WO2017185262A1 - 一种金属基体复合导线、功率电感及其制备方法 - Google Patents
一种金属基体复合导线、功率电感及其制备方法 Download PDFInfo
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- WO2017185262A1 WO2017185262A1 PCT/CN2016/080372 CN2016080372W WO2017185262A1 WO 2017185262 A1 WO2017185262 A1 WO 2017185262A1 CN 2016080372 W CN2016080372 W CN 2016080372W WO 2017185262 A1 WO2017185262 A1 WO 2017185262A1
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- Prior art keywords
- resin
- composite wire
- matrix composite
- glass
- metal matrix
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- 239000011156 metal matrix composite Substances 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 claims abstract description 33
- 239000000203 mixture Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 26
- 239000004840 adhesive resin Substances 0.000 claims abstract description 24
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 24
- 238000005245 sintering Methods 0.000 claims abstract description 18
- 239000000843 powder Substances 0.000 claims abstract description 13
- 239000006247 magnetic powder Substances 0.000 claims abstract description 9
- 239000005388 borosilicate glass Substances 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 8
- 239000002270 dispersing agent Substances 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 5
- 238000000227 grinding Methods 0.000 claims abstract description 4
- 238000005498 polishing Methods 0.000 claims abstract description 3
- 239000011521 glass Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 7
- 239000004677 Nylon Substances 0.000 claims description 6
- 229920001778 nylon Polymers 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000012298 atmosphere Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 14
- 238000003825 pressing Methods 0.000 abstract description 4
- 238000003756 stirring Methods 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 35
- 238000009413 insulation Methods 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052809 inorganic oxide Inorganic materials 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 238000007747 plating Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
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- 150000003839 salts Chemical class 0.000 description 3
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- 239000011247 coating layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
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- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
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- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
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- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
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- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
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- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/127—Encapsulating or impregnating
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2207/00—Compositions specially applicable for the manufacture of vitreous enamels
- C03C2207/02—Compositions specially applicable for the manufacture of vitreous enamels containing ingredients for securing a good bond between the vitrified enamel and the metal
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
Definitions
- the invention relates to a preparation process of a power inductor, in particular to a metal matrix composite wire, a power inductor and a preparation method thereof.
- the high temperature resistant insulated wires are generally in the form of an inorganic oxide coating, and a mesoporous inorganic oxide layer is formed on the surface of the conductor.
- a mesoporous inorganic oxide layer is formed on the surface of the conductor.
- the manufacturing cost of covering the surface of the conductor with the mesoporous inorganic oxide layer is very expensive, and the insulated wire covering the mesoporous inorganic oxide layer has a mesoporous shape, and the insulating withstand voltage capability of the inductor is not obtained after the power inductor is prepared.
- there are also insulated conductor surfaces coated with organic materials but the power inductors produced by such wires also have the problem of low insulation withstand voltage.
- it is coated with an inorganic oxide or a wire coated with an organic material there is currently a disadvantage that it is not resistant to high temperatures.
- the technical problem to be solved by the invention is to make up for the deficiencies of the above prior art, and to provide a metal matrix composite wire, a power inductor and a preparation method thereof, and the weather resistance and insulation withstand voltage of the inductor made of the composite wire are good. It is also resistant to high temperatures and has good electrical properties.
- a method for preparing a metal matrix composite wire comprises the steps of: 1) preparing a metal inner core; 2) disposing a glass resin mixture: borosilicate glass powder having a particle diameter of 300 nm to 2.5 ⁇ m and a sintering temperature of 600 to 900 ° C; The solvent is premixed and stirred uniformly, and then the dispersant is added and the resin having a decomposition temperature of 300 to 500 ° C is stirred and uniformly mixed; wherein the resin is a resin solution having a solid content of 10 to 30%, the borosilicate glass powder and the resin The mass ratio is 1:10 to 2:10; the dispersing agent accounts for 0.1% to 0.5% by mass of the glass resin mixture; 3) the self-adhesive resin is dissolved in a solvent to be a self-adhesive resin solution; Applying the glass resin mixture uniformly on the surface of the metal inner core, and then coating the self-adhesive resin solution on the surface of the glass resin mixture, drying at 80 to
- the molecular weight of the resin is from 5,000 to 50,000.
- the resin is nylon.
- the borosilicate glass powder has a particle diameter of 500 nm to 1 ⁇ m.
- the self-adhesive resin is nylon.
- the metal inner core is a nickel-plated copper wire.
- a metal matrix composite wire produced according to the preparation method as described above is described.
- a method for preparing a power inductor includes the following steps: 1) preparing a metal matrix composite wire according to the preparation method as described above; 2) winding the metal matrix composite wire into a coil of a set shape number, and inserting the mold into the mold Filling the cavity with magnetic powder, pressing the coil and the magnetic powder into a single body to form an inductance by pressure; 3) sintering at a temperature of 600 to 900 ° C to decompose the self-adhesive resin in the coil, in the coil
- the glass resin mixture is sintered into a glass layer; 4) grinding and polishing the metal matrix composite wire exposed at both ends of the magnet of the inductor, removing the glass layer in the coil to expose the inner metal core; 5) in the inductor A terminal electrode is formed on the metal core exposed at both ends of the magnet, and finally a power inductor is obtained.
- sintering is performed in an atmosphere having an oxygen content of 15% or less.
- the preparation method of the metal matrix composite wire of the invention comprises the steps of preparing a metal inner core, coating a specific glass resin mixture and a self-adhesive resin solution, and drying, etc., so that the obtained metal matrix composite wire, the metal inner core
- the surface is coated with a glass resin mixture and a self-adhesive resin.
- the composite wire is first pressed with the magnetic powder, and then sintered at 600 to 900 ° C.
- the self-adhesive resin is decomposed during the sintering process, and the glass resin mixture is sintered into a glass layer.
- the standard salt spray is 8H or more and the withstand voltage is 100V or more, so the weather resistance and insulation withstand voltage of the obtained power inductor are good.
- the glass layer is sintered at 600 to 900 ° C, so the power inductor can withstand high temperatures.
- the pressure can be tolerated during the pressing process, and there is no need to worry about the resin mixture in the composite wire and the damage of the self-adhesive resin, so the magnet density of the power inductor can be prepared higher.
- the magnetic permeability and saturation flux are also higher, so that the electrical performance of the power inductor is better.
- FIG. 1 is a schematic structural view of a composite wire prepared in a specific embodiment of the present invention.
- FIG. 2 is a flow chart of a method for preparing a power inductor according to an embodiment of the present invention
- FIG. 3 is a schematic cross-sectional view of a power inductor produced in an embodiment of the present invention.
- FIG. 4 is a partially enlarged schematic view of a power inductor produced in an embodiment of the present invention.
- a method for preparing a metal matrix composite wire is provided to overcome the problem that the conventional insulated wire cannot be applied to the manufacture of a magnetic component due to defects such as poor wrapability, poor weather resistance, high cost, and high temperature resistance.
- the method for preparing a composite wire of the present embodiment includes the following steps:
- the metal inner core may be a silver wire, an aluminum wire, a nickel-plated copper wire, preferably a nickel-plated copper wire.
- the cost and tensile strength of the copper wire are ideal, and the cost performance is the highest.
- the surface nickel plating layer has the characteristics of high temperature in the air and high wear resistance, and can protect the copper wire body in the subsequent high temperature treatment. When the copper wire is plated with nickel, plating or plating may be used, and the thickness of the nickel plating layer is controlled to be 1/10 to 3/10 of the wire diameter of the copper wire.
- the disposed glass resin mixture is the main component of the glass layer formed after subsequent sintering, which is a key factor affecting the performance of the subsequent process and the obtained product.
- the glass powder is a B and Si glass powder having sintering characteristics, and is mixed with a resin having a decomposition temperature of 300 to 500 ° C to prepare a glass resin mixture, which facilitates subsequent coating and can control the coating thickness to be thin.
- the particle size of the glass powder is in the range of 300 nm to 2.5 ⁇ m, and the agglomeration does not occur, and the compatibility with the resin, the dispersion effect is good, and the uniformity of coating is also higher.
- the glass frit is selected from glass frits having a particle size in the range of 500 nm to 1 ⁇ m, so that in the formed glass resin mixture, the dispersibility of the glass frit in the resin is better, and the coating is easier to coat uniformly.
- the glass powder can be sintered well to form a glass layer, and the resin is decomposed and volatilized.
- the molecular weight of the resin is from 5,000 to 50,000, so that the disposed resin mixture is more coatable and has high coating adhesion.
- nylon having a molecular weight of 5,000 to 50,000 may be selected, and the cost and the bonding property are both good.
- the self-adhesive resin is made of nylon, which has lower cost and better effect.
- the thickness of the resin on the surface of the metal inner core after coating is 1 to 2 ⁇ m.
- step 4) until the thickness of the coating reaches 2 to 10 ⁇ m.
- the coated glass resin mixture forms a glass layer after subsequent sintering, and the coated self-adhesive resin functions to bond and fix the entire coating layer shape.
- the insulating layer is coated, the thinner the insulating layer, the metal core can select the inner core with a relatively large cross-sectional area, so that the resistance is low, but the thickness is too thin, the insulation withstand voltage value will be low, which is not conducive to the insulation of the inductor.
- the improvement of pressure resistance in summary, the choice of coating thickness of 2 ⁇ 10 ⁇ m can comprehensively ensure the electrical performance of the inductor and the insulation withstand voltage.
- the final required thickness is achieved by multiple coating-drying methods, each coating thickness is controlled at 1 to 2 ⁇ m, the drying temperature is controlled at 80 to 150 ° C, and the glass resin layer wire is subsequently passed through 600 to After sintering at 900 ° C, a dense glass layer is formed on the surface of the nickel-plated copper wire, and the thickness is 2 to 10 ⁇ m.
- the formed glass layer has high weather resistance and insulation withstand voltage, and is respectively standard salt spray of 8H or more and withstand voltage of 100V or more.
- the structural schematic diagram of the above-mentioned metal matrix composite wire is as shown in FIG. 1.
- the metal matrix composite wire includes a metal inner core (copper 1 and nickel plating layer 2), a glass resin mixture 3 and a self-adhesive resin layer 4.
- the metal matrix composite wire can be used to prepare magnetic components.
- a flow chart for preparing a power inductor using a metal substrate includes the following steps: First, the composite wire of the present embodiment is wound into a coil of a predetermined number of turns. Next, the coil is placed in a cavity, filled with a metal soft magnetic powder, and the magnetic powder and the coil are pressed into one body by pressure. Then, it is sintered at a high temperature of 600 to 900 ° C to decompose the self-adhesive resin in the coil, and the glass resin mixture is sintered into a glass layer. The portion of the coil that leaks out of the magnet is then polished by grinding to remove the glass layer in the coil to expose the inner metal core. Finally, the terminal electrodes are formed by the process of silver plating and electroplating to finally form a surface mount power inductor.
- FIG. 3 it is a schematic cross-sectional view of the produced power inductor.
- the inductor includes a coil 100 sintered by the above-described metal matrix composite wire, a magnet 200 pressed from a metal soft magnetic powder, and a terminal electrode 300.
- Fig. 4 is a partially enlarged schematic view showing a broken line portion of Fig. 3.
- the composite wire is wound into a coil, and the self-adhesive layer resin in the composite wire is carbonized and oxidized after being sintered at a high temperature of 600 to 900 ° C to form a gas.
- the glass resin layer in the composite wire is sintered at a high temperature of 600 to 900 ° C to form a glass layer 102 having a main component of B and Si.
- 101 denotes a metal inner core in a composite wire. Since the glass layer 102 has high weather resistance and insulation properties, the coil layers are interposed. (between two adjacent metal cores 101) has a high insulation withstand voltage.
- the power inductor of this embodiment overcomes the traditional "integrated inductor", the contradiction between electrical performance and withstand voltage.
- the electrical performance of the "integrated inductor” is mainly determined by the magnet 200. Under the same material, the track rate of the magnet 200, the saturation flux is positively correlated with the density of the magnet, and the method of increasing the density during the preparation process is to increase the molding pressure.
- the traditional coil adopts the polyurethane enameled wire, which does not tolerate the high molding pressure. The extrusion process, the paint film is very easy to be broken, and finally the resulting insulation in the inductor has low insulation withstand voltage and even short circuit. The inductance of the inductor is low.
- the composite wire coated with the glass resin is used to prepare the power inductor, first pressing and then sintering, and the state of the glass resin layer at different stages is skillfully applied.
- it is a glass resin and a self-adhesive resin, which can withstand a large pressure without worrying about the breakage of the resin mixture and the self-adhesive resin. Therefore, the magnet density of the power inductor can be pressed and prepared higher, and the magnetic permeability and saturation flux are also Both are high, so the electrical performance of the power inductor is better.
- the glass resin mixture After sintering at a high temperature of 600 to 900 ° C, the glass resin mixture is sintered to form a glass layer having high weather resistance and pressure resistance characteristics, and insulation between the coil layers is formed by the glass layer, so that the insulation performance is good.
- the coil in the inductor is sintered at 600-900 ° C, and it has high temperature resistance, so that it can be completed by the process of simple, low-cost spot welding, silver burning process, and application. In a high temperature environment.
- the novel power inductor applying the specific embodiment overcomes the contradiction between the conventional molding density and the withstand voltage, has higher electrical performance, and has higher insulation withstand voltage and high temperature resistance.
- the sintering is carried out in an atmosphere having an oxygen content of 15% or less, so that the metal substrate, such as a nickel-plated copper wire, can be prevented from being oxidized during the sintering of the glass resin layer to ensure the metal matrix in the coil in the inductor. Part of the conductivity.
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Abstract
一种金属基体复合导线、功率电感的制备方法。金属基体复合导线的制备方法包括:1)准备金属内芯;2)配置玻璃树脂混合物:将硼硅玻璃粉和溶剂预混合搅拌均匀,加入分散剂和分解温度为300~500℃的树脂搅拌混合均匀;3)将自粘性树脂溶于溶剂中配置成树脂溶液;4)将玻璃树脂混合物均匀涂覆在金属内芯的表面,然后将自粘性树脂溶液涂覆在所述玻璃树脂混合物的表面,在80~150℃下烘干;5)重复步骤4),直至涂覆的厚度达到2~10μm。利用上述复合导线制备,之后与磁粉压制成一体形成电感;在600~900℃的温度下烧结;对电感的磁体两端露出的复合导线进行研磨抛光,最终制得功率电感。
Description
本发明涉及功率电感的制备工艺,特别是涉及一种金属基体复合导线、功率电感及其制备方法。
目前耐高温的绝缘导线一般都是采用无机氧化物包覆的形式,在导体表面形成介孔无机氧化层。一方面,如果无机氧化层包覆过于致密,由于无机氧化层的脆性,绕制过程中会造成无机包覆层的脱落。另一方面,如果无机氧化层包覆不致密,耐潮、耐候性会较差。此外,在导体表面包覆介孔无机氧化层的制造成本是非常昂贵的,而且包覆介孔无机氧化层的绝缘导线,由于存在介孔,制备成功率电感后,电感的绝缘耐压能力不会很高,一般在50V左右;耐候性方面也较差,一般盐雾试验4H后,介孔中铜线就会存在明显腐蚀。目前,也有绝缘导线表面包覆有机物材料的,但这种导线制得的功率电感同样存在绝缘耐压低的问题。而且无论是包覆无机氧化物还是包覆有机物材料的导线,目前均存在不耐高温的缺点。
【发明内容】
本发明所要解决的技术问题是:弥补上述现有技术的不足,提出一种金属基体复合导线、功率电感及其制备方法,复合导线制成的电感的耐候性、绝缘耐压能力均较好,且耐高温,电气性能也较好。
本发明的技术问题通过以下的技术方案予以解决:
一种金属基体复合导线的制备方法,包括以下步骤:1)准备金属内芯;2)配置玻璃树脂混合物:将粒径为300nm~2.5μm、烧结温度为600~900℃的硼硅玻璃粉和溶剂预混合搅拌均匀,然后加入分散剂和分解温度为300~500℃的树脂搅拌混合均匀;其中,所述树脂为10~30%固含量的树脂溶液,所述硼硅玻璃粉与所述树脂的质量比为1:10~2:10;所述分散剂占所述玻璃树脂混合物的质量分数为0.1.~0.5%;3)将自粘性树脂溶于溶剂中配置成自粘性树脂溶液;4)将所述玻璃树脂混合物均匀涂覆在所述金属内芯的表面,然后将所述自粘性树脂溶液涂覆在所述玻璃树脂混合物的表面,在80~150℃下烘干,确保涂覆后所述金属内芯表面的树脂厚度在1~2μm;5)重复步骤4),
直至涂覆的厚度达到2~10μm。
优选地,所述步骤2)中,树脂的分子量在5000~50000。
优选地,所述树脂为尼龙。
优选地,所述步骤2)中,硼硅玻璃粉的粒径在500nm~1μm。
优选地,所述步骤3)中,自粘性树脂为尼龙。
优选地,所述步骤1)中,金属内芯为镀镍铜线。
一种根据如上所述的制备方法制得的金属基体复合导线。
一种功率电感的制备方法,包括以下步骤:1)根据如上所述的制备方法制备金属基体复合导线;2)将所述金属基体复合导线绕制成设定形状圈数的线圈,放入模腔中,填入磁粉,通过压力将所述线圈和所述磁粉压制成一体形成电感;3)在600~900℃的温度下烧结,使所述线圈中的自粘性树脂分解,所述线圈中的玻璃树脂混合物烧结成玻璃层;4)对电感的磁体两端露出的所述金属基体复合导线进行研磨抛光,去掉所述线圈中的玻璃层,露出内部的金属内芯;5)在电感的磁体两端露出的金属内芯上形成端电极,最终制得功率电感。
优选地,所述步骤3)中,在氧气含量为15%以内的气氛中进行烧结。
一种根据如上所述的制备方法制得的功率电感。
本发明与现有技术对比的有益效果是:
本发明的金属基体复合导线的制备方法,包含制备金属内芯,涂覆特定的玻璃树脂混合物和自粘性树脂溶液,以及烘干等步骤,使得制得的金属基体复合导线中,金属内芯的表面包覆的是玻璃树脂混合物和自粘性树脂。该复合导线用于制备功率电感时,先是复合导线与磁粉进行压制,然后进行600~900℃的烧结,烧结过程中自粘性树脂分解,玻璃树脂混合物烧结成玻璃层。由于玻璃层具有较高的耐候性和绝缘耐压能力,分别为标准盐雾8H以上和耐压100V以上,因此制得的功率电感的耐候性、绝缘耐压能力均较好。玻璃层是经600~900℃烧结而成,因此功率电感可耐高温。而且由于制备过程中先压制,后烧结形成玻璃层,因此压制过程中可耐受较大压力,不必担心复合导线中树脂混合物,自粘性树脂的破损,因此功率电感的磁体密度可制备得较高,则磁导率和饱和磁通也均较高,从而功率电感的电气性能较好。
图1是本发明具体实施方式中制得的复合导线的结构示意图;
图2是本发明具体实施方式的功率电感的制备方法的流程图;
图3是本发明具体实施方式中制得的功率电感的截面示意图;
图4是本发明具体实施方式中制得的功率电感的局部放大示意图。
下面结合具体实施方式并对照附图对本发明做进一步详细说明。
本具体实施方式中提供一种金属基体复合导线的制备方法,以克服传统的绝缘导线由于可绕性差、耐候性差、成本高、不耐高温等缺点而无法应用于磁性元器件制造的难题。本具体实施方式的复合导线的制备方法包括以下步骤:
1)准备金属内芯。金属内芯可为采用银线、铝线、镀镍铜线,优选为镀镍铜线。铜线的成本和拉伸强度较理想,性价比最高,表面镀镍层具有空气中温度性高的特点、且耐磨性高,可在后续需要高温处理时起到保护铜线本体的作用。铜线镀镍时可采用电镀或化镀方式,镀镍层的厚度控制在铜线线径的1/10~3/10。
2)配置玻璃树脂混合物:将粒径为300nm~2.5μm、烧结温度为600~900℃的硼硅玻璃粉和溶剂预混合搅拌均匀,然后加入分散剂和分解温度为300~500℃的树脂搅拌混合均匀;其中,所述树脂为10~30%固含量的树脂溶液,所述硼硅玻璃粉与所述树脂的质量比为1:10~2:10;所述分散剂占所述玻璃树脂混合物的质量分数为0.1.~0.5%。
该步骤中,配置的玻璃树脂混合物是后续烧结后形成玻璃层的主体成分,是影响后续工艺以及制得的产品性能的关键因素。玻璃粉为具备烧结特性的B、Si玻璃粉,与分解温度为300~500℃树脂混合后制成玻璃树脂混合物,便于后续涂覆,且可控制涂覆厚度较薄。玻璃粉粒度在300nm~2.5μm的范围,既不会发生团聚,也能与树脂的相容性、分散效果较好,涂覆的均匀度也越高。优选地,玻璃粉选择粒度在500nm~1μm范围内的玻璃粉,这样,形成的玻璃树脂混合物中,玻璃粉在树脂中的分散性较好,涂覆时较易涂覆均匀。该配方下的混合物,在后续制备功率电感过程中进行烧结时,玻璃粉可较好地烧结形成玻璃层,树脂则分解挥发掉。
优选地,树脂的分子量在5000~50000,从而配置的树脂混合物更具可涂性,且涂层附着力高。进一步优选地,可选用分子量在5000~50000的尼龙,成本和粘结性能均较好。
3)将自粘性树脂溶于溶剂中配置成自粘性树脂溶液。自粘树脂材质为尼龙,成本较低,效果也较好。
4)将所述玻璃树脂混合物均匀涂覆在所述金属内芯的表面,然后将所述自粘性树脂溶液涂覆在所述玻璃树脂混合物的表面,在80~150℃下烘干,确保涂覆后所述金属内芯表面的树脂厚度在1~2μm。
5)重复步骤4),直至涂覆的厚度达到2~10μm。
上述步骤中,涂覆的玻璃树脂混合物在后续烧结后形成玻璃层,涂覆的自粘性树脂发挥粘结固定整个涂覆层形状的作用。涂覆绝缘层时,绝缘层越薄,则金属内芯就可以选择截面积相对较大的内芯,从而电阻低,但厚度太薄,则绝缘耐压值会较低,不利于电感的绝缘耐压能力的提高,综上,选择涂覆厚度在2~10μm可综合确保电感的电气性能和绝缘耐压能力。本具体实施方式中,通过多次涂覆-烘干的方式达到最终要求厚度,每次涂覆厚度控制在1~2μm,烘干温度控制在80~150℃,玻璃树脂层导线后续通过600~900℃烧结后,在镀镍铜线表面形成致密的玻璃层,厚度2~10μm。通过多次涂覆-烘干的方式,可有助于确保涂覆的均匀性和涂覆厚度的可控性。烧结后,形成的玻璃层具有较高的耐候性和绝缘耐压能力,分别为标准盐雾8H以上和耐压100V以上。
上述制得金属基体复合导线的结构示意图如图1所示,金属基体复合导线包括金属内芯(铜1和镀镍层2),玻璃树脂混合物3和自粘性树脂层4。该金属基体复合导线可用于制备磁性元器件。
如图2所示,为采用金属基体制备功率电感的流程图,包括以下步骤:首先将本具体实施方式的复合导线绕制规定形状圈数的线圈。接着,将线圈放入模腔中,填入金属软磁粉,通过压力将磁粉和线圈压制成一体。然后,在600~900℃的高温烧结,使线圈中的自粘性树脂分解,玻璃树脂混合物烧结成玻璃层。再通过研磨将线圈漏出磁体的部分进行抛光,去掉所述线圈中的玻璃层,露出内部的金属内芯。最后,通过端银、电镀的工艺形成端电极,最终形成表面贴装的功率电感。
如图3所示,为制得的功率电感的截面示意图。电感包括由上述金属基体复合导线绕制后烧结而成的线圈100、由金属软磁粉压制而成的磁体200以及端电极300。图4所示为图3中虚线部分的局部放大示意图。复合导线绕制成线圈,复合导线中的自粘层树脂在600~900℃高温烧结过程经过碳化、氧化后分解形成气体排出。复合导线中的玻璃树脂层经过600~900℃的高温烧结形成玻璃层102,主成分为B、Si。图中101表示复合导线中的金属内芯。由于玻璃层102具有较高的耐候、绝缘特性,则线圈层间
(相邻两个金属内芯101之间)具有较高的绝缘耐压。
本具体实施方式的功率电感克服了传统“一体成型电感”,电气性能与耐压的矛盾。“一体成型电感”的电气性能主要是由磁体200决定,同种材质下,磁体200的磁道率,饱和磁通与磁体的密度成正相关,制备过程中提升密度的方法是成型压力的提高。而传统线圈采用的是聚氨脂漆包线,不耐受较高的成型压力,挤压过程,漆膜非常容易破碎,最终导致制得的电感中线圈层间绝缘耐压低、甚至短路,制得的电感的绝缘耐压性能较低。而本具体实施方式中,采用玻璃树脂包覆的复合导线,制备功率电感时,先压制,后烧结,巧妙的应用了玻璃树脂层不同阶段的状态。压制时为玻璃树脂、自粘性树脂,可耐受较大压力,不必担心树脂混合物、自粘性树脂的破损,因此功率电感的磁体密度可压制制备得较高,则磁导率和饱和磁通也均较高,从而功率电感的电气性能较好。经过600~900℃高温烧结后,玻璃树脂混合物烧结形成具有高耐候、耐压特性的玻璃层,线圈层间通过该玻璃层形成绝缘,则绝缘性能较好。电感中的线圈经过600~900℃烧结而成,则本身具有耐高温性,从而后续在制作端电极时可通过工艺简便、成本较低的点焊,烧银工艺完成,且应用时也可应用到高温环境中。综上,应用本具体实施方式的新型功率电感克服了传统成型密度和耐压的矛盾,具有更高电气性能,且具有更高绝缘耐压,耐高温。
优选地,烧结时,在氧气含量为15%以内的气氛中进行,这样,可避免金属基体,例如镀镍铜线等,在玻璃树脂层烧结过程被氧化,确保电感中的线圈内的金属基体部分的导电性。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明,不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说,在不脱离本发明构思的前提下做出若干替代或明显变型,而且性能或用途相同,都应当视为属于本发明的保护范围。
Claims (10)
- 一种金属基体复合导线的制备方法,其特征在于:包括以下步骤:1)准备金属内芯;2)配置玻璃树脂混合物:将粒径为300nm~2.5μm、烧结温度为600~900℃的硼硅玻璃粉和溶剂预混合搅拌均匀,然后加入分散剂和分解温度为300~500℃的树脂搅拌混合均匀;其中,所述树脂为10~30%固含量的树脂溶液,所述硼硅玻璃粉与所述树脂的质量比为1:10~2:10;所述分散剂占所述玻璃树脂混合物的质量分数为0.1.~0.5%;3)将自粘性树脂溶于溶剂中配置成自粘性树脂溶液;4)将所述玻璃树脂混合物均匀涂覆在所述金属内芯的表面,然后将所述自粘性树脂溶液涂覆在所述玻璃树脂混合物的表面,在80~150℃下烘干,确保涂覆后所述金属内芯表面的树脂厚度在1~2μm;5)重复步骤4),直至涂覆的厚度达到2~10μm。
- 根据权利要求1所述的金属基体复合导线的制备方法,其特征在于:所述步骤2)中,树脂的分子量在5000~50000。
- 根据权利要求2所述的金属基体复合导线的制备方法,其特征在于:所述树脂为尼龙。
- 根据权利要求1所述的金属基体复合导线的制备方法,其特征在于:所述步骤2)中,硼硅玻璃粉的粒径在500nm~1μm。
- 根据权利要求1所述的金属基体复合导线的制备方法,其特征在于:所述步骤3)中,自粘性树脂为尼龙。
- 根据权利要求1所述的金属基体复合导线的制备方法,其特征在于:所述步骤1)中,金属内芯为镀镍铜线。
- 一种根据权利要求1~5任一项所述的制备方法制得的金属基体复合导线。
- 一种功率电感的制备方法,其特征在于:包括以下步骤:1)根据权利要求1所述的制备方法制备金属基体复合导线;2)将所述金属基体复合导线绕制成设定形状圈数的线圈,放入模腔中,填入磁粉,通过压力将所述线圈和所述磁粉压制成一体形成电感;3)在600~900℃的温度下烧结,使所述线圈中的自粘性树脂分解,所述线圈中的玻璃树脂混合物烧结成玻璃层;4)对电感的磁体两端露出的所述金属基体复合导线进行研磨抛光,去掉所述线圈中的玻璃层,露出内部的金属内芯;5)在电感的磁体两端露出的金属内芯上形成端电极,最终制得功率电感。
- 根据权利要求7所述的功率电感的制备方法,其特征在于:所述步骤3)中,在氧气含量为15%以内的气氛中进行烧结。
- 一种根据权利要求8~9任一项所述的制备方法制得的功率电感。
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