FI961181A - Heat sink - Google Patents

Heat sink Download PDF

Info

Publication number
FI961181A
FI961181A FI961181A FI961181A FI961181A FI 961181 A FI961181 A FI 961181A FI 961181 A FI961181 A FI 961181A FI 961181 A FI961181 A FI 961181A FI 961181 A FI961181 A FI 961181A
Authority
FI
Finland
Prior art keywords
heat sink
sink
heat
Prior art date
Application number
FI961181A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI112585B (en
FI961181A0 (en
Inventor
Markku Puska
Original Assignee
Nokia Alumiini Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Alumiini Oy filed Critical Nokia Alumiini Oy
Priority to FI961181A priority Critical patent/FI112585B/en
Publication of FI961181A0 publication Critical patent/FI961181A0/en
Priority to DE1997110225 priority patent/DE19710225A1/en
Priority to FR9702924A priority patent/FR2746251B1/en
Priority to SE9700880A priority patent/SE520269C2/en
Publication of FI961181A publication Critical patent/FI961181A/en
Application granted granted Critical
Publication of FI112585B publication Critical patent/FI112585B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI961181A 1996-03-13 1996-03-13 Heat sink FI112585B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI961181A FI112585B (en) 1996-03-13 1996-03-13 Heat sink
DE1997110225 DE19710225A1 (en) 1996-03-13 1997-03-12 Power electronic component heat sink
FR9702924A FR2746251B1 (en) 1996-03-13 1997-03-12 COOLING ELEMENT, ESPECIALLY FOR ELECTRONIC POWER COMPONENTS
SE9700880A SE520269C2 (en) 1996-03-13 1997-03-12 Heat sink

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI961181A FI112585B (en) 1996-03-13 1996-03-13 Heat sink
FI961181 1996-03-13

Publications (3)

Publication Number Publication Date
FI961181A0 FI961181A0 (en) 1996-03-13
FI961181A true FI961181A (en) 1997-09-14
FI112585B FI112585B (en) 2003-12-15

Family

ID=8545651

Family Applications (1)

Application Number Title Priority Date Filing Date
FI961181A FI112585B (en) 1996-03-13 1996-03-13 Heat sink

Country Status (4)

Country Link
DE (1) DE19710225A1 (en)
FI (1) FI112585B (en)
FR (1) FR2746251B1 (en)
SE (1) SE520269C2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6691768B2 (en) * 2001-06-25 2004-02-17 Sun Microsystems, Inc. Heatsink design for uniform heat dissipation
DE102006019376A1 (en) * 2006-04-24 2007-10-25 Bombardier Transportation Gmbh Power radiator for e.g. insulated gate bipolar transistor component of inverter, has cooling plate, where one set of fins exhibits heat conductive material different from other set of fins and ends of fins are inserted into cooling plate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312277A (en) * 1965-03-22 1967-04-04 Astrodyne Inc Heat sink
DE3415554A1 (en) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Heat sink for power electronic components
DE8429523U1 (en) * 1984-10-08 1984-11-29 Nixdorf Computer Ag, 4790 Paderborn Heat sinks for electronic components and / or devices

Also Published As

Publication number Publication date
FR2746251B1 (en) 2002-12-06
SE9700880D0 (en) 1997-03-12
DE19710225A1 (en) 1997-10-30
FI112585B (en) 2003-12-15
FR2746251A1 (en) 1997-09-19
FI961181A0 (en) 1996-03-13
SE9700880L (en) 1997-09-14
SE520269C2 (en) 2003-06-17

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Legal Events

Date Code Title Description
MA Patent expired