酐类环氧树脂固化配方，属于化工材料领域。由以下原料组成：E‑51型双酚A环氧树脂100‑120份、甲基六氢苯酐79‑88份、2‑乙基‑4‑甲基咪唑0.4‑0.7份、邻苯二甲酸酯0.6‑0.8份、乙酰丙酮0.2‑0.5份、丁酮30‑50份。本发明的提供的酸酐类环氧树脂固化配方，促进剂用量少，可在中温固化，固化物耐热性及强度优良。

Description

一种酸酐类环氧树脂固化配方
技术领域
本发明涉及化工材料领域，具体涉及一种酸酐类环氧树脂固化配方
背景技术
环氧树脂由于具有较好的热稳定性、绝缘性、黏附性、良好的力学性能、优良的成型工艺性能以及较低的成本等，广泛应用于电子元器件的黏接、封装以及印制线路板制作等领域，进而成为目前最为重要的电子化学材料之一近年来随着先进微电子技术的不断发展以及全球范围内环境保护呼声的日益高涨，电子领域无铅焊料的开发已成为必然趋势。而无铅焊料的回流焊温度比传统的铅焊料高30～40℃。更高的回流焊温度，对半导体元件及基板的耐热性提出了更高的要求，同时对在电子领域中普遍应用的环氧树脂材料也提出了更高的要求，即要求用于电子领域的环氧树脂材料可以短暂接触高温(260℃，30s)而不发生变形。因此，开发具有高耐热性的环氧树脂体系势在必行。
发明内容
针对上述，本发明的目的是提供一种高耐热性环氧树脂固化配方。
本发明采取的具体技术方案是：
一种酸酐类环氧树脂固化配方，其特征在于按重量份计，由以下原料组成：E-51型双酚A环氧树脂100-120份、甲基六氢苯酐79-88份、2-乙基-4-甲基咪唑0.4-0.7份、邻苯二甲酸酯0.6-0.8份、乙酰丙酮0.2-0.5份、丁酮30-50份。
本发明的优点是：促进剂用量少，可在中温固化，固化物耐热性及强度优良。
具体实施方式
下面对本发明的较佳实施例进行详细阐述，以使本发明的优点和特征能更易于被本领域技术人员理解，从而对本发明的保护范围做出更为清楚明确的界定。
实施例1
一种酸酐类环氧树脂固化配方，其特征在于按重量份计，由以下原料组成：E-51型双酚A环氧树脂100份、甲基六氢苯酐79份、2-乙基-4-甲基咪唑0.4份、邻苯二甲酸酯0.6份、乙酰丙酮0.2份、丁酮30份。
实施例2
一种酸酐类环氧树脂固化配方，其特征在于按重量份计，由以下原料组成：E-51型双酚A环氧树脂110份、甲基六氢苯酐83.5份、2-乙基-4-甲基咪唑0.55份、邻苯二甲酸酯0.7份、乙酰丙酮0.35份、丁酮40份。
实施例3
一种酸酐类环氧树脂固化配方，其特征在于按重量份计，由以下原料组成：E-51型双酚A环氧树脂120份、甲基六氢苯酐88份、2-乙基-4-甲基咪唑0.7份、邻苯二甲酸酯0.8份、乙酰丙酮0.5份、丁酮50份。

Claims (3)

1.一种酸酐类环氧树脂固化配方，其特征在于按重量份计，由以下原料组成：E-51型双酚A环氧树脂100-120份、甲基六氢苯酐79-88份、2-乙基-4-甲基咪唑0.4-0.7份、邻苯二甲酸酯0.6-0.8份、乙酰丙酮0.2-0.5份、丁酮30-50份。
2.根据权利要求1所述的酸酐类环氧树脂固化配方，其特征在于按重量份计，由以下原料组成：E-51型双酚A环氧树脂105-115份、甲基六氢苯酐81-86份、2-乙基-4-甲基咪唑0.5-0.6份、邻苯二甲酸酯0.65-0.75份、乙酰丙酮0.3-0.4份、丁酮35-45份。
3.根据权利要求1所述的酸酐类环氧树脂固化配方，其特征在于按重量份计，由以下原料组成：E-51型双酚A环氧树脂110份、甲基六氢苯酐83.5份、2-乙基-4-甲基咪唑0.55份、邻苯二甲酸酯0.7份、乙酰丙酮0.35份、丁酮40份。
CN201610464326.9A 2016-06-23 2016-06-23 一种酸酐类环氧树脂固化配方 Pending CN106008924A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102040802A (zh) * 2010-10-14 2011-05-04 天津联美化学工业有限公司 环氧树脂体系及其用途
CN102703010A (zh) * 2012-05-11 2012-10-03 华东理工大学 一种锂电池软包装用环氧粘合剂和锂电池软包装材料
CN103636286A (zh) * 2011-06-23 2014-03-12 三井化学株式会社 光半导体用的表面密封剂、使用其的有机el器件的制造方法、有机el器件以及有机el显示面板
CN103649160A (zh) * 2011-05-13 2014-03-19 陶氏环球技术有限责任公司 绝缘制剂
CN104673122A (zh) * 2013-12-03 2015-06-03 凯尔凯德新材料科技泰州有限公司 一种高导热率的导热胶膜及其制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102040802A (zh) * 2010-10-14 2011-05-04 天津联美化学工业有限公司 环氧树脂体系及其用途
CN103649160A (zh) * 2011-05-13 2014-03-19 陶氏环球技术有限责任公司 绝缘制剂
CN103636286A (zh) * 2011-06-23 2014-03-12 三井化学株式会社 光半导体用的表面密封剂、使用其的有机el器件的制造方法、有机el器件以及有机el显示面板
CN102703010A (zh) * 2012-05-11 2012-10-03 华东理工大学 一种锂电池软包装用环氧粘合剂和锂电池软包装材料
CN104673122A (zh) * 2013-12-03 2015-06-03 凯尔凯德新材料科技泰州有限公司 一种高导热率的导热胶膜及其制作方法

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Application publication date: 20161012