HK1056522A1 - Laser beam machining apparatus. - Google Patents
Laser beam machining apparatus.Info
- Publication number
- HK1056522A1 HK1056522A1 HK03108879A HK03108879A HK1056522A1 HK 1056522 A1 HK1056522 A1 HK 1056522A1 HK 03108879 A HK03108879 A HK 03108879A HK 03108879 A HK03108879 A HK 03108879A HK 1056522 A1 HK1056522 A1 HK 1056522A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- laser beam
- machining apparatus
- beam machining
- laser
- machining
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
- G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Lenses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10269096A JP3473268B2 (ja) | 1996-04-24 | 1996-04-24 | レーザ加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1056522A1 true HK1056522A1 (en) | 2004-02-20 |
Family
ID=14334255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03108879A HK1056522A1 (en) | 1996-04-24 | 2003-12-05 | Laser beam machining apparatus. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5933218A (ko) |
JP (1) | JP3473268B2 (ko) |
KR (1) | KR100231716B1 (ko) |
CN (2) | CN1104302C (ko) |
HK (1) | HK1056522A1 (ko) |
TW (1) | TW320585B (ko) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11207477A (ja) | 1998-01-26 | 1999-08-03 | Mitsubishi Electric Corp | きさげ加工装置およびきさげ加工方法 |
DE10045973A1 (de) * | 2000-09-16 | 2002-04-04 | Bosch Gmbh Robert | Optische Vorrichtung zum Bohren mittels Laserstrahl |
JP4134503B2 (ja) * | 2000-10-11 | 2008-08-20 | 松下電器産業株式会社 | 回路形成基板の製造方法 |
EP1386689A1 (en) * | 2001-05-11 | 2004-02-04 | Mitsubishi Denki Kabushiki Kaisha | Method and device for laser beam machining of laminated material |
US6951627B2 (en) * | 2002-04-26 | 2005-10-04 | Matsushita Electric Industrial Co., Ltd. | Method of drilling holes with precision laser micromachining |
TWI221102B (en) * | 2002-08-30 | 2004-09-21 | Sumitomo Heavy Industries | Laser material processing method and processing device |
US20050155956A1 (en) | 2002-08-30 | 2005-07-21 | Sumitomo Heavy Industries, Ltd. | Laser processing method and processing device |
US7880117B2 (en) | 2002-12-24 | 2011-02-01 | Panasonic Corporation | Method and apparatus of drilling high density submicron cavities using parallel laser beams |
DE102004013886A1 (de) | 2004-03-16 | 2005-10-06 | Carl Zeiss Smt Ag | Verfahren zur Mehrfachbelichtung, Mikrolithografie-Projektionsbelichtungsanlage und Projektionssystem |
US7435927B2 (en) * | 2004-06-18 | 2008-10-14 | Electron Scientific Industries, Inc. | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
US8148211B2 (en) * | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
US7629234B2 (en) * | 2004-06-18 | 2009-12-08 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling |
US7633034B2 (en) * | 2004-06-18 | 2009-12-15 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
US8383982B2 (en) * | 2004-06-18 | 2013-02-26 | Electro Scientific Industries, Inc. | Methods and systems for semiconductor structure processing using multiple laser beam spots |
US7687740B2 (en) * | 2004-06-18 | 2010-03-30 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows |
US7923306B2 (en) * | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
US7935941B2 (en) * | 2004-06-18 | 2011-05-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
KR100598521B1 (ko) | 2005-04-07 | 2006-07-10 | 현대자동차주식회사 | 레이저빔을 이용한 용접장치 |
JP2006344697A (ja) * | 2005-06-07 | 2006-12-21 | Sharp Corp | 多層配線板及びその製造方法 |
US7970487B2 (en) * | 2006-11-30 | 2011-06-28 | National Optronics, Inc. | Method of calibrating an ophthalmic processing device, machine programmed therefor, and computer program |
JP5692969B2 (ja) | 2008-09-01 | 2015-04-01 | 浜松ホトニクス株式会社 | 収差補正方法、この収差補正方法を用いたレーザ加工方法、この収差補正方法を用いたレーザ照射方法、収差補正装置、及び、収差補正プログラム |
KR101010770B1 (ko) * | 2008-10-06 | 2011-01-25 | 배응준 | 패터닝 및 마킹 기능 복합 레이저 장치 및 이를 구비한 복합 레이저 장비 |
EP2204468B1 (en) * | 2009-01-06 | 2012-10-17 | Solmates B.V. | Device for projecting an image on a surface and device for moving said image |
DE102011000768B4 (de) * | 2011-02-16 | 2016-08-18 | Ewag Ag | Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung mit umschaltbarer Laseranordnung |
KR20130141692A (ko) * | 2011-04-08 | 2013-12-26 | 미쓰비시덴키 가부시키가이샤 | 고체 레이저 장치 |
CN103381522A (zh) * | 2012-05-02 | 2013-11-06 | 鸿富锦精密工业(深圳)有限公司 | 激光网点加工的光学系统 |
TWI606880B (zh) * | 2012-09-13 | 2017-12-01 | Hamamatsu Photonics Kk | Optical modulation control method, control program, control device, and laser light irradiation device |
CN105033457B (zh) * | 2015-08-03 | 2017-07-21 | 东莞市德瑞精密设备有限公司 | 电池模组激光分时焊接机 |
CN105278553B (zh) * | 2015-10-13 | 2018-09-21 | 华中科技大学 | 一种双控制器同步轮廓控制方法 |
WO2019146021A1 (ja) * | 2018-01-24 | 2019-08-01 | ギガフォトン株式会社 | レーザ加工方法及びレーザ加工システム |
CN113210856B (zh) * | 2021-04-22 | 2022-07-19 | 广东工业大学 | Pcb短波长脉冲激光钻孔方法及相关钻孔装置 |
CN114185121A (zh) * | 2021-11-24 | 2022-03-15 | 四川橙科通信技术研究院有限责任公司 | 一种高效率制作光栅的双工位飞秒激光系统 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61160934A (ja) * | 1985-01-10 | 1986-07-21 | Canon Inc | 投影光学装置 |
JPS643664A (en) * | 1987-06-26 | 1989-01-09 | Hitachi Ltd | Laser beam marking device |
US5105075A (en) * | 1988-09-19 | 1992-04-14 | Canon Kabushiki Kaisha | Projection exposure apparatus |
JP3336649B2 (ja) * | 1992-12-25 | 2002-10-21 | 株式会社ニコン | 露光装置、露光方法、及びその露光方法を含むデバイス製造方法、及びそのデバイス製造方法により製造されたデバイス |
JP2720744B2 (ja) * | 1992-12-28 | 1998-03-04 | 三菱電機株式会社 | レーザ加工機 |
JPH06218565A (ja) * | 1993-01-20 | 1994-08-09 | Mitsubishi Electric Corp | レーザ加工装置 |
JP3235078B2 (ja) * | 1993-02-24 | 2001-12-04 | 株式会社ニコン | 走査露光方法、露光制御装置、走査型露光装置、及びデバイス製造方法 |
JP3395280B2 (ja) * | 1993-09-21 | 2003-04-07 | 株式会社ニコン | 投影露光装置及び方法 |
US5486895A (en) * | 1994-04-22 | 1996-01-23 | Eastman Kodak Company | Optical system for printing normal and panoramic images |
JP3162254B2 (ja) * | 1995-01-17 | 2001-04-25 | 三菱電機株式会社 | レーザ加工装置 |
-
1996
- 1996-04-24 JP JP10269096A patent/JP3473268B2/ja not_active Expired - Lifetime
- 1996-09-26 TW TW085111784A patent/TW320585B/zh not_active IP Right Cessation
- 1996-11-05 US US08/740,956 patent/US5933218A/en not_active Expired - Fee Related
- 1996-11-12 KR KR1019960053389A patent/KR100231716B1/ko not_active IP Right Cessation
- 1996-11-13 CN CN96121009A patent/CN1104302C/zh not_active Expired - Lifetime
- 1996-11-13 CN CNB021268843A patent/CN1195603C/zh not_active Expired - Lifetime
-
2003
- 2003-12-05 HK HK03108879A patent/HK1056522A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP3473268B2 (ja) | 2003-12-02 |
JPH09293946A (ja) | 1997-11-11 |
CN1104302C (zh) | 2003-04-02 |
CN1195603C (zh) | 2005-04-06 |
KR970069226A (ko) | 1997-11-07 |
US5933218A (en) | 1999-08-03 |
TW320585B (ko) | 1997-11-21 |
CN1163177A (zh) | 1997-10-29 |
KR100231716B1 (ko) | 1999-11-15 |
CN1425531A (zh) | 2003-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20091113 |