KR970069226A - 레이저 가공 장치 - Google Patents
레이저 가공 장치 Download PDFInfo
- Publication number
- KR970069226A KR970069226A KR1019960053389A KR19960053389A KR970069226A KR 970069226 A KR970069226 A KR 970069226A KR 1019960053389 A KR1019960053389 A KR 1019960053389A KR 19960053389 A KR19960053389 A KR 19960053389A KR 970069226 A KR970069226 A KR 970069226A
- Authority
- KR
- South Korea
- Prior art keywords
- optical system
- phase transfer
- mask
- controlling
- transfer optical
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
- G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lenses (AREA)
Abstract
집광 광학계와 상전사 광학계의 양자를 구비하고 가공 대상에 따라 각각 사용함으로써 가공할 수 있는 영역을 넓게 할 수 있고 또 가공정밀도를 높일 수 있는 레이저 가공장치를 얻는 것이다.
레이저 발진기(1)와 피가공물(7) 사이의 광로중에 삽입된 마스크 및 이 마스크의 상을 가공면에 축소결상하는 렌즈를 갖는 상전사 광학계(3)와 집광 광학계(5)와 상전사 광학계(3)와 집광 광학계(5)의 어느 한쪽을 선택하는 구동장치(선택수단)(11)과 상전사 광학계(3)와 집광 광학계(5)와 구동 장치(11)를 제어하는 NC장치(9)를 구비하고 가공하는 구멍직경과 구멍깊이에 따라 상전사 광학계(3)와 집광 광학계(5)의 어느 한쪽을 선택하는 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 이 발명의 제1 및 제2의 실시의 형태에 의한 레이저 가공기의 구성도, 제5도는 이 발명의 제3의 실시의 형태에 의한 제어방법의 플로 차트도, 제8도는 이 발명의 제5및 제6의 실시의 형태에 의한 상전사 광학계의 구성도.
Claims (4)
- 레이저 발진기와 피가공물 사이의 광로중에 삽입된 마스크 및 이 마스크의 상을 가공면에 축소 결상하는 렌즈를 갖는 상전사 광학계와 집광 광학계와 상기 상전사 광학계와 상기 집광 광학계의 어느 하나를 선택하는 선택수단과 상기 상전사 광학계와 상기 집광 광학계와 상기 선택 수단을 제어하는 NC장치를 구비하고 가공내용 및 가공조건에 따라 상기 상전사 광학계와 상기 집광 광학계의 어느 것을 선택하는 것을 특징으로 하는 레이저 가공장치.
- 레이저 발진기와 피가공물 사이의 광로중에 삽입된 위치 가변의 마스크 및 이 마스크의 상을 가공면에 축소결상하는 곡률가변미러을 갖는 상전사 광학계와 이 상전사 광학계를 제어하는 NC장치를 구비하고 상기 곡률 가변 미러의 곡률과 상기 마스크의 위치를 제어하는 것을 특징으로 하는 레이저 가공장치.
- 레이저 발진기와 피가공물 사이의 광로중에 삽입된 마스크와 이 마스크의 상을 가공면에 축소결상하는 곡률가변미러와 가공면과 상기 곡률가변미러 사이의 거리를 변화시키는 가변수단을 갖는 상전사 광학계와 이 상전사 광학계를 제어하는 NC장치를 구비하고 구멍직경에 따라 상기 곡률 가변미러의 곡률과 상기 가공면과 상기 곡률 가변 미러 사이의 거리를 제어하는 것을 특징으로 하는 레이저 가공장치.
- 레이저 발진기와 피가공물 사이의 광로중에 삽입된 마스크 및 이 마스크의 상을 가공면에 축소 결상하는 렌즈를 갖는 상전사 광학계와 이 상전사 광학계를 제어하는 NC장치를 구비하고 상기 마스크의 레이저 빔 입사 측에서의 레이저 빔 직경을 변화시킴으로써 상기 마스크를 통과하는 에너지를 조절하고, 가공면상에서의 에너지를 조절하는 것을 특징으로 하는 레이저 가공장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10269096A JP3473268B2 (ja) | 1996-04-24 | 1996-04-24 | レーザ加工装置 |
JP96-102690 | 1996-04-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970069226A true KR970069226A (ko) | 1997-11-07 |
KR100231716B1 KR100231716B1 (ko) | 1999-11-15 |
Family
ID=14334255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960053389A KR100231716B1 (ko) | 1996-04-24 | 1996-11-12 | 레이저 가공장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5933218A (ko) |
JP (1) | JP3473268B2 (ko) |
KR (1) | KR100231716B1 (ko) |
CN (2) | CN1104302C (ko) |
HK (1) | HK1056522A1 (ko) |
TW (1) | TW320585B (ko) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11207477A (ja) | 1998-01-26 | 1999-08-03 | Mitsubishi Electric Corp | きさげ加工装置およびきさげ加工方法 |
DE10045973A1 (de) * | 2000-09-16 | 2002-04-04 | Bosch Gmbh Robert | Optische Vorrichtung zum Bohren mittels Laserstrahl |
JP4134503B2 (ja) * | 2000-10-11 | 2008-08-20 | 松下電器産業株式会社 | 回路形成基板の製造方法 |
JP4278389B2 (ja) * | 2001-05-11 | 2009-06-10 | 三菱電機株式会社 | 積層材料のレーザ加工方法および装置 |
US6951627B2 (en) * | 2002-04-26 | 2005-10-04 | Matsushita Electric Industrial Co., Ltd. | Method of drilling holes with precision laser micromachining |
TWI221102B (en) * | 2002-08-30 | 2004-09-21 | Sumitomo Heavy Industries | Laser material processing method and processing device |
US20050155956A1 (en) | 2002-08-30 | 2005-07-21 | Sumitomo Heavy Industries, Ltd. | Laser processing method and processing device |
US7880117B2 (en) | 2002-12-24 | 2011-02-01 | Panasonic Corporation | Method and apparatus of drilling high density submicron cavities using parallel laser beams |
DE102004013886A1 (de) | 2004-03-16 | 2005-10-06 | Carl Zeiss Smt Ag | Verfahren zur Mehrfachbelichtung, Mikrolithografie-Projektionsbelichtungsanlage und Projektionssystem |
US7425471B2 (en) * | 2004-06-18 | 2008-09-16 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
US7435927B2 (en) * | 2004-06-18 | 2008-10-14 | Electron Scientific Industries, Inc. | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
US8383982B2 (en) * | 2004-06-18 | 2013-02-26 | Electro Scientific Industries, Inc. | Methods and systems for semiconductor structure processing using multiple laser beam spots |
US7633034B2 (en) * | 2004-06-18 | 2009-12-15 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
US8148211B2 (en) * | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
US7629234B2 (en) * | 2004-06-18 | 2009-12-08 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling |
US7935941B2 (en) * | 2004-06-18 | 2011-05-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
US7687740B2 (en) * | 2004-06-18 | 2010-03-30 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows |
KR100598521B1 (ko) | 2005-04-07 | 2006-07-10 | 현대자동차주식회사 | 레이저빔을 이용한 용접장치 |
JP2006344697A (ja) * | 2005-06-07 | 2006-12-21 | Sharp Corp | 多層配線板及びその製造方法 |
US7970487B2 (en) * | 2006-11-30 | 2011-06-28 | National Optronics, Inc. | Method of calibrating an ophthalmic processing device, machine programmed therefor, and computer program |
JP5692969B2 (ja) | 2008-09-01 | 2015-04-01 | 浜松ホトニクス株式会社 | 収差補正方法、この収差補正方法を用いたレーザ加工方法、この収差補正方法を用いたレーザ照射方法、収差補正装置、及び、収差補正プログラム |
KR101010770B1 (ko) * | 2008-10-06 | 2011-01-25 | 배응준 | 패터닝 및 마킹 기능 복합 레이저 장치 및 이를 구비한 복합 레이저 장비 |
EP2204468B1 (en) * | 2009-01-06 | 2012-10-17 | Solmates B.V. | Device for projecting an image on a surface and device for moving said image |
DE102011000768B4 (de) * | 2011-02-16 | 2016-08-18 | Ewag Ag | Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung mit umschaltbarer Laseranordnung |
KR20130141692A (ko) * | 2011-04-08 | 2013-12-26 | 미쓰비시덴키 가부시키가이샤 | 고체 레이저 장치 |
CN103381522A (zh) * | 2012-05-02 | 2013-11-06 | 鸿富锦精密工业(深圳)有限公司 | 激光网点加工的光学系统 |
TWI606880B (zh) * | 2012-09-13 | 2017-12-01 | Hamamatsu Photonics Kk | Optical modulation control method, control program, control device, and laser light irradiation device |
CN105033457B (zh) * | 2015-08-03 | 2017-07-21 | 东莞市德瑞精密设备有限公司 | 电池模组激光分时焊接机 |
CN105278553B (zh) * | 2015-10-13 | 2018-09-21 | 华中科技大学 | 一种双控制器同步轮廓控制方法 |
WO2019146021A1 (ja) * | 2018-01-24 | 2019-08-01 | ギガフォトン株式会社 | レーザ加工方法及びレーザ加工システム |
CN113210856B (zh) * | 2021-04-22 | 2022-07-19 | 广东工业大学 | Pcb短波长脉冲激光钻孔方法及相关钻孔装置 |
CN114185121A (zh) * | 2021-11-24 | 2022-03-15 | 四川橙科通信技术研究院有限责任公司 | 一种高效率制作光栅的双工位飞秒激光系统 |
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JPS61160934A (ja) * | 1985-01-10 | 1986-07-21 | Canon Inc | 投影光学装置 |
JPS643664A (en) * | 1987-06-26 | 1989-01-09 | Hitachi Ltd | Laser beam marking device |
US5105075A (en) * | 1988-09-19 | 1992-04-14 | Canon Kabushiki Kaisha | Projection exposure apparatus |
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JP2720744B2 (ja) * | 1992-12-28 | 1998-03-04 | 三菱電機株式会社 | レーザ加工機 |
JPH06218565A (ja) * | 1993-01-20 | 1994-08-09 | Mitsubishi Electric Corp | レーザ加工装置 |
JP3235078B2 (ja) * | 1993-02-24 | 2001-12-04 | 株式会社ニコン | 走査露光方法、露光制御装置、走査型露光装置、及びデバイス製造方法 |
JP3395280B2 (ja) * | 1993-09-21 | 2003-04-07 | 株式会社ニコン | 投影露光装置及び方法 |
US5486895A (en) * | 1994-04-22 | 1996-01-23 | Eastman Kodak Company | Optical system for printing normal and panoramic images |
JP3162254B2 (ja) * | 1995-01-17 | 2001-04-25 | 三菱電機株式会社 | レーザ加工装置 |
-
1996
- 1996-04-24 JP JP10269096A patent/JP3473268B2/ja not_active Expired - Lifetime
- 1996-09-26 TW TW085111784A patent/TW320585B/zh not_active IP Right Cessation
- 1996-11-05 US US08/740,956 patent/US5933218A/en not_active Expired - Fee Related
- 1996-11-12 KR KR1019960053389A patent/KR100231716B1/ko not_active IP Right Cessation
- 1996-11-13 CN CN96121009A patent/CN1104302C/zh not_active Expired - Lifetime
- 1996-11-13 CN CNB021268843A patent/CN1195603C/zh not_active Expired - Lifetime
-
2003
- 2003-12-05 HK HK03108879A patent/HK1056522A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1163177A (zh) | 1997-10-29 |
KR100231716B1 (ko) | 1999-11-15 |
JP3473268B2 (ja) | 2003-12-02 |
CN1425531A (zh) | 2003-06-25 |
CN1104302C (zh) | 2003-04-02 |
CN1195603C (zh) | 2005-04-06 |
HK1056522A1 (en) | 2004-02-20 |
US5933218A (en) | 1999-08-03 |
JPH09293946A (ja) | 1997-11-11 |
TW320585B (ko) | 1997-11-21 |
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