MX2016011835A - Aparato electronico flexible y metodos asociados. - Google Patents

Aparato electronico flexible y metodos asociados.

Info

Publication number
MX2016011835A
MX2016011835A MX2016011835A MX2016011835A MX2016011835A MX 2016011835 A MX2016011835 A MX 2016011835A MX 2016011835 A MX2016011835 A MX 2016011835A MX 2016011835 A MX2016011835 A MX 2016011835A MX 2016011835 A MX2016011835 A MX 2016011835A
Authority
MX
Mexico
Prior art keywords
flexible substrate
electronic component
overhang
associated methods
component island
Prior art date
Application number
MX2016011835A
Other languages
English (en)
Other versions
MX362718B (es
Inventor
Cotton Darryl
Allen Mark
Andrew Piers
robinson Adam
Original Assignee
Nokia Technologies Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Technologies Oy filed Critical Nokia Technologies Oy
Publication of MX2016011835A publication Critical patent/MX2016011835A/es
Publication of MX362718B publication Critical patent/MX362718B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
    • H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/36—Electrical components characterised by special electrical interconnection means between two or more PV modules, e.g. electrical module-to-module connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Un aparato que comprende: un sustrato flexible; y una isla de componentes electrónicos sobresaliente, estando configurada la isla de componentes electrónicos para ser menos flexible que el sustrato flexible y comprendiendo uno o más componentes electrónicos, en donde la isla de componentes electrónicos comprende una cara de sustrato con una porción de conexión y una porción sobresaliente, estando mecánicamente acoplada la porción de conexión a una superficie del sustrato flexible mediante una única almohadilla de soporte de conexión, y estando configurada la porción sobresaliente para sobresalir y estar esencialmente libre del sustrato flexible subyacente, de tal manera que el sustrato flexible subyacente puede deformarse independientemente de la porción sobresaliente bajo deformaciones operacionales del sustrato flexible.
MX2016011835A 2014-03-21 2015-03-03 Aparato electrónico flexible y métodos asociados. MX362718B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1405081.9A GB2524327A (en) 2014-03-21 2014-03-21 Flexible electronics apparatus and associated methods
PCT/FI2015/050131 WO2015140392A1 (en) 2014-03-21 2015-03-03 Flexible electronics apparatus and associated methods

Publications (2)

Publication Number Publication Date
MX2016011835A true MX2016011835A (es) 2016-12-02
MX362718B MX362718B (es) 2019-01-25

Family

ID=50686669

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2016011835A MX362718B (es) 2014-03-21 2015-03-03 Aparato electrónico flexible y métodos asociados.

Country Status (6)

Country Link
US (1) US10470304B2 (es)
EP (1) EP3120381B1 (es)
JP (1) JP6577564B2 (es)
GB (1) GB2524327A (es)
MX (1) MX362718B (es)
WO (1) WO2015140392A1 (es)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2991460B1 (en) 2014-08-29 2018-11-21 Nokia Technologies OY An apparatus and associated methods for deformable electronics
EP3009822B1 (en) 2014-10-16 2017-06-21 Nokia Technologies OY A deformable apparatus and method
EP3010315A1 (en) 2014-10-16 2016-04-20 Nokia Technologies OY A deformable apparatus and method
WO2017015000A1 (en) * 2015-07-17 2017-01-26 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US9484209B1 (en) * 2015-11-20 2016-11-01 International Business Machines Corporation Flexible and stretchable sensors formed by patterned spalling
CN105578738B (zh) * 2015-12-21 2019-01-25 上海交通大学 基于弹性衬底的可拉伸电路板的制备方法及可拉伸电路板
KR101973163B1 (ko) * 2016-03-22 2019-04-29 삼성디스플레이 주식회사 디스플레이 장치
WO2018063198A1 (en) 2016-09-28 2018-04-05 Aleksandar Aleksov Flexible packaging for a wearable electronic device
CN108962914B (zh) * 2017-05-19 2021-07-30 启耀光电股份有限公司 电子装置与其制造方法
CN107068648A (zh) * 2017-06-06 2017-08-18 西南交通大学 一种双面“i”型复合结构的柔性基体
US11331019B2 (en) 2017-08-07 2022-05-17 The Research Foundation For The State University Of New York Nanoparticle sensor having a nanofibrous membrane scaffold
CN107592075B (zh) * 2017-10-11 2023-10-10 青海黄河上游水电开发有限责任公司光伏产业技术分公司 一种光伏组件测试挂架
EP3490008A1 (en) * 2017-11-27 2019-05-29 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Photovoltaic multilayer laminate
CN110056786A (zh) * 2018-01-18 2019-07-26 展晶科技(深圳)有限公司 可挠式超薄发光体结构及其制作方法
US11257969B2 (en) * 2018-03-15 2022-02-22 The Boeing Company Blocking diode board for rollable solar power module
WO2020018255A1 (en) * 2018-07-20 2020-01-23 Shenzhen Royole Technologies Co. Ltd. Stretchable electronics and hybrid integration method for fabricating the same
KR102530672B1 (ko) * 2018-07-20 2023-05-08 엘지디스플레이 주식회사 스트레쳐블 표시 장치
KR102664207B1 (ko) * 2018-10-08 2024-05-07 엘지디스플레이 주식회사 스트레쳐블 표시 장치 및 그 제조 방법
KR102609426B1 (ko) * 2018-10-08 2023-12-01 엘지디스플레이 주식회사 스트레쳐블 표시 장치
KR20200052094A (ko) * 2018-11-06 2020-05-14 엘지디스플레이 주식회사 스트레쳐블 표시 장치
WO2020105206A1 (ja) * 2018-11-22 2020-05-28 株式会社村田製作所 伸縮性配線基板及び伸縮性配線基板の製造方法
GB2581818B (en) * 2019-02-28 2024-01-03 Cennox Ltd Kit and method for improving the security of a card reader
EP3944727A4 (en) * 2019-03-20 2022-12-07 Dai Nippon Printing Co., Ltd. CIRCUIT BOARD AND PROCESS OF MAKING THE CIRCUIT BOARD
JP6930681B2 (ja) * 2019-03-25 2021-09-01 株式会社村田製作所 伸縮性実装基板
JP2020181958A (ja) * 2019-04-26 2020-11-05 株式会社ジャパンディスプレイ フレキシブル基板
CN110649181B (zh) * 2019-10-08 2022-04-26 京东方科技集团股份有限公司 显示基板、显示装置以及显示基板的制备方法
US20210307170A1 (en) * 2020-03-30 2021-09-30 Sanctuary Cognitive Systems Corporation Sensory array for use with artificial skin and artificial skin with sensory array, useful in robotics
CN111462637B (zh) * 2020-05-29 2022-07-01 上海天马微电子有限公司 一种显示面板和显示装置
CN111916518A (zh) * 2020-06-30 2020-11-10 泰州隆基乐叶光伏科技有限公司 叠瓦组件的导电互联件、叠瓦组件及制备方法
CN112087696B (zh) * 2020-06-30 2022-01-07 歌尔微电子有限公司 微型麦克风防尘装置及mems麦克风
CN112435579B (zh) * 2020-11-24 2022-11-15 京东方科技集团股份有限公司 显示装置及其弯折方法
EP4120806A1 (en) * 2021-07-15 2023-01-18 Imec VZW An interconnect, an electronic assembly and a method for manufacturing an electronic assembly

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001358422A (ja) * 2000-06-13 2001-12-26 Sony Corp 電子回路装置
US6859577B2 (en) 2001-06-25 2005-02-22 Analog Devices Inc. Self assembled micro anti-stiction structure
US6849935B2 (en) * 2002-05-10 2005-02-01 Sarnoff Corporation Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
JP3785131B2 (ja) * 2002-09-30 2006-06-14 株式会社東芝 カメラユニット及びカメラユニット製造方法
JP2005209729A (ja) * 2004-01-20 2005-08-04 Yaskawa Electric Corp プリント基板実装構造
JP2005235997A (ja) * 2004-02-19 2005-09-02 Mitsubishi Electric Corp プリント基板、電子回路基板及びその製造方法
US7521292B2 (en) * 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
JP2006005026A (ja) * 2004-06-15 2006-01-05 Epson Toyocom Corp 電子機器、プリント基板ユニット、及びスペーサ
JP4328970B2 (ja) 2005-08-02 2009-09-09 セイコーエプソン株式会社 半導体装置
US7564536B2 (en) 2005-11-08 2009-07-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2007097366A1 (ja) * 2006-02-21 2007-08-30 Nippon Steel Chemical Co., Ltd. 多層プリント配線板及びその製造方法
JP2007250998A (ja) 2006-03-17 2007-09-27 Seiko Epson Corp 半導体装置及びその製造方法
KR20080043068A (ko) 2006-11-13 2008-05-16 삼성전자주식회사 칩 온 필름 구조를 갖는 반도체 장치 및 그 제조방법
KR100837276B1 (ko) * 2006-12-20 2008-06-11 삼성전자주식회사 인쇄 회로 기판 및 이를 사용하는 반도체 메모리 모듈
JP5056051B2 (ja) * 2007-02-19 2012-10-24 パナソニック株式会社 カード型情報装置
JP2008235594A (ja) * 2007-03-20 2008-10-02 Sumitomo Electric Printed Circuit Inc 配線板接合体およびその製造方法
JP2009094099A (ja) * 2007-10-03 2009-04-30 Nec Lcd Technologies Ltd フレキシブル基板の接続部の構造、フレキシブル基板、フラットパネル表示装置
US20090094099A1 (en) * 2007-10-09 2009-04-09 Archer-Daniels-Midland Company Evaluating commodity conditions using multiple sources of information
US7998797B2 (en) 2008-12-09 2011-08-16 Infineon Technologies Ag Semiconductor device
JP5382418B2 (ja) * 2009-01-28 2014-01-08 ソニー株式会社 回路基板およびその製造方法、タッチパネルならびに表示装置
JP2010251706A (ja) * 2009-03-25 2010-11-04 Panasonic Corp 装着用発電モジュール
US9080622B2 (en) * 2009-04-03 2015-07-14 Eaton Corporation Hydraulic coupling having self-adjusting anti-rotation hydraulic fluid path
WO2010131578A1 (ja) * 2009-05-12 2010-11-18 日本電気株式会社 光信号入出力器内蔵半導体装置及びそれを搭載した電子機器
KR101765473B1 (ko) * 2010-06-21 2017-08-24 삼성전자 주식회사 인쇄 회로 기판 및 이를 포함하는 반도체 패키지
JP2012069673A (ja) * 2010-09-22 2012-04-05 Sony Corp フレキシブル基板、フレキシブル基板の実装方法及び照明装置
WO2012133530A1 (ja) 2011-03-31 2012-10-04 日本碍子株式会社 セラミックス素子の製造方法
US9682856B2 (en) 2011-08-01 2017-06-20 President And Fellows Of Harvard College MEMS force sensors fabricated using paper substrates
JP5855979B2 (ja) 2012-03-07 2016-02-09 日本メクトロン株式会社 伸縮性フレキシブル回路基板
KR20150006055A (ko) * 2012-05-04 2015-01-15 유니-픽셀 디스플레이스, 인코포레이티드 촉매 농도의 최적화를 통한 저 변화를 가진 고 분해능 도전성 패턴들

Also Published As

Publication number Publication date
MX362718B (es) 2019-01-25
JP6577564B2 (ja) 2019-09-18
EP3120381B1 (en) 2021-01-06
US20170086291A1 (en) 2017-03-23
EP3120381A1 (en) 2017-01-25
JP2017513237A (ja) 2017-05-25
GB2524327A (en) 2015-09-23
GB201405081D0 (en) 2014-05-07
WO2015140392A1 (en) 2015-09-24
US10470304B2 (en) 2019-11-05

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