FI946047A0 - Method for attaching heat sinks - Google Patents

Method for attaching heat sinks

Info

Publication number
FI946047A0
FI946047A0 FI946047A FI946047A FI946047A0 FI 946047 A0 FI946047 A0 FI 946047A0 FI 946047 A FI946047 A FI 946047A FI 946047 A FI946047 A FI 946047A FI 946047 A0 FI946047 A0 FI 946047A0
Authority
FI
Finland
Prior art keywords
heat sinks
attaching heat
attaching
sinks
heat
Prior art date
Application number
FI946047A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI946047A (en
Inventor
Erkki Miettinen
Original Assignee
Abb Industry Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Industry Oy filed Critical Abb Industry Oy
Priority to FI946047A priority Critical patent/FI946047A/en
Publication of FI946047A0 publication Critical patent/FI946047A0/en
Priority to PCT/FI1995/000702 priority patent/WO1996019827A1/en
Priority to AU42630/96A priority patent/AU4263096A/en
Publication of FI946047A publication Critical patent/FI946047A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FI946047A 1994-12-22 1994-12-22 Method of attaching heat sinks to a power semiconductor component and a cooled power semiconductor FI946047A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI946047A FI946047A (en) 1994-12-22 1994-12-22 Method of attaching heat sinks to a power semiconductor component and a cooled power semiconductor
PCT/FI1995/000702 WO1996019827A1 (en) 1994-12-22 1995-12-21 A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sink
AU42630/96A AU4263096A (en) 1994-12-22 1995-12-21 A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI946047A FI946047A (en) 1994-12-22 1994-12-22 Method of attaching heat sinks to a power semiconductor component and a cooled power semiconductor

Publications (2)

Publication Number Publication Date
FI946047A0 true FI946047A0 (en) 1994-12-22
FI946047A FI946047A (en) 1996-06-23

Family

ID=8542041

Family Applications (1)

Application Number Title Priority Date Filing Date
FI946047A FI946047A (en) 1994-12-22 1994-12-22 Method of attaching heat sinks to a power semiconductor component and a cooled power semiconductor

Country Status (3)

Country Link
AU (1) AU4263096A (en)
FI (1) FI946047A (en)
WO (1) WO1996019827A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2862424B1 (en) 2003-11-18 2006-10-20 Valeo Electronique Sys Liaison DEVICE FOR COOLING AN ELECTRICAL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
JP2006261519A (en) * 2005-03-18 2006-09-28 Sharp Corp Semiconductor device and its manufacturing method
US8872332B2 (en) 2012-04-30 2014-10-28 Infineon Technologies Ag Power module with directly attached thermally conductive structures
CA3137290A1 (en) 2019-04-25 2020-10-29 American Axle & Manufacturing, Inc. Electric drive module
CA3239745A1 (en) 2021-12-01 2023-06-08 James P. Downs Electric drive unit with motor assembly isolated from beaming loads transmitted through housing assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2107516A (en) * 1981-10-14 1983-04-27 Atomic Energy Authority Uk Thermocouple
US4541004A (en) * 1982-11-24 1985-09-10 Burroughs Corporation Aerodynamically enhanced heat sink
US4682269A (en) * 1984-10-11 1987-07-21 Teradyne, Inc. Heat dissipation for electronic components on a ceramic substrate
DE3602163A1 (en) * 1986-01-24 1987-07-30 Telefunken Electronic Gmbh Welding device for the sealing of housings of electronic components
US4733453A (en) * 1987-01-16 1988-03-29 Pinfin, Inc. Method of making a multiple-pin heatsink

Also Published As

Publication number Publication date
WO1996019827A1 (en) 1996-06-27
AU4263096A (en) 1996-07-10
FI946047A (en) 1996-06-23

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