WO2018149422A2 - 一体成型电感元件及其制造方法 - Google Patents

一体成型电感元件及其制造方法 Download PDF

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Publication number
WO2018149422A2
WO2018149422A2 PCT/CN2018/087736 CN2018087736W WO2018149422A2 WO 2018149422 A2 WO2018149422 A2 WO 2018149422A2 CN 2018087736 W CN2018087736 W CN 2018087736W WO 2018149422 A2 WO2018149422 A2 WO 2018149422A2
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coil
integrally formed
insulating coating
coating layer
component
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PCT/CN2018/087736
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English (en)
French (fr)
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WO2018149422A3 (zh
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夏胜程
汪信志
肖更新
余鑫树
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深圳顺络电子股份有限公司
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Priority to CN201880000456.4A priority Critical patent/CN109791829A/zh
Priority to PCT/CN2018/087736 priority patent/WO2018149422A2/zh
Publication of WO2018149422A2 publication Critical patent/WO2018149422A2/zh
Publication of WO2018149422A3 publication Critical patent/WO2018149422A3/zh
Priority to US16/999,042 priority patent/US20200381151A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147—Alloys characterised by their composition
    • H01F1/153—Amorphous metallic alloys, e.g. glassy metals
    • H01F1/15333—Amorphous metallic alloys, e.g. glassy metals containing nanocrystallites, e.g. obtained by annealing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147—Alloys characterised by their composition
    • H01F1/153—Amorphous metallic alloys, e.g. glassy metals
    • H01F1/15308—Amorphous metallic alloys, e.g. glassy metals based on Fe/Ni
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147—Alloys characterised by their composition
    • H01F1/153—Amorphous metallic alloys, e.g. glassy metals
    • H01F1/15358—Making agglomerates therefrom, e.g. by pressing
    • H01F1/15366—Making agglomerates therefrom, e.g. by pressing using a binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/147—Alloys characterised by their composition
    • H01F1/153—Amorphous metallic alloys, e.g. glassy metals
    • H01F1/15383—Applying coatings thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/22—Heat treatment; Thermal decomposition; Chemical vapour deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
    • H01F41/26—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents, e.g. electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F2017/048—Fixed inductances of the signal type  with magnetic core with encapsulating core, e.g. made of resin and magnetic powder

Definitions

  • the present invention relates to an integrally formed inductor element and a method of fabricating the same.
  • the integrated inductor has the following three advantages: (1) Material use: material use: low loss alloy powder die casting, low impedance, leadless end, small parasitic capacitance; (2) Structural features: solid and firm, precise thickness and long-lasting rust prevention; (3) Practicality: small volume, high current, excellent temperature rise current and saturation current characteristics in high frequency and high temperature environment, working frequency coverage wide range.
  • the current integrated inductors also have technical disadvantages that cannot be ignored.
  • the electrical performance of the traditional integrated inductor is mainly determined by the magnetic material. Under the same material, the magnetic permeability and the saturation flux are positively correlated with the density.
  • One of the methods for increasing the density is the improvement of the forming pressure.
  • the integral molded inductor product cannot be subjected to large pressure by press molding, because the self-adhesive copper wire used for the integrally formed inductor is generally in the form of an organic film coating. However, there is a defect in the self-adhesive copper wire of the organic film.
  • the organic film coated on the outside of the copper wire will be damaged under the external high pressure at a higher pressure.
  • the organic film since the organic film has poor pressure resistance and the density of product pressing is low, the product prepared by using the organic film-coated enamelled copper wire has limited electrical properties.
  • the main object of the present invention is to overcome the deficiencies of the prior art, and provide an integrally formed inductor element and a manufacturing method thereof to improve the withstand voltage performance of the integrally formed inductor and improve product performance and reliability.
  • the present invention adopts the following technical solutions:
  • An integrally formed inductive component comprising a coil having an insulating coating and a magnetic material integrally formed with the coil, and an electrode exposed to the outside of the magnetic material is formed at both ends of the coil, wherein
  • the insulating coating layer of the coil comprises a uniformly mixed non-conductive inorganic particle component and a resin component, wherein the weight percentage of the inorganic particle component to the resin component is 70%: 30% to 90%: 10% .
  • the inorganic particle component includes any one or more of SiO 2 , Al 2 O 3 , and SiC.
  • the resin component includes any one or more of polyimide and polyurethane.
  • the magnetic powder is an iron-based metal alloy soft magnetic powder.
  • the soft magnetic powder is any soft magnetic powder of carbonyl iron powder, FeSiCr, FeNi50, MPP, amorphous soft magnetic powder, and nanocrystalline soft magnetic powder. It is preferably FeSiCr.
  • the material forming the electrode is a silver paste.
  • the insulating coating of the coil is further coated with a self-adhesive layer.
  • a method of preparing the integrally formed inductive component comprises the following steps:
  • step S1 comprises: drawing a copper wire, copper wire nickel plating, annealing, coating an insulating coating on the copper wire, coating the self-adhesive layer on the insulating coating layer, baking, cooling, and winding;
  • step S2 comprises: performing granulation of the soft magnetic of the iron-based metal alloy, followed by baking.
  • the heat treatment condition is heat treatment at 180 to 230 ° C for 2.8 to 3.2 h, and most preferably heat treatment at 200 ° C for 3 h.
  • the step S4 includes: firstly grinding the insulating coating layer of the coil along an electrode take-off direction to expose a copper wire in the coil, and then forming an electrode by a silver plating process, preferably forming an overlay The sidewall of the core and the L-shaped electrode at the bottom.
  • the coil of the traditional integrated inductor component is made of an organic paint film such as a polyurethane enameled wire.
  • the organic paint film is easily broken, which easily leads to short-circuit failure of the integrally formed inductor product, and the reliability is poor.
  • the molding density of the magnetic material integrally formed with the coil cannot be effectively improved, which affects the magnetic permeability and saturation flux of the integrally formed inductor product, thereby affecting the performance of the inductor product.
  • the insulating coating layer of the coil of the integrally formed inductor of the present invention comprises a uniformly mixed non-conductive inorganic particle component and a resin component, wherein the weight percentage of the inorganic particle component to the resin component is 70%: 30% ⁇ 90%: 10%, due to the presence of non-conductive inorganic particles, the insulating coating not only has insulation, but also has excellent high-pressure resistance, can effectively protect the copper core, and overcome the traditional package.
  • the insulating lacquer layer of the inner core of the copper clad wire is broken under high pressure, which causes a problem in the production of the short circuit of the product, and the magnetic density of the magnetic electronic component product can be greatly improved by the strong increase of the allowable pressing pressure, thereby improving the magnetic property of the product.
  • Conductivity
  • the inductor product is manufactured by using the integrated inductor manufacturing method of the invention, has high pressure resistance and good performance, good reliability, high magnetic permeability and good electrical performance, and overcomes the poor resistance of the traditional one-piece inductor, resulting in poor electrical performance of the product.
  • the ideal shortcoming can be widely used in the production of magnetic electronic components under high pressure.
  • the pressing pressure of the conventional integrally formed inductor component is generally 500-600 MPa, and the integral molded inductor of the present invention can be pressed at a pressure of 1000-1400 MPa or more.
  • the high-reliability integrally formed inductor of the present invention adopts an inorganic film-coated copper wire, the film of the inductive copper wire can be effectively protected from damage under high-pressure conditions, thereby greatly reducing the interlayer existing in the conventional integrally formed inductor. Poor, product short-circuit and other failure risks.
  • the ⁇ i range of the conventional integrally formed inductor is 20-30, and the integrated molded inductor of the present invention has good withstand voltage performance, so that the ⁇ i of the inductor product obtained by high pressure strong pressing is higher, up to 30-40.
  • FIG. 1 is a schematic cross-sectional view of an integrally formed inductor according to an embodiment of the present invention
  • Figure 2 is an enlarged schematic view of the D area of Figure 1:
  • FIG. 3 is a schematic view showing deformation of a coil in an integrated molded inductor pressing process according to an embodiment of the present invention
  • Figure 4 is an enlarged schematic view of the E area of Figure 3;
  • FIG. 5 is a schematic diagram of a manufacturing process of an integrally formed inductor according to an embodiment of the present invention.
  • an integrally formed inductor element includes a coil 1 having an insulating coating layer 102 and a magnetic material 2 integrally formed integrally with the coil 1 and an insulating coating layer. 102 is coated with a copper wire 101, and an electrode 3 exposed to the outside of the magnetic material 2 is formed at both ends of the coil 1, wherein the insulating coating layer 102 of the coil 1 comprises an inorganic particle component 1021 and a resin A component in which the weight percentage of the inorganic particle component 1021 and the resin component is 70%: 30% to 90%: 10%, and the inorganic particle component 1021 is uniformly mixed with the resin component.
  • the inorganic particle component includes any one or more of SiO 2 , Al 2 O 3 , and SiC.
  • the resin component includes any one or more of polyimide and polyurethane.
  • the magnetic powder is an iron-based metal alloy soft magnetic powder.
  • the soft magnetic powder is any one of carbonyl iron powder, FeSiCr, FeNi50, MPP, amorphous soft magnetic powder, and nanocrystalline soft magnetic powder.
  • Soft magnetic powder most preferably FeSiCr.
  • the material forming the electrode 3 is a silver paste.
  • the material of the electrode 3 can also be made of other conductive metal paste.
  • the insulating coating 102 of the coil 1 is further coated with a self-adhesive layer.
  • a method of preparing the integrally formed inductor component includes the following steps:
  • the insulating coating layer 102 comprises a uniformly mixed inorganic particle component 1021 and a resin component, wherein the weight percentage of the inorganic particle component 1021 and the resin component is 70%: 30% to 90%: 10%;
  • An electrode 3 electrically connected to both ends of the coil 1 is formed outside the magnetic core formed of the magnetic material 2.
  • the step S1 comprises: drawing a copper wire, copper wire nickel plating, annealing, coating an insulating coating on the copper wire, coating the self-adhesive layer on the insulating coating layer, baking, cooling, and winding;
  • step S2 comprises: granulating the soft magnetic of the iron-based metal alloy and then baking.
  • the heat treatment is heat treatment at 180 to 230 ° C for 2.8 to 3.2 h, and most preferably at 200 ° C for 3 h.
  • step S4 includes first grinding the insulating coating of the coil 1 along the direction in which the electrode 3 is taken out to expose the copper wire in the coil 1, and then forming the electrode 3 by a silver plating process.
  • the L-shaped electrode 3 covers the side walls and the bottom of the magnetic core.
  • the electrode 3 can also be fabricated by a PVD/copper metallization process.
  • the copper wire can be made of more than 99.99% pure copper. Nickel plating is available outside the copper wire.
  • the coil of the traditional integrated inductor component is made of an organic paint film such as a polyurethane enameled wire.
  • the organic paint film is easily broken, which easily leads to short-circuit failure of the integrally formed inductor product, and the reliability is poor.
  • the molding density of the magnetic material integrally formed with the coil cannot be effectively improved, which affects the magnetic permeability and saturation flux of the integrally formed inductor product, thereby affecting the performance of the inductor product.
  • the insulating coating layer of the coil of the integrally molded inductor of the present invention comprises a uniformly mixed inorganic particle component and a resin component, wherein the weight percentage of the inorganic particle component and the resin component is 70%: 30% to 90%: 10%, due to the presence of inorganic particles, the insulating coating not only has insulation, but also has excellent high-pressure resistance, can effectively protect the copper core, and overcome the insulation of the traditional coated copper core.
  • the problem that the lacquer layer is broken under high pressure causes a short circuit of the product, and the allowable pressing pressure is greatly enhanced, and the molding density of the magnetic electronic component product can be greatly improved, thereby improving the magnetic permeability of the product.
  • the inductor product is manufactured by using the integrated inductor manufacturing method of the invention, has high pressure resistance and good performance, good reliability, high magnetic permeability and good electrical performance, and overcomes the poor resistance of the traditional one-piece inductor, resulting in poor electrical performance of the product.
  • the ideal shortcoming can be widely used in the production of magnetic electronic components under high pressure.
  • the inductive component includes a coil 1, an electrode 3, and a magnetic material 2 using a metal soft magnetic powder; and FIG. 5 shows a simplified flow of the integrally formed inductor.
  • the coil of the specified shape and number of turns is wound, and then the coil is placed in the cavity, filled with the soft magnetic powder of the metal, and the coil 1 and the soft magnetic powder of the metal are pressed into one body by applying a certain pressure, and then heat-treated at a temperature of 200 ° C. 3h, the outer end portion of the exposed metal soft magnetic powder of the coil 1 is ground by grinding, and the electrode 3 is formed by a terminal silver plating process to finally form a surface mount power inductor.
  • Fig. 2 is an enlarged schematic cross-sectional view showing a coil of a specific example of the present invention.
  • the insulating coating layer on the outer side of the coil 1 is obtained by mixing an inorganic particle component and an organic resin component by a weight ratio of 7:3, and the inorganic particle component is at least one of inorganic substances such as SiO 2 , Al 2 O 3 , and SiC.
  • the insulating coating layer may be coated with a self-adhesive layer which is an organic resin.
  • FIG. 3 is a schematic view showing the deformation of the coil of the high-reliability and integrally formed inductor pressing process of the present invention.
  • 4 is an enlarged schematic view of an area E in FIG.
  • the coil of the integrally formed inductor adopts the above-mentioned insulating coating layer, and under the condition of high pressure, due to the presence of non-conductive inorganic particles in the insulating coating layer, the force is transferred by the inorganic particles and transferred to the inner core of the copper wire.
  • the non-conductive inorganic particles not only serve as a force transfer medium, but also isolate the copper core as a spacer in the insulating coating. Therefore, when pressed under high pressure, although the inner core of the copper wire is deformed due to excessive pressure, there is no risk of direct contact between the two copper wires due to the isolation of the inorganic particle layer, thereby causing a short circuit. It solves the defect that the traditional one-piece inductor has poor pressure resistance performance.
  • the integrally formed inductor of the present invention overcomes the traditional integral molding inductance, and the enameled wire has poor resistance to high pressure, and the magnet compaction density is low, thereby hindering the electrical performance of the product.
  • the power inductor is fabricated by the method of the invention, which overcomes the contradiction between molding density and withstand voltage, and has higher pressure resistance and better electrical properties.

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  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

本发明公开了一种一体成型电感元件及其制作方法，所述一体成型电感元件包括具有绝缘包覆层的线圈和与所述线圈压制成型为一体的磁性材料，在所述线圈的两端形成有暴露在所述磁性材料外的电极，其中所述线圈的所述绝缘包覆层包含均匀混合的非导电性无机物颗粒成分以及树脂成分，其中所述无机物颗粒成分与所述树脂成分的重量百分比为70％:30％～90％:10％。本发明的一体成型电感元件及其制作方法能够提升一体成型电感的耐压性能，并提升电感产品的电性能与可靠性。

Description

一体成型电感元件及其制造方法 技术领域
本发明涉及一体成型电感元件及其制造方法。
背景技术
近年来，伴随个人电脑和电子整机的小型化和高性能化，迫切要求给其电子电路提供电力的电源电路进一步小型、薄型和大电流化。因此，为了满足市场的需求，电感行业的制造技术也越来越先进，实用性也越来越高，一体成型电感就是电感技术进步的产物。一体成型电感与传统电感相比，主要有以下三个方面的优点：(1)材料使用方面：材料使用方面：低损耗合金粉末压铸，低阻抗，无引线端头，寄生电容小；(2)结构特点方面：坚实牢固，产品精准厚度、持久防锈；(3)实用性方面：小体积、大电流，在高频和高温环境下仍保持优良的温升电流及饱和电流特性，工作频率覆盖范围广。
但是，目前一体成型电感同样存在着不可忽视的技术缺点。传统一体成型电感的电气性能主要是由磁材决定，同种材质下，磁导率和饱和磁通与密度成正相关，提升密度的方法之一是成型压强的提高。目前一体成型电感产品压制成型无法承受大的压强，其原因在于，一体成型电感所用的漆包自粘铜线一般都是有机皮膜包覆的形式。但是，有机皮膜自粘铜线存在一个缺陷，电感器件如果是通过压强压制坯体而制成，那么在较高压强下，包覆在铜线外部的有机皮膜会在外部高压强下破损，会导致铜线裸露而造成产品短路的风险。此外，由于有机皮膜的耐压强能力较差，产品压制的密度较低，因此使用有机皮膜包覆的漆包铜线制备的产品电性性能有限。
综上所述，制备能够在高压强下压制成型的一体成型电感，对于提升一体成型电感可靠性存在着很大的需求。
发明内容
本发明的主要目的在于克服现有技术的不足，提供一体成型电感元件及其制造方法，以提升一体成型电感的耐压性能，并提升产品性能与可靠性。
为实现上述目的，本发明采用以下技术方案：
一种一体成型电感元件，包括具有绝缘包覆层的线圈和与所述线圈压制成型为一体的磁性材料，在所述线圈的两端形成有暴露在所述磁性材料外的电极，其中所述线圈的所述绝缘包覆层包含均匀混合的非导电性无机物颗粒成分以及树脂成分，其中所述无机物颗粒成分与所述树脂成分的重量百分比为70％:30％～90％:10％。
进一步地，所述无机物颗粒成分包括SiO 2、Al 2O 3、SiC中的任意一种或多种。
进一步地，所述树脂成分包括聚酰亚胺、聚氨酯中的任意一种或多种。
进一步地，所述磁粉为铁系金属合金软磁粉，优选地，所述软磁粉为羰基铁粉、FeSiCr、FeNi50、MPP、非晶软磁粉、纳米晶软磁粉中的任一种软磁粉，最优选为FeSiCr。
进一步地，形成所述电极的材料为银浆。
进一步地，所述线圈的所述绝缘包覆层外还涂覆有自粘层。
一种制备所述的一体成型电感元件的方法，包括如下步骤：
S1、准备具有绝缘包覆层的线圈，其中所述绝缘包覆层包含无机物颗粒成分以及树脂成分，其中所述无机物颗粒成分与所述树脂成分的重量百分比为70％:30％～90％:10％；
S2、准备磁性材料；
S3、将所述线圈与所述磁性材料压制成型为一体，并进行热处理；
S4、在由所述磁性材料形成的磁芯外形成与所述线圈的两端电连接的电极。
进一步地，步骤S1包括：拉铜线、铜线镀镍、退火、铜线上涂覆绝缘包覆层、绝缘包覆层上涂覆自粘层、烘焙、冷却、收线；
进一步地，步骤S2包括：进行铁系金属合金软磁的造粒，然后进行烘烤。
进一步地，步骤S3中，所述热处理条件为180～230℃热处理2.8～3.2h，最优选为200℃热处理3h。
进一步地，步骤S4包括：先沿着电极引出方向打磨所述线圈的所述绝缘包覆层至露出所述线圈内的铜线，然后用镀银电工艺形成电极，优选地，形成覆盖所述磁芯的侧壁和底部的L型电极。
本发明的一体成型电感元件相比传统的一体成型电感元件的有益效 果有：
传统一体成型电感元件的线圈采用的是有机漆膜如聚氨脂漆包线，在制作一体成型电感元件的压制过程中，有机漆膜非常容易破损，因而容易导致一体成型电感产品发生短路故障，可靠性差，而且由于线圈无法承受较高的压制压强，使得与线圈一体成型的磁性材料的成型密度无法有效提升，影响一体成型电感产品的磁导率和饱和磁通的提升，从而影响电感产品的性能。而本发明的一体成型电感的线圈的绝缘包覆层包含均匀混合的非导电性无机物颗粒成分以及树脂成分，其中所述无机物颗粒成分与所述树脂成分的重量百分比为70％:30％～90％:10％，由于非导电性无机物颗粒的存在，该绝缘包覆层不仅具有绝缘性，还具有了优良的抗高压性能，能够有效的保护铜线内芯，克服了传统的包覆铜线内芯的绝缘漆层在高压下破损从而导致产品短路的生产上的问题，且由于允许的压制压强大大提升，能够极大地提高磁性电子元器件产品的成型密度，从而提高产品的磁导率。使用本发明的一体成型电感制作方法制作电感产品，耐高压强性能好，可靠性好，磁导率高，产品电性能好，克服了传统一体成型电感耐压强性能差从而导致产品电气性能不理想的缺点，能够广泛应用于高压强下生产磁性电子元器件。
与传统的一体成型电感元件相比，本发明的一体成型电感元件的具体优点体现在如下方面：
(1)耐压强性能高
传统一体成型电感元件产品压制压强一般为500-600MPa，本发明的一体成型电感压制压强可达1000-1400MPa以上。
(2)可靠性高
由于本发明的高可靠一体成型电感采用的是无机皮膜包覆铜线，能够有效保护电感铜线的皮膜在高压强条件下不受损坏，从而大幅度降低了传统一体成型电感可能存在的层间不良，产品短路等失效风险。
(3)产品电性更优
传统一体成型电感的μi范围为20～30，本发明的一体成型电感耐压强性能好，从而经过高压强压制得到的电感产品的μi更高，可达30～40。
前述已经相当广泛地阐述了本发明的特征和技术优势，以便能够更好地理解本发明的详细描述。本发明实施例的具体特征和优势将在以下描述。
附图说明
图1为本发明一种实施例的一体成型电感的截面示意图；
图2为图1中的D区域的放大示意图：
图3为本发明一种实施例的一体成型电感压制过程中线圈变形的示意图；
图4为图3中的E区域的放大示意图；
图5为本发明一种实施例的一体成型电感的制造流程示意图。
具体实施方式
以下通过实施例结合附图对本发明进行进一步的详细说明。应该强调的是，下述说明仅仅是示例性的，而不是为了限制本发明的范围及其应用。本领域技术人员应该理解，披露的概念和具体实施例可以很容易地被使用作为基础用来修改或设计其它结构以完成本发明的相同目的。本领域技术人员也应该认识到，这种等同的构造并没有偏移本发明的精神和范围。被认为是本发明特点的新颖性特征，其结构和运作方法，以及进一步的目的和优点，从以下的描述并结合附图将被更好地理解。但是，应该深刻地认识到，提供的每个特征都仅是为了描述和说明，而不是意在限制本发明的定义。
参阅图1至图5，在一种实施例中，一种一体成型电感元件，包括具有绝缘包覆层102的线圈1和与所述线圈1压制成型为一体的磁性材料2，绝缘包覆层102包覆铜线101，在所述线圈1的两端形成有暴露在所述磁性材料2外的电极3，其中所述线圈1的所述绝缘包覆层102包含无机物颗粒成分1021以及树脂成分，其中所述无机物颗粒成分1021与所述树脂成分的重量百分比为70％:30％～90％:10％，所述无机物颗粒成分1021与所述树脂成分均匀混合。
在优选的实施例中，所述无机物颗粒成分包括SiO 2、Al 2O 3、SiC中的任意一种或多种。
在优选的实施例中，所述树脂成分包括聚酰亚胺、聚氨酯中的任意一种或多种。
在优选的实施例中，所述磁粉为铁系金属合金软磁粉，优选地，所述软磁粉为羰基铁粉、FeSiCr、FeNi50、MPP、非晶软磁粉、纳米晶软磁粉中的任一种软磁粉，最优选为FeSiCr。
在优选的实施例中，形成所述电极3的材料为银浆。电极3的材料也可以采用其他导电金属浆料。
在优选的实施例中，所述线圈1的所述绝缘包覆层102外还涂覆有自 粘层。
参阅图5，在另一种实施例中，一种制备所述的一体成型电感元件的方法，包括如下步骤：
S1、准备具有绝缘包覆层的线圈1，其中所述绝缘包覆层102包含均匀混合的无机物颗粒成分1021以及树脂成分，其中所述无机物颗粒成分1021与所述树脂成分的重量百分比为70％:30％～90％:10％；
S2、准备磁性材料2；
S3、先将所述线圈1与所述磁性材料2压制成型为一体，再进行热处
理；
S4、在由所述磁性材料2形成的磁芯外形成与所述线圈1的两端电连接的电极3。
在优选的实施例中，步骤S1包括：拉铜线、铜线镀镍、退火、铜线上涂覆绝缘包覆层、绝缘包覆层上涂覆自粘层、烘焙、冷却、收线；
在优选的实施例中，步骤S2包括：进行铁系金属合金软磁的造粒，然后进行烘烤。
在优选的实施例中，步骤S1中，所述热处理为180～230℃热处理2.8～3.2h，最优选为200℃热处理3h。
在优选的实施例中，步骤S4包括：先沿着电极3引出方向打磨所述线圈1的所述绝缘包覆层至露出所述线圈1内的铜线，然后用镀银电工艺形成电极3，优选为覆盖在磁芯的侧壁和底部的L型电极3。
电极3的制作还可以采用PVD/融铜金属化等工艺方式。
铜线可采用99.99％以上的纯铜制成。铜线外可镀镍。
传统一体成型电感元件的线圈采用的是有机漆膜如聚氨脂漆包线，在制作一体成型电感元件的压制过程中，有机漆膜非常容易破损，因而容易导致一体成型电感产品发生短路故障，可靠性差，而且由于线圈无法承受较高的压制压强，使得与线圈一体成型的磁性材料的成型密度无法有效提升，影响一体成型电感产品的磁导率和饱和磁通的提升，从而影响电感产品的性能。本发明的一体成型电感的线圈的绝缘包覆层包含均匀混合的无机物颗粒成分以及树脂成分，其中所述无机物颗粒成分与所述树脂成分的重量百分比为70％:30％～90％:10％，由于无机物颗粒的存在，该绝缘包覆层不仅具有绝缘性，还具有了优良的抗高压性能，能够有效的保护铜线内芯，克服了传统的包覆铜线内芯的绝缘漆层在高压下破损从而导致产品短 路的生产上的问题，且由于允许的压制压强大大提升，能够极大地提高磁性电子元器件产品的成型密度，从而提高产品的磁导率。使用本发明的一体成型电感制作方法制作电感产品，耐高压强性能好，可靠性好，磁导率高，产品电性能好，克服了传统一体成型电感耐压强性能差从而导致产品电气性能不理想的缺点，能够广泛应用于高压强下生产磁性电子元器件。
在一个具体示例中，如图1所示，电感元件包括线圈1、电极3、以及采用金属软磁粉的磁性材料2；图5所示为该一体成型电感制造的简易流程。首先，绕制规定形状和圈数的线圈、然后将线圈放入模腔中，填入金属软磁粉，通过施加一定的压强将线圈1和金属软磁粉压制成一体，然后以200℃的温度热处理3h，再通过研磨将线圈1的露出金属软磁粉的外端部分进行研磨，通过端银电镀工艺形成电极3，最终形成表面贴装功率电感。
图2为本发明一个具体示例的线圈截面放大示意图。线圈1外部的绝缘包覆层为无机物颗粒成分与有机树脂成分通过重量比例7:3混合而成，无机物颗粒成分为SiO 2、Al 2O 3、SiC等无机物的至少一种。绝缘包覆层可涂覆自粘层，其为有机树脂。图3为本发明高可靠一体成型电感压制过程线圈变形示意图。图4为图3中E区域的放大示意图。
该一体成型电感的线圈采用上述绝缘包覆层，在高压强条件下，由于绝缘包覆层中非导电性无机物颗粒的存在，力由无机物颗粒承载被通过其转移至铜线内芯，而非导电性无机物颗粒不仅作为一种力的传递介质，还作为绝缘包覆层中的隔离物隔离铜线内芯。因此，在高压强下压制时，尽管铜线内芯会由于压力过大而变形，但是两根铜线之间由于有无机物颗粒层的隔离作用，不会产生直接接触从而短路的风险，从而解决了传统一体成型电感耐压强性能差的缺陷。
本发明的一体成型电感克服了传统一体成型电感，漆包线耐高压强性差，磁体压制密度低从而使产品电气性能受限的障碍。使用本发明的方法制作功率电感，克服了成型密度和耐压的矛盾，具有更高的耐压性和更好的电性能。
以上内容是结合具体/优选的实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，其还可以对这些已描述的实施方式做出若干替代或变型，而这些替代或变型方式都应当 视为属于本发明的保护范围。在本说明书的描述中，参考术语“一种实施例”、“一些实施例”、“优选实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。尽管已经详细描述了本发明的实施例及其优点，但应当理解，在不脱离由所附权利要求限定的实施例精神和范围的情况下，可以在本文中进行各种改变、替换和变更。此外，本发明的范围不旨在限于说明书中所述的过程、机器、制造、物质组成、手段、方法和步骤的特定实施例。本领域普通技术人员将容易理解，可以利用执行与本文所述相应实施例基本相同功能或获得与本文所述实施例基本相同结果的目前存在的或稍后要开发的上述披露、过程、机器、制造、物质组成、手段、方法或步骤。因此，所附权利要求旨在将这些过程、机器、制造、物质组成、手段、方法或步骤包含在其范围内。

Claims (10)

  1. 一种一体成型电感元件，包括具有绝缘包覆层的线圈和与所述线圈压制成型为一体的磁性材料，在所述线圈的两端形成有暴露在所述磁性材料外的电极，其特征在于,所述线圈的所述绝缘包覆层包含均匀混合的非导电性无机物颗粒成分以及树脂成分，其中所述无机物颗粒成分与所述树脂成分的重量百分比为70％:30％～90％:10％。
  2. 根据权利要求1所述的一体成型电感元件，其特征在于,所述无机物颗粒成分包括SiO 2、Al 2O 3、SiC中的任意一种或多种。
  3. 根据权利要求1或2所述的一体成型电感元件，其特征在于,所述树脂成分包括聚酰亚胺、聚氨酯中的任意一种或多种。
  4. 根据权利要求1至3任一项所述的一体成型电感元件，其特征在于,所述磁粉为铁系金属合金软磁粉，优选地，所述软磁粉为羰基铁粉、FeSiCr、FeNi50、MPP、非晶软磁粉、纳米晶软磁粉中的任一种软磁粉，最优选为FeSiCr。
  5. 根据权利要求1至4任一项所述的一体成型电感元件，其特征在于,形成所述电极的材料为银浆。
  6. 根据权利要求1至5任一项所述的一体成型电感元件，其特征在于,所述线圈的所述绝缘包覆层外还涂覆有自粘层。
  7. 一种制备根据权利要求1至6任一项所述的一体成型电感元件的方法，其特征在于，包括如下步骤：
    S1、准备具有绝缘包覆层的线圈，其中所述绝缘包覆层包含无机物颗粒成分以及树脂成分，其中所述无机物颗粒成分与所述树脂成分的重量百分比为70％:30％～90％:10％；
    S2、准备磁性材料；
    S3、将所述线圈与所述磁性材料压制成型为一体，并进行热处理；
    S4、在由所述磁性材料形成的磁芯外形成与所述线圈的两端电连接的电极。
  8. 根据权利要求7所述的方法，其特征在于，步骤S1包括：拉铜线、铜线镀镍、退火、铜线上涂覆绝缘包覆层、绝缘包覆层上涂覆自粘层、烘焙、冷却、收线；
    步骤S2包括：进行铁系金属合金软磁的造粒，然后进行烘烤。
  9. 根据权利要求7或8所述的方法，其特征在于，步骤S1中，所述热处理的条件为180～230℃热处理2.8～3.2h，最优选为200℃热处理3h。
  10. 根据权利要求7至9任一项所述的方法，其特征在于，步骤S4包括：先沿着电极引出方向打磨所述线圈的所述绝缘包覆层至露出所述线圈内的铜线，然后用镀银电工艺形成电极，优选地，形成覆盖所述磁芯的侧壁和底部的L型电极。
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