MX2011008425A - Sistema de resina de moldeo para materiales aislantes. - Google Patents

Sistema de resina de moldeo para materiales aislantes.

Info

Publication number
MX2011008425A
MX2011008425A MX2011008425A MX2011008425A MX2011008425A MX 2011008425 A MX2011008425 A MX 2011008425A MX 2011008425 A MX2011008425 A MX 2011008425A MX 2011008425 A MX2011008425 A MX 2011008425A MX 2011008425 A MX2011008425 A MX 2011008425A
Authority
MX
Mexico
Prior art keywords
isolators
resin system
cast resin
bisphenol
casting
Prior art date
Application number
MX2011008425A
Other languages
English (en)
Inventor
Gernot Swiatkowski
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of MX2011008425A publication Critical patent/MX2011008425A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

La invención se refiere a una resina moldeada para interruptores que contiene resina epoxídica líquida de bisfenol F. De esta manera pueden mejorarse considerablemente las propiedades de la resina moldeada con respecto a resinas moldeadas a base de bisfenol A puro, en particular en cuanto a la temperatura de transición vítrea y la estabilidad frente al cambio de temperatura.
MX2011008425A 2009-03-06 2010-02-23 Sistema de resina de moldeo para materiales aislantes. MX2011008425A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009012195A DE102009012195A1 (de) 2009-03-06 2009-03-06 Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit
PCT/EP2010/052269 WO2010100058A1 (de) 2009-03-06 2010-02-23 Giessharzsystem für isolierstoffe

Publications (1)

Publication Number Publication Date
MX2011008425A true MX2011008425A (es) 2011-09-01

Family

ID=42352706

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2011008425A MX2011008425A (es) 2009-03-06 2010-02-23 Sistema de resina de moldeo para materiales aislantes.

Country Status (12)

Country Link
US (1) US20120010328A1 (es)
EP (1) EP2403893B1 (es)
KR (2) KR102039409B1 (es)
CN (1) CN102341427B (es)
AU (1) AU2010220423B2 (es)
BR (1) BRPI1009158A2 (es)
CA (1) CA2754346C (es)
DE (1) DE102009012195A1 (es)
MX (1) MX2011008425A (es)
RU (1) RU2523282C2 (es)
UA (1) UA105378C2 (es)
WO (1) WO2010100058A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102532484B (zh) * 2011-12-14 2013-09-18 华东理工大学 环氧树脂组合物及应用其制备预浸料和复合材料的方法
DE102015204885A1 (de) * 2015-03-18 2016-09-22 Siemens Aktiengesellschaft Isolationssystem, Verwendungen dazu, sowie elektrische Maschine
DE102016203867A1 (de) 2016-03-09 2017-09-14 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
CA3098791A1 (en) 2018-05-16 2019-11-21 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Accelerator composition for the cure of polyfunctional isocyanates with epoxy resins

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3998983A (en) * 1975-06-27 1976-12-21 Westinghouse Electric Corporation Resin rich epoxide-mica flexible high voltage insulation
JPH04185628A (ja) * 1990-11-21 1992-07-02 Sumitomo Bakelite Co Ltd 電気絶縁用エポキシ樹脂液状組成物
EP0507271A3 (en) * 1991-04-03 1993-04-21 The Dow Chemical Company Epoxy resin compositions for use in electrical laminates
JP3359410B2 (ja) * 1994-03-04 2002-12-24 三菱電機株式会社 成形用エポキシ樹脂組成物ならびにそれを用いた高電圧機器用モールド製品およびその製法
EP0671427B1 (de) * 1994-03-10 1998-05-27 Ciba SC Holding AG Thermisch härtbare Epoxidharzsysteme mit gutem Reaktivitäts-/Stabilitätsverhalten
JP3290295B2 (ja) * 1994-05-13 2002-06-10 太陽インキ製造株式会社 硬化性樹脂組成物並びに該組成物を用いた多層プリント配線板及びその製造方法
EP0787348B1 (en) * 1994-07-01 2003-08-13 Vantico AG Epoxy resin casting composition
US6046257A (en) * 1995-07-18 2000-04-04 Toray Industries, Inc. Composition for prepreg comprising epoxy resin, polyamide block copolymer and curing agent
EP0819723B1 (en) * 1996-02-02 2004-06-02 Toray Industries, Inc. Resin compositions for fiber-reinforced composite materials and processes for producing the same, prepregs, fiber-reinforced composite materials, and honeycomb structures
WO1998001494A1 (fr) * 1996-07-04 1998-01-15 Tohto Kasei Co., Ltd. Resine phenolique modifiee contenant un groupe hydroxyle, composition reticulable a base d'une telle resine, produit d'epoxydation de ladite resine modifiee, et composition reticulable a base d'un tel produit
DE69833865T2 (de) * 1997-07-24 2006-10-05 Henkel Corp., Rocky Hill Hitzehärtende harzzusammensetzungen verwendbar als unterfüllungs dichtungsmassen
US20020006484A1 (en) * 1998-05-20 2002-01-17 Balasubramaniam Ramalingam Adhesive and coating formulations for flexible packaging
JP3442006B2 (ja) * 1999-08-24 2003-09-02 日東電工株式会社 流延用エポキシ樹脂組成物
JP2001170950A (ja) * 1999-12-15 2001-06-26 Nitto Denko Corp 複層樹脂板及びその製造方法
JP4319332B2 (ja) * 2000-06-29 2009-08-26 株式会社東芝 電気絶縁材料およびその製造方法
JP2004359792A (ja) * 2003-06-04 2004-12-24 Murata Mfg Co Ltd 高圧部品注型用樹脂組成物および高圧部品
EP1491566B1 (en) * 2003-06-16 2007-02-28 ABB Technology Ltd Curable epoxy resin composition, and process for the production of shaped articles therefrom
EP1881033A1 (en) * 2006-07-20 2008-01-23 Abb Research Ltd. Diluent free epoxy resin formulation
EP1978049B1 (en) * 2007-04-03 2010-02-24 ABB Research Ltd Curable Epoxy Resin Composition

Also Published As

Publication number Publication date
US20120010328A1 (en) 2012-01-12
RU2523282C2 (ru) 2014-07-20
AU2010220423A1 (en) 2011-09-08
KR20170051541A (ko) 2017-05-11
DE102009012195A1 (de) 2010-09-09
KR20110135931A (ko) 2011-12-20
UA105378C2 (uk) 2014-05-12
WO2010100058A1 (de) 2010-09-10
BRPI1009158A2 (pt) 2016-03-01
CA2754346A1 (en) 2010-09-10
EP2403893B1 (de) 2018-12-19
CA2754346C (en) 2017-06-06
AU2010220423B2 (en) 2013-04-04
RU2011140468A (ru) 2013-04-20
CN102341427A (zh) 2012-02-01
CN102341427B (zh) 2014-06-11
EP2403893A1 (de) 2012-01-11
KR102039409B1 (ko) 2019-11-04

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