KR970015763U - Heat sink for heating circuit parts - Google Patents

Heat sink for heating circuit parts

Info

Publication number
KR970015763U
KR970015763U KR2019950024991U KR19950024991U KR970015763U KR 970015763 U KR970015763 U KR 970015763U KR 2019950024991 U KR2019950024991 U KR 2019950024991U KR 19950024991 U KR19950024991 U KR 19950024991U KR 970015763 U KR970015763 U KR 970015763U
Authority
KR
South Korea
Prior art keywords
heat sink
heating circuit
circuit parts
parts
heating
Prior art date
Application number
KR2019950024991U
Other languages
Korean (ko)
Other versions
KR0127160Y1 (en
Inventor
김기돈
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR2019950024991U priority Critical patent/KR0127160Y1/en
Publication of KR970015763U publication Critical patent/KR970015763U/en
Application granted granted Critical
Publication of KR0127160Y1 publication Critical patent/KR0127160Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
KR2019950024991U 1995-09-16 1995-09-16 Heat sink for heating circuit parts KR0127160Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950024991U KR0127160Y1 (en) 1995-09-16 1995-09-16 Heat sink for heating circuit parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950024991U KR0127160Y1 (en) 1995-09-16 1995-09-16 Heat sink for heating circuit parts

Publications (2)

Publication Number Publication Date
KR970015763U true KR970015763U (en) 1997-04-28
KR0127160Y1 KR0127160Y1 (en) 1998-12-15

Family

ID=19423459

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950024991U KR0127160Y1 (en) 1995-09-16 1995-09-16 Heat sink for heating circuit parts

Country Status (1)

Country Link
KR (1) KR0127160Y1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100400628B1 (en) * 2000-10-05 2003-10-04 산요덴키가부시키가이샤 Heat-dissipating substrate and semiconductor module
KR100467429B1 (en) * 2002-06-18 2005-01-24 삼성에스디아이 주식회사 Plasma display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100400628B1 (en) * 2000-10-05 2003-10-04 산요덴키가부시키가이샤 Heat-dissipating substrate and semiconductor module
KR100467429B1 (en) * 2002-06-18 2005-01-24 삼성에스디아이 주식회사 Plasma display device

Also Published As

Publication number Publication date
KR0127160Y1 (en) 1998-12-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20060629

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee