FI946047A - Menetelmä jäähdytyselementtien kiinnittämiseksi tehopuolijohdekomponenttiin sekä jäähdytetty tehonpuolijohde - Google Patents
Menetelmä jäähdytyselementtien kiinnittämiseksi tehopuolijohdekomponenttiin sekä jäähdytetty tehonpuolijohde Download PDFInfo
- Publication number
- FI946047A FI946047A FI946047A FI946047A FI946047A FI 946047 A FI946047 A FI 946047A FI 946047 A FI946047 A FI 946047A FI 946047 A FI946047 A FI 946047A FI 946047 A FI946047 A FI 946047A
- Authority
- FI
- Finland
- Prior art keywords
- power semiconductor
- heat sinks
- attaching heat
- cooled
- semiconductor component
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI946047A FI946047A (fi) | 1994-12-22 | 1994-12-22 | Menetelmä jäähdytyselementtien kiinnittämiseksi tehopuolijohdekomponenttiin sekä jäähdytetty tehonpuolijohde |
| PCT/FI1995/000702 WO1996019827A1 (en) | 1994-12-22 | 1995-12-21 | A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sink |
| AU42630/96A AU4263096A (en) | 1994-12-22 | 1995-12-21 | A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI946047A FI946047A (fi) | 1994-12-22 | 1994-12-22 | Menetelmä jäähdytyselementtien kiinnittämiseksi tehopuolijohdekomponenttiin sekä jäähdytetty tehonpuolijohde |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FI946047A0 FI946047A0 (fi) | 1994-12-22 |
| FI946047A true FI946047A (fi) | 1996-06-23 |
Family
ID=8542041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FI946047A FI946047A (fi) | 1994-12-22 | 1994-12-22 | Menetelmä jäähdytyselementtien kiinnittämiseksi tehopuolijohdekomponenttiin sekä jäähdytetty tehonpuolijohde |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU4263096A (fi) |
| FI (1) | FI946047A (fi) |
| WO (1) | WO1996019827A1 (fi) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2862424B1 (fr) | 2003-11-18 | 2006-10-20 | Valeo Electronique Sys Liaison | Dispositif de refroidissement d'un composant electrique et procede de fabrication de ce dispositif |
| JP2006261519A (ja) * | 2005-03-18 | 2006-09-28 | Sharp Corp | 半導体装置及びその製造方法 |
| US8872332B2 (en) | 2012-04-30 | 2014-10-28 | Infineon Technologies Ag | Power module with directly attached thermally conductive structures |
| CA3137290A1 (en) | 2019-04-25 | 2020-10-29 | American Axle & Manufacturing, Inc. | Electric drive module |
| CA3239745A1 (en) | 2021-12-01 | 2023-06-08 | James P. Downs | Electric drive unit with motor assembly isolated from beaming loads transmitted through housing assembly |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2107516A (en) * | 1981-10-14 | 1983-04-27 | Atomic Energy Authority Uk | Thermocouple |
| US4541004A (en) * | 1982-11-24 | 1985-09-10 | Burroughs Corporation | Aerodynamically enhanced heat sink |
| US4682269A (en) * | 1984-10-11 | 1987-07-21 | Teradyne, Inc. | Heat dissipation for electronic components on a ceramic substrate |
| DE3602163A1 (de) * | 1986-01-24 | 1987-07-30 | Telefunken Electronic Gmbh | Schweissvorrichtung zum verschluss von gehaeusen elektronischer bauelemente |
| US4733453A (en) * | 1987-01-16 | 1988-03-29 | Pinfin, Inc. | Method of making a multiple-pin heatsink |
-
1994
- 1994-12-22 FI FI946047A patent/FI946047A/fi unknown
-
1995
- 1995-12-21 AU AU42630/96A patent/AU4263096A/en not_active Abandoned
- 1995-12-21 WO PCT/FI1995/000702 patent/WO1996019827A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| FI946047A0 (fi) | 1994-12-22 |
| WO1996019827A1 (en) | 1996-06-27 |
| AU4263096A (en) | 1996-07-10 |
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