MX2014008852A - Transductor capacitivo micromaquinado y metodo de manufactura del mismo. - Google Patents

Transductor capacitivo micromaquinado y metodo de manufactura del mismo.

Info

Publication number
MX2014008852A
MX2014008852A MX2014008852A MX2014008852A MX2014008852A MX 2014008852 A MX2014008852 A MX 2014008852A MX 2014008852 A MX2014008852 A MX 2014008852A MX 2014008852 A MX2014008852 A MX 2014008852A MX 2014008852 A MX2014008852 A MX 2014008852A
Authority
MX
Mexico
Prior art keywords
depositing
manufacturing
capacitive micro
dielectric film
transducer
Prior art date
Application number
MX2014008852A
Other languages
English (en)
Spanish (es)
Inventor
Peter Dirksen
Bout Marcelis
Ruediger Mauczok
Koray Karakaya
Johan Hendrik Klootwijk
Marcel Mulder
Original Assignee
Koninkl Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Nv filed Critical Koninkl Philips Nv
Publication of MX2014008852A publication Critical patent/MX2014008852A/es

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292Electrostatic transducers, e.g. electret-type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0027Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523Etching material
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0271Resonators; ultrasonic resonators
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Acoustics & Sound (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Signal Processing (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Measuring Fluid Pressure (AREA)
  • Drying Of Semiconductors (AREA)
  • Pressure Sensors (AREA)
MX2014008852A 2012-01-27 2013-01-23 Transductor capacitivo micromaquinado y metodo de manufactura del mismo. MX2014008852A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261591308P 2012-01-27 2012-01-27
PCT/IB2013/050572 WO2013111063A1 (en) 2012-01-27 2013-01-23 Capacitive micro-machined transducer and method of manufacturing the same

Publications (1)

Publication Number Publication Date
MX2014008852A true MX2014008852A (es) 2014-10-06

Family

ID=47884432

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014008852A MX2014008852A (es) 2012-01-27 2013-01-23 Transductor capacitivo micromaquinado y metodo de manufactura del mismo.

Country Status (8)

Country Link
US (1) US9828236B2 (enExample)
EP (1) EP2806983B1 (enExample)
JP (1) JP6190387B2 (enExample)
CN (1) CN104066520A (enExample)
BR (1) BR112014018080A8 (enExample)
MX (1) MX2014008852A (enExample)
RU (1) RU2627062C2 (enExample)
WO (1) WO2013111063A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5578810B2 (ja) * 2009-06-19 2014-08-27 キヤノン株式会社 静電容量型の電気機械変換装置
CN105592940B (zh) * 2013-09-24 2018-09-25 皇家飞利浦有限公司 Cmut装置制造方法、cmut装置和设备
EP3071338B1 (en) * 2013-11-18 2022-05-11 Koninklijke Philips N.V. Ultrasound transducer assembly
KR20160006494A (ko) * 2014-07-09 2016-01-19 삼성전자주식회사 와이어 본딩을 이용한 정전용량 미세가공 초음파 변환기 프로브
JP6932085B2 (ja) 2015-07-02 2021-09-08 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. マルチモード容量性マイクロマシン超音波トランスデューサ並びに関連するデバイス、システム及び方法
CN110100294B (zh) 2016-12-22 2022-03-29 皇家飞利浦有限公司 电容式射频微机电开关的系统和操作方法
WO2019213388A1 (en) * 2018-05-03 2019-11-07 Butterfly Network, Inc. Pressure port for ultrasonic transducer on cmos sensor
JP7410935B2 (ja) 2018-05-24 2024-01-10 ザ リサーチ ファウンデーション フォー ザ ステイト ユニバーシティー オブ ニューヨーク 容量性センサ
CN109665488B (zh) * 2018-12-29 2024-07-19 杭州士兰集成电路有限公司 Mems器件及其制造方法
WO2020163595A1 (en) * 2019-02-07 2020-08-13 Butterfly Network, Inc Bi-layer metal electrode for micromachined ultrasonic transducer devices
US11684951B2 (en) 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007528153A (ja) * 2004-02-06 2007-10-04 ジョージア テック リサーチ コーポレイション Cmutデバイス及び製造方法
US7172947B2 (en) * 2004-08-31 2007-02-06 Micron Technology, Inc High dielectric constant transition metal oxide materials
EP1883956A4 (en) * 2005-05-18 2011-03-23 Kolo Technologies Inc BY-THE-WAFER CONNECTION
KR100648860B1 (ko) * 2005-09-08 2006-11-24 주식회사 하이닉스반도체 유전막 및 그 형성방법과, 상기 유전막을 구비한 반도체메모리 소자 및 그 제조방법
JP4724505B2 (ja) * 2005-09-09 2011-07-13 株式会社日立製作所 超音波探触子およびその製造方法
JP4961260B2 (ja) 2007-05-16 2012-06-27 株式会社日立製作所 半導体装置
US20080315331A1 (en) * 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure
CN101772383B (zh) 2007-07-31 2011-11-02 皇家飞利浦电子股份有限公司 具有高k电介质的cmut
US8475374B2 (en) * 2007-08-23 2013-07-02 Purdue Research Foundation Intra-occular pressure sensor
WO2009122314A1 (en) * 2008-03-31 2009-10-08 Nxp B.V. A sensor chip and a method of manufacturing the same
JP5305993B2 (ja) * 2008-05-02 2013-10-02 キヤノン株式会社 容量型機械電気変換素子の製造方法、及び容量型機械電気変換素子
US9132693B2 (en) 2008-09-16 2015-09-15 Koninklijke Philps N.V. Capacitive micromachine ultrasound transducer
FR2939003B1 (fr) * 2008-11-21 2011-02-25 Commissariat Energie Atomique Cellule cmut formee d'une membrane de nano-tubes ou de nano-fils ou de nano-poutres et dispositif d'imagerie acoustique ultra haute frequence comprenant une pluralite de telles cellules
EP2400893B1 (en) * 2009-02-27 2017-01-04 Koninklijke Philips N.V. Pre-collapsed cmut with mechanical collapse retention
JP2011054708A (ja) * 2009-09-01 2011-03-17 Elpida Memory Inc 絶縁膜およびその製造方法、半導体装置、ならびにデータ処理システム
WO2011111427A1 (ja) * 2010-03-12 2011-09-15 株式会社 日立メディコ 超音波トランスデューサおよびそれを用いた超音波診断装置
US8530322B2 (en) * 2010-12-16 2013-09-10 Intermolecular, Inc. Method of forming stacked metal oxide layers
US20120228773A1 (en) * 2011-03-08 2012-09-13 International Business Machines Corporation Large-grain, low-resistivity tungsten on a conductive compound
US8794075B2 (en) * 2011-08-11 2014-08-05 Nxp, B.V. Multilayered NONON membrane in a MEMS sensor

Also Published As

Publication number Publication date
EP2806983B1 (en) 2020-04-01
US9828236B2 (en) 2017-11-28
EP2806983A1 (en) 2014-12-03
BR112014018080A2 (enExample) 2017-06-20
JP2015506641A (ja) 2015-03-02
US20140332911A1 (en) 2014-11-13
RU2014134901A (ru) 2016-03-27
CN104066520A (zh) 2014-09-24
BR112014018080A8 (pt) 2017-07-11
RU2627062C2 (ru) 2017-08-03
WO2013111063A1 (en) 2013-08-01
JP6190387B2 (ja) 2017-08-30

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