MX2022010097A - Disipador de calor del dispositivo de conmutación de potencia integrado. - Google Patents

Disipador de calor del dispositivo de conmutación de potencia integrado.

Info

Publication number
MX2022010097A
MX2022010097A MX2022010097A MX2022010097A MX2022010097A MX 2022010097 A MX2022010097 A MX 2022010097A MX 2022010097 A MX2022010097 A MX 2022010097A MX 2022010097 A MX2022010097 A MX 2022010097A MX 2022010097 A MX2022010097 A MX 2022010097A
Authority
MX
Mexico
Prior art keywords
heat sink
base
switching device
power switching
integrated power
Prior art date
Application number
MX2022010097A
Other languages
English (en)
Inventor
James P Downs
Paul J Valente
Chi-Wai David Lau
Original Assignee
American Axle & Mfg Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Axle & Mfg Inc filed Critical American Axle & Mfg Inc
Publication of MX2022010097A publication Critical patent/MX2022010097A/es

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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K7/00—Constructional details common to different types of electric apparatus
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
    • H01L24/92—Specific sequence of method steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K2211/00—Specific aspects not provided for in the other groups of this subclass relating to measuring or protective devices or electric components
    • H02K2211/03—Machines characterised by circuit boards, e.g. pcb

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Motor Or Generator Frames (AREA)
  • Inverter Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Connection Of Motors, Electrical Generators, Mechanical Devices, And The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Un ensamble eléctrico que incluye un dado semiconductor, un disipador de calor y un alojamiento o carcasa. El dado semiconductor incluye un dispositivo semiconductor de potencia con una pluralidad de terminales, y una pluralidad de cables conductores eléctricamente. Cada uno de los cables conductores de electricidad está acoplado eléctricamente a una de las terminales asociadas en el dispositivo semiconductor de potencia. El disipador de calor tiene una base, un montaje y una pluralidad de aletas. El montaje se extiende desde un primer lado de la base y se acopla al dado semiconductor. Las aletas están fijamente acopladas a la base y se extienden desde un segundo lado de la base que es opuesto al primer lado de la base. El alojamiento o carcasa está formado por un primer material eléctricamente aislante. Uno de los primeros cables está formado unitaria e integralmente con el montaje.
MX2022010097A 2019-04-25 2022-08-16 Disipador de calor del dispositivo de conmutación de potencia integrado. MX2022010097A (es)

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CA3137290A1 (en) 2020-10-29
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US11456239B2 (en) 2022-09-27
EP3959799A1 (en) 2022-03-02
US20220037241A1 (en) 2022-02-03
CN113728537A (zh) 2021-11-30
CN113728537B (zh) 2024-04-12
US20220037954A1 (en) 2022-02-03
KR20210144936A (ko) 2021-11-30
US20230041227A1 (en) 2023-02-09
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US11862543B2 (en) 2024-01-02
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