LU81652A1 - Composition pour photoreserve positive - Google Patents
Composition pour photoreserve positive Download PDFInfo
- Publication number
- LU81652A1 LU81652A1 LU81652A LU81652A LU81652A1 LU 81652 A1 LU81652 A1 LU 81652A1 LU 81652 A LU81652 A LU 81652A LU 81652 A LU81652 A LU 81652A LU 81652 A1 LU81652 A1 LU 81652A1
- Authority
- LU
- Luxembourg
- Prior art keywords
- resin
- novolak type
- parts
- composition
- approximately
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims description 36
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 229920003986 novolac Polymers 0.000 claims description 29
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 239000003504 photosensitizing agent Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 12
- 229920001228 polyisocyanate Polymers 0.000 claims description 11
- 239000005056 polyisocyanate Substances 0.000 claims description 11
- -1 phenol-formaldehyde compound Chemical class 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000004132 cross linking Methods 0.000 claims description 8
- 229920000728 polyester Polymers 0.000 claims description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- 229920001568 phenolic resin Polymers 0.000 claims description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 6
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- 125000005442 diisocyanate group Chemical group 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- QEVHRUUCFGRFIF-MDEJGZGSSA-N reserpine Chemical compound O([C@H]1[C@@H]([C@H]([C@H]2C[C@@H]3C4=C(C5=CC=C(OC)C=C5N4)CCN3C[C@H]2C1)C(=O)OC)OC)C(=O)C1=CC(OC)=C(OC)C(OC)=C1 QEVHRUUCFGRFIF-MDEJGZGSSA-N 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 description 28
- 229920002120 photoresistant polymer Polymers 0.000 description 25
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 239000000463 material Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 9
- 239000000470 constituent Substances 0.000 description 8
- 238000011161 development Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 125000006222 dimethylaminomethyl group Chemical group [H]C([H])([H])N(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 229920000609 methyl cellulose Polymers 0.000 description 3
- 239000001923 methylcellulose Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- GPRLTFBKWDERLU-UHFFFAOYSA-N bicyclo[2.2.2]octane Chemical compound C1CC2CCC1CC2 GPRLTFBKWDERLU-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000008707 rearrangement Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 2
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical group C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000001412 amines Chemical group 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- JXCHMDATRWUOAP-UHFFFAOYSA-N diisocyanatomethylbenzene Chemical compound O=C=NC(N=C=O)C1=CC=CC=C1 JXCHMDATRWUOAP-UHFFFAOYSA-N 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- BTQXIESSQVRLCV-UHFFFAOYSA-N epi-catalponol Natural products C1=CC=C2C(=O)C(CC=C(C)C)CC(O)C2=C1 BTQXIESSQVRLCV-UHFFFAOYSA-N 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000011221 initial treatment Methods 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US93998978A | 1978-09-06 | 1978-09-06 | |
| US93998978 | 1978-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| LU81652A1 true LU81652A1 (fr) | 1980-04-21 |
Family
ID=25474042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LU81652A LU81652A1 (fr) | 1978-09-06 | 1979-09-05 | Composition pour photoreserve positive |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS5546746A (enrdf_load_stackoverflow) |
| BR (1) | BR7905714A (enrdf_load_stackoverflow) |
| CA (1) | CA1119447A (enrdf_load_stackoverflow) |
| DE (1) | DE2935904A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2435741B1 (enrdf_load_stackoverflow) |
| GB (1) | GB2031442B (enrdf_load_stackoverflow) |
| IT (1) | IT1162658B (enrdf_load_stackoverflow) |
| LU (1) | LU81652A1 (enrdf_load_stackoverflow) |
| NL (1) | NL7906588A (enrdf_load_stackoverflow) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56140342A (en) * | 1980-04-02 | 1981-11-02 | Tokyo Ohka Kogyo Co Ltd | Image forming composition and formation of resist image |
| JPS58152236A (ja) * | 1982-03-05 | 1983-09-09 | Toray Ind Inc | 感光性組成物 |
| JPS6120939A (ja) * | 1984-07-10 | 1986-01-29 | Fuji Photo Film Co Ltd | 平版印刷版用感光性組成物 |
| US4680346A (en) * | 1985-12-13 | 1987-07-14 | Ppg Industries, Inc. | Flexible primer composition and method of providing a substrate with a flexible multilayer coating |
| JPH0654390B2 (ja) * | 1986-07-18 | 1994-07-20 | 東京応化工業株式会社 | 高耐熱性ポジ型ホトレジスト組成物 |
| JPS6380254A (ja) * | 1986-09-24 | 1988-04-11 | Fuji Photo Film Co Ltd | 感光性組成物 |
| JPS6463856A (en) * | 1987-05-12 | 1989-03-09 | Sumitomo Metal Ind | Method and apparatus for automatic ultrasonic flaw detection of pipe end |
| EP0413087A1 (en) * | 1989-07-20 | 1991-02-20 | International Business Machines Corporation | Photosensitive composition and use thereof |
| DE3927631A1 (de) * | 1989-08-22 | 1991-02-28 | Basf Ag | Umsetzungsprodukt, verfahren zu dessen herstellung und damit herstellbares strahlungsempfindliches gemisch |
| WO1997019819A1 (en) * | 1995-11-24 | 1997-06-05 | Horsell Graphic Industries Limited | Hydrophilized support for planographic printing plates and its preparation |
| GB9624224D0 (en) | 1996-11-21 | 1997-01-08 | Horsell Graphic Ind Ltd | Planographic printing |
| GB9702568D0 (en) * | 1997-02-07 | 1997-03-26 | Horsell Graphic Ind Ltd | Planographic printing |
| GB9710552D0 (en) | 1997-05-23 | 1997-07-16 | Horsell Graphic Ind Ltd | Planographic printing |
| US6357351B1 (en) | 1997-05-23 | 2002-03-19 | Kodak Polychrome Graphics Llc | Substrate for planographic printing |
| US6293197B1 (en) | 1999-08-17 | 2001-09-25 | Kodak Polychrome Graphics | Hydrophilized substrate for planographic printing |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1538320A (fr) * | 1965-11-02 | 1968-09-06 | Ferrania Spa | Procédé de fabrication de matrices présensibilisées pour l'impression offset |
| BE789196A (fr) * | 1971-09-25 | 1973-03-22 | Kalle Ag | Matiere a copier photosensible |
| CH576739A5 (enrdf_load_stackoverflow) * | 1972-08-25 | 1976-06-15 | Ciba Geigy Ag | |
| AR205345A1 (es) * | 1973-06-20 | 1976-04-30 | Minnesota Mining & Mfg | Composicion organofilica fotosensible y placa litografica preparada con la misma |
| DE2617088A1 (de) * | 1975-04-29 | 1976-11-11 | Hoechst Co American | Lichtempfindliche kopiermasse |
-
1979
- 1979-08-10 CA CA000333505A patent/CA1119447A/en not_active Expired
- 1979-09-03 NL NL7906588A patent/NL7906588A/nl not_active Application Discontinuation
- 1979-09-05 GB GB7930761A patent/GB2031442B/en not_active Expired
- 1979-09-05 DE DE19792935904 patent/DE2935904A1/de active Granted
- 1979-09-05 IT IT50175/79A patent/IT1162658B/it active
- 1979-09-05 LU LU81652A patent/LU81652A1/fr unknown
- 1979-09-05 FR FR7922164A patent/FR2435741B1/fr not_active Expired
- 1979-09-05 BR BR7905714A patent/BR7905714A/pt not_active IP Right Cessation
- 1979-09-06 JP JP11470279A patent/JPS5546746A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2435741A1 (fr) | 1980-04-04 |
| IT7950175A0 (it) | 1979-09-05 |
| NL7906588A (nl) | 1980-03-10 |
| BR7905714A (pt) | 1980-05-13 |
| GB2031442B (en) | 1982-11-10 |
| FR2435741B1 (fr) | 1986-10-03 |
| DE2935904A1 (de) | 1980-03-20 |
| DE2935904C2 (enrdf_load_stackoverflow) | 1991-03-07 |
| CA1119447A (en) | 1982-03-09 |
| JPS5546746A (en) | 1980-04-02 |
| GB2031442A (en) | 1980-04-23 |
| IT1162658B (it) | 1987-04-01 |
| JPS6244256B2 (enrdf_load_stackoverflow) | 1987-09-18 |
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