IT1406644B1 - Substrato (fetta) di materiale semiconduttore con sovrastanti strati eteroepitassiali assumenti una struttura sandwich, idoneo per la fabbricazione di componenti elettronici ibridi. - Google Patents

Substrato (fetta) di materiale semiconduttore con sovrastanti strati eteroepitassiali assumenti una struttura sandwich, idoneo per la fabbricazione di componenti elettronici ibridi.

Info

Publication number
IT1406644B1
IT1406644B1 ITCT2010A000006A ITCT20100006A IT1406644B1 IT 1406644 B1 IT1406644 B1 IT 1406644B1 IT CT2010A000006 A ITCT2010A000006 A IT CT2010A000006A IT CT20100006 A ITCT20100006 A IT CT20100006A IT 1406644 B1 IT1406644 B1 IT 1406644B1
Authority
IT
Italy
Prior art keywords
heterophyptitial
slice
overhead
manufacture
substrate
Prior art date
Application number
ITCT2010A000006A
Other languages
English (en)
Inventor
Giuseppe Abbondanza
Original Assignee
Abbondanza
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abbondanza filed Critical Abbondanza
Priority to ITCT2010A000006A priority Critical patent/IT1406644B1/it
Priority to US13/695,246 priority patent/US9099308B2/en
Priority to CN201180028435.1A priority patent/CN102939642B/zh
Priority to PCT/EP2011/056817 priority patent/WO2011135065A1/en
Publication of ITCT20100006A1 publication Critical patent/ITCT20100006A1/it
Application granted granted Critical
Publication of IT1406644B1 publication Critical patent/IT1406644B1/it
Priority to US14/788,699 priority patent/US9576793B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02529—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02436—Intermediate layers between substrates and deposited layers
    • H01L21/02439—Materials
    • H01L21/02441—Group 14 semiconducting materials
    • H01L21/02447—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/0254—Nitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02587—Structure
    • H01L21/0259—Microstructure
    • H01L21/02598—Microstructure monocrystalline
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02658—Pretreatments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1608—Silicon carbide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003—Nitride compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/26—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
    • H01L29/267—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys in different semiconductor regions, e.g. heterojunctions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
ITCT2010A000006A 2010-04-29 2010-04-29 Substrato (fetta) di materiale semiconduttore con sovrastanti strati eteroepitassiali assumenti una struttura sandwich, idoneo per la fabbricazione di componenti elettronici ibridi. IT1406644B1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ITCT2010A000006A IT1406644B1 (it) 2010-04-29 2010-04-29 Substrato (fetta) di materiale semiconduttore con sovrastanti strati eteroepitassiali assumenti una struttura sandwich, idoneo per la fabbricazione di componenti elettronici ibridi.
US13/695,246 US9099308B2 (en) 2010-04-29 2011-04-29 Semiconductor wafer and method for manufacturing the same
CN201180028435.1A CN102939642B (zh) 2010-04-29 2011-04-29 半导体晶片及其制造方法
PCT/EP2011/056817 WO2011135065A1 (en) 2010-04-29 2011-04-29 Semiconductor wafer and method for manufacturing the same
US14/788,699 US9576793B2 (en) 2010-04-29 2015-06-30 Semiconductor wafer and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITCT2010A000006A IT1406644B1 (it) 2010-04-29 2010-04-29 Substrato (fetta) di materiale semiconduttore con sovrastanti strati eteroepitassiali assumenti una struttura sandwich, idoneo per la fabbricazione di componenti elettronici ibridi.

Publications (2)

Publication Number Publication Date
ITCT20100006A1 ITCT20100006A1 (it) 2011-10-30
IT1406644B1 true IT1406644B1 (it) 2014-03-07

Family

ID=42751951

Family Applications (1)

Application Number Title Priority Date Filing Date
ITCT2010A000006A IT1406644B1 (it) 2010-04-29 2010-04-29 Substrato (fetta) di materiale semiconduttore con sovrastanti strati eteroepitassiali assumenti una struttura sandwich, idoneo per la fabbricazione di componenti elettronici ibridi.

Country Status (4)

Country Link
US (2) US9099308B2 (it)
CN (1) CN102939642B (it)
IT (1) IT1406644B1 (it)
WO (1) WO2011135065A1 (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107487054B (zh) * 2016-06-12 2023-08-08 中国科学院宁波材料技术与工程研究所 多层复合膜、其制备方法以及作为纤维增强复合材料的连接材料的应用
TWI686948B (zh) * 2019-04-15 2020-03-01 世界先進積體電路股份有限公司 基底結構及包含其之半導體結構的製造方法
CN111863590B (zh) * 2019-04-24 2023-05-16 世界先进积体电路股份有限公司 衬底结构及包含其半导体结构的制造方法
US10896617B2 (en) 2019-04-30 2021-01-19 Honeywell International S.R.O. Transmitting surveillance signals in response to a received signal
US11183563B2 (en) * 2019-10-04 2021-11-23 Vanguard International Semiconductor Corporation Substrate structure and method for fabricating semiconductor structure including the substrate structure
CN115279956A (zh) * 2019-12-27 2022-11-01 沃孚半导体公司 大直径碳化硅晶片
EP4135006A1 (en) 2021-08-13 2023-02-15 Siltronic AG A method for manufacturing a substrate wafer for building group iii-v devices thereon and a substrate wafer for building group iii-v devices thereon
WO2023147136A1 (en) * 2022-01-31 2023-08-03 Lam Research Corporation Thin film growth modulation using wafer bow

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4234508C2 (de) * 1992-10-13 1994-12-22 Cs Halbleiter Solartech Verfahren zur Herstellung eines Wafers mit einer monokristallinen Siliciumcarbidschicht
US6110279A (en) * 1996-03-29 2000-08-29 Denso Corporation Method of producing single-crystal silicon carbide
US5952679A (en) * 1996-10-17 1999-09-14 Denso Corporation Semiconductor substrate and method for straightening warp of semiconductor substrate
JPH10246730A (ja) * 1997-03-04 1998-09-14 Canon Inc プローブとその製造方法、及び該プローブを備えた情報処理装置
JP2998724B2 (ja) * 1997-11-10 2000-01-11 日本電気株式会社 張り合わせｓｏｉ基板の製造方法
US7439158B2 (en) * 2003-07-21 2008-10-21 Micron Technology, Inc. Strained semiconductor by full wafer bonding
JP4522301B2 (ja) * 2005-03-30 2010-08-11 住友電工デバイス・イノベーション株式会社 半導体基板および半導体装置
EP2251897B1 (en) * 2009-05-13 2016-01-06 Siltronic AG A method for producing a wafer comprising a silicon single crystal substrate having a front and a back side and a layer of SiGe deposited on the front side

Also Published As

Publication number Publication date
US20150325656A1 (en) 2015-11-12
ITCT20100006A1 (it) 2011-10-30
US20130112995A1 (en) 2013-05-09
US9099308B2 (en) 2015-08-04
WO2011135065A1 (en) 2011-11-03
CN102939642B (zh) 2016-08-03
CN102939642A (zh) 2013-02-20
US9576793B2 (en) 2017-02-21

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