LT2873751T - Tiesioginio perkėlimo ant pagrindo būdas perduodant ultratrumpųjų lazerio impulsų paketo energiją - Google Patents

Tiesioginio perkėlimo ant pagrindo būdas perduodant ultratrumpųjų lazerio impulsų paketo energiją

Info

Publication number
LT2873751T
LT2873751T LTEP14193911.6T LT14193911T LT2873751T LT 2873751 T LT2873751 T LT 2873751T LT 14193911 T LT14193911 T LT 14193911T LT 2873751 T LT2873751 T LT 2873751T
Authority
LT
Lithuania
Prior art keywords
substrate
energy transfer
laser pulse
pulse energy
deposition onto
Prior art date
Application number
LTEP14193911.6T
Other languages
English (en)
Inventor
S. Abbas Hosseini
Original Assignee
Rofin-Sinar Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rofin-Sinar Technologies, Inc. filed Critical Rofin-Sinar Technologies, Inc.
Publication of LT2873751T publication Critical patent/LT2873751T/lt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02697Forming conducting materials on a substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0008Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
LTEP14193911.6T 2013-11-19 2014-11-19 Tiesioginio perkėlimo ant pagrindo būdas perduodant ultratrumpųjų lazerio impulsų paketo energiją LT2873751T (lt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201361906309P 2013-11-19 2013-11-19

Publications (1)

Publication Number Publication Date
LT2873751T true LT2873751T (lt) 2017-06-26

Family

ID=52023167

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEP14193911.6T LT2873751T (lt) 2013-11-19 2014-11-19 Tiesioginio perkėlimo ant pagrindo būdas perduodant ultratrumpųjų lazerio impulsų paketo energiją

Country Status (8)

Country Link
US (1) US10252507B2 (lt)
EP (1) EP2873751B1 (lt)
JP (1) JP6181031B2 (lt)
KR (1) KR101736398B1 (lt)
CN (1) CN104674212B (lt)
DK (1) DK2873751T3 (lt)
LT (1) LT2873751T (lt)
TW (1) TWI570775B (lt)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6316991B2 (ja) 2014-06-20 2018-04-25 ヴェロ・スリー・ディー・インコーポレイテッド 3次元物体を生成するための方法
US10384306B1 (en) 2015-06-10 2019-08-20 Seagate Technology Llc Laser cutting array with multiple laser source arrangement
WO2017015217A2 (en) * 2015-07-20 2017-01-26 Velo3D, Inc. Transfer of particulate material
US9676145B2 (en) 2015-11-06 2017-06-13 Velo3D, Inc. Adept three-dimensional printing
CN108883575A (zh) 2016-02-18 2018-11-23 维洛3D公司 准确的三维打印
KR101877452B1 (ko) * 2016-05-19 2018-08-09 한국기계연구원 도전 물질의 패터닝 장치 및 방법
US11691343B2 (en) 2016-06-29 2023-07-04 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
JP6775822B2 (ja) * 2016-09-28 2020-10-28 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置
WO2018064349A1 (en) 2016-09-30 2018-04-05 Velo3D, Inc. Three-dimensional objects and their formation
US20180126462A1 (en) 2016-11-07 2018-05-10 Velo3D, Inc. Gas flow in three-dimensional printing
WO2018129089A1 (en) 2017-01-05 2018-07-12 Velo3D, Inc. Optics in three-dimensional printing
US10357829B2 (en) 2017-03-02 2019-07-23 Velo3D, Inc. Three-dimensional printing of three-dimensional objects
US20180281237A1 (en) 2017-03-28 2018-10-04 Velo3D, Inc. Material manipulation in three-dimensional printing
JP6888809B2 (ja) * 2017-03-30 2021-06-16 三星ダイヤモンド工業株式会社 金属膜付き脆性材料基板の分断方法並びに分断装置
DE102018005010A1 (de) * 2017-07-13 2019-01-17 Wika Alexander Wiegand Se & Co. Kg Transfer und Aufschmelzen von Schichten
US10272525B1 (en) 2017-12-27 2019-04-30 Velo3D, Inc. Three-dimensional printing systems and methods of their use
US10144176B1 (en) 2018-01-15 2018-12-04 Velo3D, Inc. Three-dimensional printing systems and methods of their use
KR102337659B1 (ko) * 2018-02-21 2021-12-09 삼성전자주식회사 금형 검사 장치 및 금형 검사 방법
DK3543371T3 (da) 2018-03-22 2021-04-06 Fund I D Automocion Y Mecatronica Kontinuerlig laserinduceret fremad-overføring af et materialesystem
CN112272966B (zh) * 2018-06-20 2024-02-02 信越化学工业株式会社 转移装置、使用方法和调整方法
CN110039205B (zh) * 2019-04-30 2021-07-20 大族激光科技产业集团股份有限公司 Led晶圆片的加工方法
CN110422993A (zh) * 2019-07-03 2019-11-08 大族激光科技产业集团股份有限公司 激光焊接方法及装置
JP2022544339A (ja) 2019-07-26 2022-10-17 ヴェロ3ディー,インコーポレーテッド 三次元オブジェクトの形成における品質保証
CN110568023A (zh) * 2019-08-01 2019-12-13 国网浙江省电力有限公司温州供电公司 一种气体传感器及其制备方法
FR3102377B1 (fr) * 2019-10-29 2022-03-18 Univ Bordeaux Equipement et procédé de dépôt par projection de particules par ondes de choc laser
CN110972406B (zh) * 2019-12-04 2020-07-28 广东工业大学 一种用于精细线路的修复方法
CN110753454B (zh) * 2019-12-04 2020-08-18 广东工业大学 一种用于精细线路的成型及修复方法
CN115341180A (zh) * 2022-07-29 2022-11-15 松山湖材料实验室 激光扫描溅射部件
DE102022114645A1 (de) 2022-06-10 2023-12-21 Trumpf Laser Gmbh Verfahren und Vorrichtung zum Verarbeiten mindestens eines Teilbereichs eines Schichtsystems
FR3141092A1 (fr) 2022-10-20 2024-04-26 Poietis Manipulation et transfert d’objets par propulsion
FR3141091A1 (fr) 2022-10-20 2024-04-26 Poietis Impression d’objets a partir d’un puits
CN116002991B (zh) * 2023-02-10 2023-07-04 广东工业大学 一种多层复合薄膜及其在激光精密成型中的应用

Family Cites Families (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5107510A (en) 1989-09-29 1992-04-21 Seguin Herb J J Apparatus and method for burst-mode operation of a pulsed laser
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5567336A (en) 1994-10-24 1996-10-22 Matsushita Electric Industrial Co., Ltd. Laser ablation forward metal deposition with electrostatic assisted bonding
US7218448B1 (en) 1997-03-17 2007-05-15 The Regents Of The University Of Colorado Extended depth of field optical systems
JP2724993B2 (ja) 1995-08-31 1998-03-09 株式会社小松製作所 レーザ加工装置およびレーザ装置
JPH1124103A (ja) * 1997-07-01 1999-01-29 Hitachi Ltd 液晶表示素子とその製造方法および製造装置
US6407360B1 (en) 1998-08-26 2002-06-18 Samsung Electronics, Co., Ltd. Laser cutting apparatus and method
US6177151B1 (en) * 1999-01-27 2001-01-23 The United States Of America As Represented By The Secretary Of The Navy Matrix assisted pulsed laser evaporation direct write
US6552301B2 (en) 2000-01-25 2003-04-22 Peter R. Herman Burst-ultrafast laser machining method
CA2332154C (en) 2000-01-25 2009-09-15 Peter R. Herman Burst-ultrafast laser machining method
US6417485B1 (en) 2000-05-30 2002-07-09 Igor Troitski Method and laser system controlling breakdown process development and space structure of laser radiation for production of high quality laser-induced damage images
JP3651585B2 (ja) * 2000-11-09 2005-05-25 三菱電機株式会社 レーザ加工方法
SG108262A1 (en) 2001-07-06 2005-01-28 Inst Data Storage Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
JP4345278B2 (ja) * 2001-09-14 2009-10-14 セイコーエプソン株式会社 パターニング方法、膜形成方法、パターニング装置、有機エレクトロルミネッセンス素子の製造方法、カラーフィルタの製造方法、電気光学装置の製造方法、及び電子装置の製造方法
DE10213044B3 (de) 2002-03-22 2004-01-29 Freie Universität Berlin, Körperschaft des öffentlichen Rechts Verfahren zur Materialbearbeitung und/oder Materialanalyse mit Lasern
CA2428187C (en) 2002-05-08 2012-10-02 National Research Council Of Canada Method of fabricating sub-micron structures in transparent dielectric materials
CN1241253C (zh) 2002-06-24 2006-02-08 丰田合成株式会社 半导体元件的制造方法
US20040017428A1 (en) 2002-07-25 2004-01-29 John Cronin Method of using a sacrificial layer to create smooth exit holes using a laser drilling system
US7063596B2 (en) 2003-06-09 2006-06-20 David Benderly Vibratory material removal system, tool and method
JP2005028438A (ja) 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
KR101119387B1 (ko) 2003-07-18 2012-03-07 하마마츠 포토닉스 가부시키가이샤 절단방법
US7060933B2 (en) 2004-06-08 2006-06-13 Igor Troitski Method and laser system for production of laser-induced images inside and on the surface of transparent material
US7211184B2 (en) 2004-08-04 2007-05-01 Ast Management Inc. Capillary electrophoresis devices
JP4692717B2 (ja) 2004-11-02 2011-06-01 澁谷工業株式会社 脆性材料の割断装置
US7303977B2 (en) 2004-11-10 2007-12-04 Intel Corporation Laser micromachining method
JP4776911B2 (ja) 2004-11-19 2011-09-21 キヤノン株式会社 レーザ加工装置およびレーザ加工方法
US20060207976A1 (en) 2005-01-21 2006-09-21 Bovatsek James M Laser material micromachining with green femtosecond pulses
JP2006305803A (ja) 2005-04-27 2006-11-09 Japan Drilling Co Ltd 岩石又はコンクリートの加工方法及びその装置
DE102005039833A1 (de) 2005-08-22 2007-03-01 Rowiak Gmbh Vorrichtung und Verfahren zur Materialtrennung mit Laserpulsen
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US7626138B2 (en) 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US8835802B2 (en) 2006-01-24 2014-09-16 Stephen C. Baer Cleaving wafers from silicon crystals
TWI431380B (zh) * 2006-05-12 2014-03-21 Photon Dynamics Inc 沉積修復設備及方法
JP2007307599A (ja) 2006-05-20 2007-11-29 Sumitomo Electric Ind Ltd スルーホール成形体およびレーザー加工方法
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US20070298529A1 (en) 2006-05-31 2007-12-27 Toyoda Gosei, Co., Ltd. Semiconductor light-emitting device and method for separating semiconductor light-emitting devices
JP2008193067A (ja) * 2007-01-10 2008-08-21 Sumitomo Electric Ind Ltd 金属膜パターン形成方法
JP2009066627A (ja) 2007-09-13 2009-04-02 Aisin Seiki Co Ltd レーザ加工による研磨方法、研磨装置及び研磨された切削工具
US8729426B2 (en) 2008-12-13 2014-05-20 M-Solv Ltd. Method and apparatus for laser machining relatively narrow and relatively wide structures
JP5271092B2 (ja) 2009-01-09 2013-08-21 エヌイーシーコンピュータテクノ株式会社 電気機器
US8309885B2 (en) * 2009-01-15 2012-11-13 Electro Scientific Industries, Inc. Pulse temporal programmable ultrafast burst mode laser for micromachining
US10307862B2 (en) 2009-03-27 2019-06-04 Electro Scientific Industries, Inc Laser micromachining with tailored bursts of short laser pulses
US7960242B2 (en) * 2009-04-14 2011-06-14 Monolithic 3D Inc. Method for fabrication of a semiconductor device and structure
US20100279067A1 (en) 2009-04-30 2010-11-04 Robert Sabia Glass sheet having enhanced edge strength
DE102009020774B4 (de) * 2009-05-05 2011-01-05 Universität Stuttgart Verfahren zum Kontaktieren eines Halbleitersubstrates
DE102009029903A1 (de) * 2009-06-19 2010-12-23 Tesa Se Verfahren zum Aufbringen einer dauerhaften Prozessmarke auf einem Produkt, insbesondere Glas
JP2011056519A (ja) * 2009-09-07 2011-03-24 Osaka Univ 接合方法および接合体の製造方法
US20120234807A1 (en) 2009-12-07 2012-09-20 J.P. Sercel Associates Inc. Laser scribing with extended depth affectation into a workplace
JP2011174134A (ja) * 2010-02-24 2011-09-08 Idemitsu Kosan Co Ltd In−Ga−Sn系酸化物焼結体、ターゲット、酸化物半導体膜、及び半導体素子
SG187059A1 (en) * 2010-07-12 2013-02-28 Filaser Inc Method of material processing by laser filamentation
JP5089735B2 (ja) 2010-07-15 2012-12-05 株式会社レーザーシステム レーザ加工装置
CA2823806C (en) 2011-01-10 2017-08-29 Universite Laval Laser reinforced direct bonding of optical components
JP2012151394A (ja) * 2011-01-21 2012-08-09 Dainippon Screen Mfg Co Ltd 射出装置およびパターン形成装置、並びに、射出方法およびパターン形成方法
US20120235969A1 (en) 2011-03-15 2012-09-20 Qualcomm Mems Technologies, Inc. Thin film through-glass via and methods for forming same
JP5731063B2 (ja) * 2011-04-08 2015-06-10 エーエスエムエル ネザーランズ ビー.ブイ. リソグラフィ装置、プログラマブル・パターニングデバイス、及びリソグラフィ方法
US9192056B2 (en) * 2011-09-12 2015-11-17 Lawrence Livermore National Security, Llc Methods and system for controlled laser-driven explosive bonding
US8969220B2 (en) 2012-01-13 2015-03-03 Imra America, Inc. Methods and systems for laser processing of coated substrates
US20130293482A1 (en) 2012-05-04 2013-11-07 Qualcomm Mems Technologies, Inc. Transparent through-glass via
US8842358B2 (en) 2012-08-01 2014-09-23 Gentex Corporation Apparatus, method, and process with laser induced channel edge
CN102785031B (zh) 2012-08-15 2015-04-01 武汉隽龙科技有限公司 一种利用超短脉冲激光的透明材料切割方法及切割装置
US20140079570A1 (en) 2012-09-17 2014-03-20 GM Global Technology Operations LLC Launch torus torque converter
DE102012110971A1 (de) 2012-11-14 2014-05-15 Schott Ag Trennen von transparenten Werkstücken
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
JP6208430B2 (ja) 2013-01-25 2017-10-04 株式会社ディスコ レーザー加工方法
KR20150110707A (ko) 2013-02-04 2015-10-02 뉴포트 코포레이션 투명 및 반투명 기재의 레이저 절단 방법 및 장치
JP6392789B2 (ja) 2013-02-28 2018-09-19 アイピージー フォトニクス コーポレーション サファイアを処理するためのレーザーシステム及びそれを用いた方法
US9481598B2 (en) 2013-03-15 2016-11-01 Kinestral Technologies, Inc. Laser cutting strengthened glass
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
EP2964417B1 (de) 2013-04-04 2022-01-12 LPKF Laser & Electronics AG Verfahren zum einbringen von durchbrechungen in ein substrat
JP6162827B2 (ja) 2013-04-04 2017-07-12 エル・ピー・ケー・エフ・レーザー・ウント・エレクトロニクス・アクチエンゲゼルシヤフト 基板を分離する方法及び装置
US9102011B2 (en) 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses
US20150034613A1 (en) 2013-08-02 2015-02-05 Rofin-Sinar Technologies Inc. System for performing laser filamentation within transparent materials
US20150121960A1 (en) 2013-11-04 2015-05-07 Rofin-Sinar Technologies Inc. Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses
DE102013223637B4 (de) 2013-11-20 2018-02-01 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Behandeln eines lasertransparenten Substrats zum anschließenden Trennen des Substrats
US10144088B2 (en) 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
WO2015095264A2 (en) 2013-12-17 2015-06-25 Corning Incorporated 3-d forming of glass
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US20150166393A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser cutting of ion-exchangeable glass substrates
EP3166894A1 (en) 2014-07-11 2017-05-17 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
EP3169635B1 (en) 2014-07-14 2022-11-23 Corning Incorporated Method and system for forming perforations
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
EP3221727B1 (de) 2014-11-19 2021-03-17 Trumpf Laser- und Systemtechnik GmbH System zur asymmetrischen optischen strahlformung

Also Published As

Publication number Publication date
JP6181031B2 (ja) 2017-08-16
EP2873751B1 (en) 2017-02-01
US20150140229A1 (en) 2015-05-21
CN104674212A (zh) 2015-06-03
TW201528338A (zh) 2015-07-16
TWI570775B (zh) 2017-02-11
KR101736398B1 (ko) 2017-05-29
US10252507B2 (en) 2019-04-09
JP2015099922A (ja) 2015-05-28
KR20150058075A (ko) 2015-05-28
DK2873751T3 (en) 2017-05-01
CN104674212B (zh) 2017-10-31
EP2873751A1 (en) 2015-05-20

Similar Documents

Publication Publication Date Title
LT2873751T (lt) Tiesioginio perkėlimo ant pagrindo būdas perduodant ultratrumpųjų lazerio impulsų paketo energiją
EP2910532B8 (en) Method of machining and releasing closed forms from a transparent substrate using burst of ultrafast laser pulses
GB2516775B (en) Coating surfaces by a printing method
AP2016009229A0 (en) A method for controlling rust
PT2683669T (pt) Processo de obtenção de um substrato munido de um revestimento
EP3033689A4 (en) A penalty method for pde-constrained optimization
PL2839054T3 (pl) Sposób otrzymywania podłoża powlekanego
EP2946031A4 (en) METHOD FOR PRODUCING A CHROMATE BLOCK ON A METAL SUBSTRATE
EP3092268A4 (en) Energy curable inks with improved adhesion a method for formulating
EP2993708A4 (en) LASER WELDING METHOD FOR CONNECTING CRYSTALLINE SILICON SOLAR CELLS
PL3176487T3 (pl) Sposób powlekania rur
PL3027980T3 (pl) Sposób przeprowadzenia elektrokalorycznej konwersji energii
EP3090229A4 (en) Element for a thermal energy storage
EP3052267C0 (en) METHOD OF AUTOMATIC STUD WELDING ON A BEAM
GB201417260D0 (en) Method for forming a coating or three-dimensional structural elements of tial on substrate surfaces by means of laser build-up welding
PL3074204T3 (pl) Sposób spawania laserowego zespołu testowego jednorazowego użytku
ZA201604227B (en) Method for assessing parameters for controlling a solar tracker
IL240401B (en) A method to reduce energy consumption through thermal coupling
PL2999551T3 (pl) Sposób powlekania pojemników
GB2579491B (en) Protective coating for a substrate
EP3079665A4 (en) Method for controlled release with femtosecond laser pulses
SG11201500185SA (en) High-power pulse coating method
EP3024900A4 (en) Process for depositing metal on a substrate
IL249157B (en) A system for spatial recombination of very short laser pulses using a diffractive component
IL243136A (en) A method of coating tools with layers of titanium nitrate silicon