CN102341427B - 绝缘体用的铸模树脂体系 - Google Patents
绝缘体用的铸模树脂体系 Download PDFInfo
- Publication number
- CN102341427B CN102341427B CN201080010189.2A CN201080010189A CN102341427B CN 102341427 B CN102341427 B CN 102341427B CN 201080010189 A CN201080010189 A CN 201080010189A CN 102341427 B CN102341427 B CN 102341427B
- Authority
- CN
- China
- Prior art keywords
- solid resin
- bisphenol
- resin
- raw material
- resin system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Abstract
本发明涉及开关装置用的铸模树脂,其包含双酚F液体环氧树脂。与基于纯双酚A的铸模树脂相比,本发明铸模树脂的性能得到了显著的改进,尤其是在玻璃化转变温度和抗冲击性方面。
Description
本发明涉及开关装置用的铸模树脂体系的领域。
在电开关装置中,特别是在紧凑设计的情况中,绝缘材料起重要作用。
本发明中特别使用所谓的固体树脂。它们通常通过所谓的进展工艺(Advancementprozess)进行制备,其中液体树脂和适当的起始成分(通常为双酚A)以及催化剂进行反应。由于该过程是放热进行的,所以所产生的基于固体树脂的体系在固化过程中有利地进行放热。另外,由于链延伸,该体系比液体树脂体系更具有柔性。
在这些树脂中,高玻璃化转变温度是有利的,但是同时经常也对有利的机械性能例如低裂化倾向和高爆裂值有着很高的要求。
因此本发明的目的是,作为已有解决方法的备选,提供一种开关装置用的固体树脂体系,其中显示了提高的玻璃化转变温度以及同时具有好的或甚至改进的其他性能。
该目的通过根据本申请的权利要求1的固体树脂体系而实现。相应地,本发明提供了用于开关装置中的绝缘材料的固体树脂体系,其由包含基于双酚A的固体树脂和基于双酚F的液体树脂的原料形成。
已意外发现了在使用基于双酚F的液体环氧树脂的情况中,树脂体系的一些机械性能和/或电性能得到了极大的改进。根据本申请,这些包括
-较好的爆裂值(Berstwerte)
-较好的温度交变行为(Temperaturwechselverhalten)
-提高的玻璃化转变温度。
在本发明的上下文中,术语“基于X”特别地包括和/或涵盖使用化合物X作为起始成分,特别是主要成分。可以使用所有其他在现有技术中已知用作添加剂的物质。
在本发明的上下文中,“双酚F”理解为化合物4,4’-二羟基-二苯基甲烷,其具有以下结构:
在本发明的上下文中,“双酚A”理解为化合物2,2’-二(4-羟基苯基)丙烷,其具有以下结构:
在本发明的上下文中,术语“固体树脂”、“液体树脂”和“固体树脂体系”特别地包括和/或涵盖由包含表氯醇(或其他适当的起始环氧化物成分)和双酚类的原料形成的环氧树脂。
在本发明的上下文中,术语“开关装置”特别地包括和/或涵盖用于低压、中压和高压的装置。
在本发明的上下文中,术语“由(一种或多种)原料成分形成”特别地表示和/或涵盖固体树脂体系由这些(一种或多种)成分制备。
在本发明化合物的优选实施方案中,固化前的固体树脂体系具有的环氧值(DIN ISO 16945)是≥0.2至≤0.55,优选≥0.35至≤0.50,更优选≥0.4至≤0.45。已发现了这在实践中是有利的。
优选地,基于双酚F的液体树脂在固体树脂体系中的含量(以重量/全部树脂重量进行测量)为≥5%至≤60%,更优选为≥10%至≤50%。
在本发明的一优选实施方案中,基于双酚F的液体树脂具有的环氧值(DIN ISO 16945)是≥0.4至≤0.63,优选≥0.45至≤0.6,更优选≥0.5至≤0.59。已发现了这在实践中是有利的。
优选地,在固化之前,双酚F液体树脂和基于双酚A的固体树脂进行混合(其中如果适当的话,通过熔融或其他合适的方法充分混合)。
在本化合物的一优选实施方案中,基于双酚A的固体树脂具有的环氧值(DIN ISO 16945)是≥0.2至≤0.3,优选≥0.22至≤0.28,更优选≥0.24至≤0.26。已发现了这在实践中是有利的。
在本发明的一优选实施方案中,用于形成固体树脂体系的原料包含固化剂成分。
固化剂成分优选选自邻苯二甲酸酐、四氢邻苯二甲酸酐、甲基纳迪克酸酐(Methylnadicanhydrid)、氢化甲基纳迪克酸酐、甲基六氢化邻苯二甲酸酐、六氢化邻苯二甲酸酐、甲基四氢邻苯二甲酸酐以及它们的衍生物和混合物。特别优选的是邻苯二甲酸酐和四氢邻苯二甲酸酐的混合物。
在本发明的一优选实施方案中,用于形成固体树脂体系的原料包含加速剂成分。
在本发明的一更优选实施方案中,加速剂成分选自1-甲基咪唑、1-乙基咪唑、1-丙基咪唑、1-异丙基咪唑、1,2-二甲基咪唑、2-乙基-4-乙基咪唑、咪唑、1-苄基-2-苯基咪唑、1-乙烯基咪唑、2-甲基咪唑、2-十七基咪唑以及它们的混合物。
在本发明的一优选实施方案中,用于形成固体树脂体系的原料包含填料。
该填料优选选自SiO2、白云石、Al2O3、CaCO3、TiO2以及它们的衍生物和混合物。
特别优选Al2O3,特别是d50为≥2μm至≤6μm的Al2O3。已发现这在实践中是有利的,因为抗爆裂性常常可以因此进一步得到提高。更优选≥2.5μm至≤5μm,更优选≥3μm至≤3.5μm。
在本发明的优选实施方案中,固体树脂体系中的填料的含量(以重量/全部混合物重量计)为≥50%至≤75%。优选≥60%至≤70%,更优选≥65%至≤68%。
在本发明的一优选实施方案中,固体树脂体系在固化过程中进行制备,其中该固化过程包括于≥140℃、优选≥150℃的固化步骤,以及固化时间为≥12小时、优选≥14小时以及最优选≥16小时。
在本发明的一优选实施方案中,固体树脂体系通过包括以下步骤的方法进行制备:
a)首先加入基于双酚A的固体树脂
b)将该固体树脂与基于双酚F的液体树脂,任选通过加热或其他适当的方法进行混合
c)固化该固体树脂-液体树脂混合物,任选加入至少一种固化剂成分、加速剂成分和/或填料,其中进行至少一个在≥140℃、优选≥150℃进行的固化步骤,以及固化时间为≥12小时、优选≥14小时以及最优选≥16小时。
浇注优选在减压条件下进行。
本发明还涉及绝缘部件,其包括根据本发明的绝缘树脂。该绝缘部件优选为GIL装置的绝缘部件。
本发明还涉及包含用作原料的基于双酚A的固体树脂和基于双酚F的液体树脂的固体树脂用作开关装置的绝缘体系的用途。
上述的、所要求保护的和在实施例中描述的本发明要素在它们的尺寸、形状结构、材料选择和技术设计方面不存在特别的限制条件,因此可以不受限制地选用使用领域中已知的选择标准。
本发明主题的其他细节、特征和优势在从属权利要求和下文实施例的描述中清楚可见。
实施例I
参考本发明实施例I仅以示例性的和非限制性的方式描述本发明。
在此,首先制备双酚A固体树脂和双酚F液体树脂的混合物,其中通过混合环氧值为0.26的双酚A固体树脂与环氧值为0.58的双酚F液体树脂,直到产生环氧值为0.42的树脂。
接着,将该树脂与根据以下所列的其他成分进行混合并固化:
所得固体体系在130℃固化3小时,然后最终在150℃时固化16小时。
另外,制备了(非本发明的)对比树脂体系。
对比例I:
在对比例I中,双酚F液体树脂由双酚A液体树脂替代。在制备条件上和实施例I的制备条件相同。
将各树脂混合物浇铸成测试棒,即绝缘体。在测试中,首先测定了抗拉强度[ISO 527-4]、马顿斯温度(Martenstemperatur)以及热循环后的爆裂值(用水加压)。
树脂体系 | 抗拉强度 | 马顿斯温度(℃) | 爆裂值 |
对比例I | 70N/mm2 | 143 | 未达到目标值 |
实施例I | 90N/mm2 | 133 | 达到目标值 |
由此,可以看出本发明的固体树脂体系的有利性能。
Claims (12)
1.开关装置中绝缘材料用的由包含下列的原料形成的固体树脂体系,其中所述原料包含基于双酚A的固体树脂和基于双酚F的液体树脂作为仅有的树脂,其中所述树脂中的双酚F液体树脂的含量为≥5%至≤60%,以重量/全部树脂的重量测量。
2.根据权利要求1的固体树脂体系,其中所述双酚F液体树脂的环氧值根据DIN ISO16945是≥0.4至≤0.63。
4.根据权利要求3所述的固体树脂体系,其中所述加速剂成分选自1-甲基咪唑、1-乙基咪唑、1-丙基咪唑、1-异丙基咪唑、2-甲基咪唑、1,2-二甲基咪唑、2-乙基-4-乙基咪唑、咪唑、1-苄基-2-苯基咪唑、1-乙烯基咪唑、2-十七基咪唑、2-苯基咪唑以及它们的混合物。
5.根据权利要求1所述的固体树脂体系,其中所述原料包含固化剂成分,其选自邻苯二甲酸酐、四氢邻苯二甲酸酐、甲基纳迪克酸酐、氢化甲基纳迪克酸酐、甲基六氢邻苯二甲酸酐、六氢邻苯二甲酸酐、甲基四氢邻苯二甲酸酐以及它们的衍生物和混合物。
6.根据权利要求1所述的固体树脂体系,其中所述原料包含填料,其选自SiO2、白云石、Al2O3、CaCO3、TiO2以及它们的混合物。
7.根据权利要求6所述的固体树脂体系,其中所述原料包含d50为≥2μm至≤6μm的Al2O3。
8.由包含基于双酚A的固体树脂和基于双酚F的液体树脂作为仅有的树脂的原料制成的固体树脂体系在电开关装置中用作绝缘材料的用途。
9.制备权利要求1-7中任一项的固体树脂体系的方法:
a)首先加入基于双酚A的固体树脂
b)将该固体树脂与基于双酚F的液体树脂,任选通过加热或其他适当的方法进行混合
c)固化该固体树脂-液体树脂混合物,任选加入至少一种固化剂成分、加速剂成分和/或填料,其中进行至少一个在≥140℃进行的固化步骤,以及固化时间为≥12小时,
其中基于双酚A的固体树脂和基于双酚F的液体树脂为仅有的树脂。
10.根据权利要求9所述的方法,其中所述固化步骤在≥150℃进行。
11.根据权利要求9或10所述的方法,其中所述固化时间为≥14小时。
12.根据权利要求11所述的方法,其中所述固化时间为≥16小时。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009012195A DE102009012195A1 (de) | 2009-03-06 | 2009-03-06 | Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit |
DE102009012195.1 | 2009-03-06 | ||
PCT/EP2010/052269 WO2010100058A1 (de) | 2009-03-06 | 2010-02-23 | Giessharzsystem für isolierstoffe |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102341427A CN102341427A (zh) | 2012-02-01 |
CN102341427B true CN102341427B (zh) | 2014-06-11 |
Family
ID=42352706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080010189.2A Active CN102341427B (zh) | 2009-03-06 | 2010-02-23 | 绝缘体用的铸模树脂体系 |
Country Status (12)
Country | Link |
---|---|
US (1) | US20120010328A1 (zh) |
EP (1) | EP2403893B1 (zh) |
KR (2) | KR102039409B1 (zh) |
CN (1) | CN102341427B (zh) |
AU (1) | AU2010220423B2 (zh) |
BR (1) | BRPI1009158A2 (zh) |
CA (1) | CA2754346C (zh) |
DE (1) | DE102009012195A1 (zh) |
MX (1) | MX2011008425A (zh) |
RU (1) | RU2523282C2 (zh) |
UA (1) | UA105378C2 (zh) |
WO (1) | WO2010100058A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102532484B (zh) * | 2011-12-14 | 2013-09-18 | 华东理工大学 | 环氧树脂组合物及应用其制备预浸料和复合材料的方法 |
DE102015204885A1 (de) * | 2015-03-18 | 2016-09-22 | Siemens Aktiengesellschaft | Isolationssystem, Verwendungen dazu, sowie elektrische Maschine |
DE102016203867A1 (de) | 2016-03-09 | 2017-09-14 | Siemens Aktiengesellschaft | Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem |
CA3098791A1 (en) | 2018-05-16 | 2019-11-21 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Accelerator composition for the cure of polyfunctional isocyanates with epoxy resins |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2144230A1 (en) * | 1994-03-10 | 1995-09-11 | Roland Moser | Heat-curable epoxy resin systems having a good reactivity/stability ratio |
CN1110977A (zh) * | 1994-03-04 | 1995-11-01 | 三菱电机株式会社 | 成型用环氧树脂组合物和使用它的高电压设备用模压制品及其制法 |
CN101108892A (zh) * | 2006-07-20 | 2008-01-23 | Abb研究有限公司 | 无稀释剂的环氧树脂制剂 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3998983A (en) * | 1975-06-27 | 1976-12-21 | Westinghouse Electric Corporation | Resin rich epoxide-mica flexible high voltage insulation |
JPH04185628A (ja) * | 1990-11-21 | 1992-07-02 | Sumitomo Bakelite Co Ltd | 電気絶縁用エポキシ樹脂液状組成物 |
EP0507271A3 (en) * | 1991-04-03 | 1993-04-21 | The Dow Chemical Company | Epoxy resin compositions for use in electrical laminates |
JP3290295B2 (ja) * | 1994-05-13 | 2002-06-10 | 太陽インキ製造株式会社 | 硬化性樹脂組成物並びに該組成物を用いた多層プリント配線板及びその製造方法 |
EP0787348B1 (en) * | 1994-07-01 | 2003-08-13 | Vantico AG | Epoxy resin casting composition |
US6046257A (en) * | 1995-07-18 | 2000-04-04 | Toray Industries, Inc. | Composition for prepreg comprising epoxy resin, polyamide block copolymer and curing agent |
EP0819723B1 (en) * | 1996-02-02 | 2004-06-02 | Toray Industries, Inc. | Resin compositions for fiber-reinforced composite materials and processes for producing the same, prepregs, fiber-reinforced composite materials, and honeycomb structures |
WO1998001494A1 (fr) * | 1996-07-04 | 1998-01-15 | Tohto Kasei Co., Ltd. | Resine phenolique modifiee contenant un groupe hydroxyle, composition reticulable a base d'une telle resine, produit d'epoxydation de ladite resine modifiee, et composition reticulable a base d'un tel produit |
DE69833865T2 (de) * | 1997-07-24 | 2006-10-05 | Henkel Corp., Rocky Hill | Hitzehärtende harzzusammensetzungen verwendbar als unterfüllungs dichtungsmassen |
US20020006484A1 (en) * | 1998-05-20 | 2002-01-17 | Balasubramaniam Ramalingam | Adhesive and coating formulations for flexible packaging |
JP3442006B2 (ja) * | 1999-08-24 | 2003-09-02 | 日東電工株式会社 | 流延用エポキシ樹脂組成物 |
JP2001170950A (ja) * | 1999-12-15 | 2001-06-26 | Nitto Denko Corp | 複層樹脂板及びその製造方法 |
JP4319332B2 (ja) * | 2000-06-29 | 2009-08-26 | 株式会社東芝 | 電気絶縁材料およびその製造方法 |
JP2004359792A (ja) * | 2003-06-04 | 2004-12-24 | Murata Mfg Co Ltd | 高圧部品注型用樹脂組成物および高圧部品 |
EP1491566B1 (en) * | 2003-06-16 | 2007-02-28 | ABB Technology Ltd | Curable epoxy resin composition, and process for the production of shaped articles therefrom |
EP1978049B1 (en) * | 2007-04-03 | 2010-02-24 | ABB Research Ltd | Curable Epoxy Resin Composition |
-
2009
- 2009-03-06 DE DE102009012195A patent/DE102009012195A1/de not_active Ceased
-
2010
- 2010-02-23 CN CN201080010189.2A patent/CN102341427B/zh active Active
- 2010-02-23 BR BRPI1009158A patent/BRPI1009158A2/pt not_active IP Right Cessation
- 2010-02-23 US US13/254,864 patent/US20120010328A1/en not_active Abandoned
- 2010-02-23 MX MX2011008425A patent/MX2011008425A/es active IP Right Grant
- 2010-02-23 EP EP10706981.7A patent/EP2403893B1/de active Active
- 2010-02-23 KR KR1020177012042A patent/KR102039409B1/ko active IP Right Grant
- 2010-02-23 WO PCT/EP2010/052269 patent/WO2010100058A1/de active Application Filing
- 2010-02-23 RU RU2011140468/04A patent/RU2523282C2/ru not_active IP Right Cessation
- 2010-02-23 UA UAA201110710A patent/UA105378C2/uk unknown
- 2010-02-23 AU AU2010220423A patent/AU2010220423B2/en not_active Ceased
- 2010-02-23 KR KR1020117020659A patent/KR20110135931A/ko active Application Filing
- 2010-02-23 CA CA2754346A patent/CA2754346C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1110977A (zh) * | 1994-03-04 | 1995-11-01 | 三菱电机株式会社 | 成型用环氧树脂组合物和使用它的高电压设备用模压制品及其制法 |
CA2144230A1 (en) * | 1994-03-10 | 1995-09-11 | Roland Moser | Heat-curable epoxy resin systems having a good reactivity/stability ratio |
CN101108892A (zh) * | 2006-07-20 | 2008-01-23 | Abb研究有限公司 | 无稀释剂的环氧树脂制剂 |
Also Published As
Publication number | Publication date |
---|---|
US20120010328A1 (en) | 2012-01-12 |
RU2523282C2 (ru) | 2014-07-20 |
MX2011008425A (es) | 2011-09-01 |
AU2010220423A1 (en) | 2011-09-08 |
KR20170051541A (ko) | 2017-05-11 |
DE102009012195A1 (de) | 2010-09-09 |
KR20110135931A (ko) | 2011-12-20 |
UA105378C2 (uk) | 2014-05-12 |
WO2010100058A1 (de) | 2010-09-10 |
BRPI1009158A2 (pt) | 2016-03-01 |
CA2754346A1 (en) | 2010-09-10 |
EP2403893B1 (de) | 2018-12-19 |
CA2754346C (en) | 2017-06-06 |
AU2010220423B2 (en) | 2013-04-04 |
RU2011140468A (ru) | 2013-04-20 |
CN102341427A (zh) | 2012-02-01 |
EP2403893A1 (de) | 2012-01-11 |
KR102039409B1 (ko) | 2019-11-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103649160B (zh) | 绝缘制剂 | |
CN102388096B (zh) | 直接重叠注塑 | |
TWI540146B (zh) | 絕緣調配物 | |
CN101663344A (zh) | 可固化环氧树脂组合物 | |
EP2230267A1 (en) | Curable Epoxy Resin Composition | |
CN102341427B (zh) | 绝缘体用的铸模树脂体系 | |
JP6217099B2 (ja) | エポキシ樹脂成形材料、モールドコイルの製造方法及びモールドコイル | |
JP2009203431A (ja) | 注形用エポキシ樹脂組成物および高熱伝導コイル | |
JP6101122B2 (ja) | モールドトランス用エポキシ樹脂組成物、モールドトランスおよびモールドトランスの製造方法 | |
WO2013123648A1 (en) | Curable epoxy composition with milled glass fiber | |
HUE029963T2 (en) | Electro-insulating resin based on isohexide diol diglycyl ether | |
JP2009114222A (ja) | 注形用エポキシ樹脂組成物および電気・電子部品装置 | |
CN105385109A (zh) | 一种环氧树脂组合物及其在制备浸渍线圈中的用途 | |
CN109867909A (zh) | 环氧树脂组合物和包含该组合物的变压器 | |
WO2019175342A1 (en) | Storage stable and curable resin compositions | |
CN102030969B (zh) | 用于现场浇注低压母线的合成树脂组合物 | |
CN105331052A (zh) | 一种环氧树脂组合物 | |
CN104530643B (zh) | 用于浇注核电用中压树脂母线的合成树脂组合物及其制备和使用方法 | |
JP2000086869A (ja) | エポキシ樹脂組成物およびコイル | |
JP2002155193A (ja) | エポキシ樹脂組成物および電気・電子部品装置 | |
JP3949436B2 (ja) | 注形用エポキシ樹脂組成物および電気・電子部品装置 | |
WO2013139390A1 (en) | Curable epoxy resin composition | |
CN108276733A (zh) | 线圈含浸用环氧树脂组合物、线圈产品的制造方法以及点火线圈 | |
CN106433023A (zh) | 制备环氧树脂浇注干式变压器用弹性环氧树脂的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220208 Address after: Munich, Germany Patentee after: Siemens energy Global Ltd. Address before: Munich, Germany Patentee before: SIEMENS AG |