AU4263096A - A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sink - Google Patents
A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sinkInfo
- Publication number
- AU4263096A AU4263096A AU42630/96A AU4263096A AU4263096A AU 4263096 A AU4263096 A AU 4263096A AU 42630/96 A AU42630/96 A AU 42630/96A AU 4263096 A AU4263096 A AU 4263096A AU 4263096 A AU4263096 A AU 4263096A
- Authority
- AU
- Australia
- Prior art keywords
- solid
- heat sink
- power component
- state power
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI946047A FI946047A (en) | 1994-12-22 | 1994-12-22 | Method of attaching heat sinks to a power semiconductor component and a cooled power semiconductor |
| FI946047 | 1994-12-22 | ||
| PCT/FI1995/000702 WO1996019827A1 (en) | 1994-12-22 | 1995-12-21 | A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU4263096A true AU4263096A (en) | 1996-07-10 |
Family
ID=8542041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU42630/96A Abandoned AU4263096A (en) | 1994-12-22 | 1995-12-21 | A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sink |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU4263096A (en) |
| FI (1) | FI946047A (en) |
| WO (1) | WO1996019827A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2862424B1 (en) | 2003-11-18 | 2006-10-20 | Valeo Electronique Sys Liaison | DEVICE FOR COOLING AN ELECTRICAL COMPONENT AND METHOD FOR MANUFACTURING THE SAME |
| JP2006261519A (en) * | 2005-03-18 | 2006-09-28 | Sharp Corp | Semiconductor device and its manufacturing method |
| US8872332B2 (en) | 2012-04-30 | 2014-10-28 | Infineon Technologies Ag | Power module with directly attached thermally conductive structures |
| DE112020002058T5 (en) | 2019-04-25 | 2022-08-18 | American Axle & Manufacturing, Inc. | ELECTRIC DRIVE MODULE |
| CN118633229A (en) | 2021-12-01 | 2024-09-10 | 美国轮轴制造公司 | Electric drive unit having motor assembly isolated from beam loads transferred through housing assembly |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2107516A (en) * | 1981-10-14 | 1983-04-27 | Atomic Energy Authority Uk | Thermocouple |
| US4541004A (en) * | 1982-11-24 | 1985-09-10 | Burroughs Corporation | Aerodynamically enhanced heat sink |
| US4682269A (en) * | 1984-10-11 | 1987-07-21 | Teradyne, Inc. | Heat dissipation for electronic components on a ceramic substrate |
| DE3602163A1 (en) * | 1986-01-24 | 1987-07-30 | Telefunken Electronic Gmbh | Welding device for the sealing of housings of electronic components |
| US4733453A (en) * | 1987-01-16 | 1988-03-29 | Pinfin, Inc. | Method of making a multiple-pin heatsink |
-
1994
- 1994-12-22 FI FI946047A patent/FI946047A/en unknown
-
1995
- 1995-12-21 WO PCT/FI1995/000702 patent/WO1996019827A1/en active Application Filing
- 1995-12-21 AU AU42630/96A patent/AU4263096A/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| FI946047A0 (en) | 1994-12-22 |
| FI946047A (en) | 1996-06-23 |
| WO1996019827A1 (en) | 1996-06-27 |
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