SE9700880L - Heat sink - Google Patents

Heat sink

Info

Publication number
SE9700880L
SE9700880L SE9700880A SE9700880A SE9700880L SE 9700880 L SE9700880 L SE 9700880L SE 9700880 A SE9700880 A SE 9700880A SE 9700880 A SE9700880 A SE 9700880A SE 9700880 L SE9700880 L SE 9700880L
Authority
SE
Sweden
Prior art keywords
base
heat sink
fins
recesses
assembled
Prior art date
Application number
SE9700880A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE520269C2 (en
SE9700880D0 (en
Inventor
Markku Puska
Original Assignee
Nordic Aluminium Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordic Aluminium Oyj filed Critical Nordic Aluminium Oyj
Publication of SE9700880D0 publication Critical patent/SE9700880D0/en
Publication of SE9700880L publication Critical patent/SE9700880L/en
Publication of SE520269C2 publication Critical patent/SE520269C2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The heat sink includes a base (3) supporting a structure of parallel fins made of aluminium. The base is attached to the component to be cooled. The base is made up of copper elongated profiles which are assembled using square shaped protrusions (6) and recesses (7). Similar protrusions and recesses are provided on the aluminium fins. The fins are assembled using the same method and then fixed on the base.
SE9700880A 1996-03-13 1997-03-12 Heat sink SE520269C2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI961181A FI112585B (en) 1996-03-13 1996-03-13 Heat sink

Publications (3)

Publication Number Publication Date
SE9700880D0 SE9700880D0 (en) 1997-03-12
SE9700880L true SE9700880L (en) 1997-09-14
SE520269C2 SE520269C2 (en) 2003-06-17

Family

ID=8545651

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9700880A SE520269C2 (en) 1996-03-13 1997-03-12 Heat sink

Country Status (4)

Country Link
DE (1) DE19710225A1 (en)
FI (1) FI112585B (en)
FR (1) FR2746251B1 (en)
SE (1) SE520269C2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6691768B2 (en) * 2001-06-25 2004-02-17 Sun Microsystems, Inc. Heatsink design for uniform heat dissipation
DE102006019376A1 (en) * 2006-04-24 2007-10-25 Bombardier Transportation Gmbh Power radiator for e.g. insulated gate bipolar transistor component of inverter, has cooling plate, where one set of fins exhibits heat conductive material different from other set of fins and ends of fins are inserted into cooling plate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312277A (en) * 1965-03-22 1967-04-04 Astrodyne Inc Heat sink
DE3415554A1 (en) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Heat sink for power electronic components
DE8429523U1 (en) * 1984-10-08 1984-11-29 Nixdorf Computer Ag, 4790 Paderborn Heat sinks for electronic components and / or devices

Also Published As

Publication number Publication date
FR2746251A1 (en) 1997-09-19
FI112585B (en) 2003-12-15
SE520269C2 (en) 2003-06-17
FR2746251B1 (en) 2002-12-06
FI961181A (en) 1997-09-14
SE9700880D0 (en) 1997-03-12
FI961181A0 (en) 1996-03-13
DE19710225A1 (en) 1997-10-30

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Legal Events

Date Code Title Description
NUG Patent has lapsed