KR970053292A - 반도체웨이퍼 공급장치 - Google Patents
반도체웨이퍼 공급장치 Download PDFInfo
- Publication number
- KR970053292A KR970053292A KR1019950049284A KR19950049284A KR970053292A KR 970053292 A KR970053292 A KR 970053292A KR 1019950049284 A KR1019950049284 A KR 1019950049284A KR 19950049284 A KR19950049284 A KR 19950049284A KR 970053292 A KR970053292 A KR 970053292A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor wafer
- stopper member
- wafer
- supply apparatus
- eccentric cam
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명은 본 반도체웨이퍼를 소정위치로 공급하기 위한 반도체웨이퍼 공급장치에 관한 것이다.
본 발명의 반도체웨이퍼 공급장치, 이송되는 반도체웨이퍼를 소정의 위치에서 정지시키기 위한 구조가 개선되어, 공급될 반도체웨이퍼의 규격이 변경되더라도 스토퍼를 일일이 작업자가 교체해줄 필요가 없게 되므로, 작업의 전자동화가 가능하며 반도체웨이퍼 취급환경을 청결하게 유지할 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 따른 반도체웨이퍼 공급장치의 일 예의 개략적 평면도.
제4도는 제3도에 도시된 장치의 Ⅳ-Ⅳ선 단면도.
Claims (3)
- 반도체웨이퍼를 수평이송시키는 웨이퍼 이송부와, 이 웨이퍼 이송부에 의해 이송되는 반도체웨이퍼를 그 이송경로상의 소정위치에서 정지시키기 위한 웨이퍼 정지부를 갖춘 반도체웨이퍼 공급장치에 있어서, 상기 웨이퍼 정지부는, 서로 다른 높이상에 형성된 복수의 원호형 차단벽을 가지며 상기 반도체웨이퍼의 수평이송경로상에서 승강 가능하게 설치되는 스토퍼부재와, 이 스토퍼부재를 승강시키기 위한 승강수단을 구비하며; 상기 스토퍼부재의 차단벽들은 각각 다른 크기 반경을 가지며 그 곡률중심들은 동일 수직선상에 위치하는 것을 특징으로 하는 반도체웨이퍼 공급장치.
- 제1항에 있어서, 상기 승강수단은 승강용모터와, 상기 승강용모터의 출력축에 결합된 편심캠과, 상기 스토퍼부재에 고정되며 일측이 상기 편심캠의 외주면에 접촉되어 편심캠의 회전에 따라 승강하도록 된 캠팔로우어를 구비하여 된 것을 특징으로 하는 반도체웨이퍼 공급장치.
- 제1항 또는 제2항에 있어서, 상기 스토퍼부재의 상기 각 차단벽의 하측 바닥면들에는 그 바닥면에 상기 반도체웨이퍼가 놓여져 있는지를 감지하는 센서들이 설치된 것을 특징으로 하는 반도체웨이퍼 공급장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950049284A KR0165350B1 (ko) | 1995-12-13 | 1995-12-13 | 반도체웨이퍼 공급장치 |
US08/680,871 US5669752A (en) | 1995-12-13 | 1996-07-16 | Semiconductor wafer pre-aligning apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950049284A KR0165350B1 (ko) | 1995-12-13 | 1995-12-13 | 반도체웨이퍼 공급장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970053292A true KR970053292A (ko) | 1997-07-31 |
KR0165350B1 KR0165350B1 (ko) | 1999-02-18 |
Family
ID=19439621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950049284A KR0165350B1 (ko) | 1995-12-13 | 1995-12-13 | 반도체웨이퍼 공급장치 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5669752A (ko) |
KR (1) | KR0165350B1 (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09213769A (ja) * | 1996-01-31 | 1997-08-15 | Komatsu Electron Metals Co Ltd | 半導体ウェハの搬送装置 |
US5980195A (en) * | 1996-04-24 | 1999-11-09 | Tokyo Electron, Ltd. | Positioning apparatus for substrates to be processed |
US6113165A (en) * | 1998-10-02 | 2000-09-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Self-sensing wafer holder and method of using |
US6185830B1 (en) * | 1999-03-25 | 2001-02-13 | Lucent Technologies, Inc. | Semiconductor wafer fixture for alignment in a grating exposure process |
US6409463B1 (en) * | 2000-02-08 | 2002-06-25 | Seh America, Inc. | Apparatuses and methods for adjusting a substrate centering system |
JP3581303B2 (ja) * | 2000-07-31 | 2004-10-27 | 東京エレクトロン株式会社 | 判別方法及び処理装置 |
US6631935B1 (en) * | 2000-08-04 | 2003-10-14 | Tru-Si Technologies, Inc. | Detection and handling of semiconductor wafer and wafer-like objects |
US6682295B2 (en) * | 2001-06-21 | 2004-01-27 | Novellus Systems, Inc. | Flatted object passive aligner |
US6638004B2 (en) | 2001-07-13 | 2003-10-28 | Tru-Si Technologies, Inc. | Article holders and article positioning methods |
US6935830B2 (en) * | 2001-07-13 | 2005-08-30 | Tru-Si Technologies, Inc. | Alignment of semiconductor wafers and other articles |
US7334826B2 (en) * | 2001-07-13 | 2008-02-26 | Semitool, Inc. | End-effectors for handling microelectronic wafers |
US7281741B2 (en) * | 2001-07-13 | 2007-10-16 | Semitool, Inc. | End-effectors for handling microelectronic workpieces |
US6615113B2 (en) | 2001-07-13 | 2003-09-02 | Tru-Si Technologies, Inc. | Articles holders with sensors detecting a type of article held by the holder |
US7104578B2 (en) * | 2002-03-15 | 2006-09-12 | Asm International N.V. | Two level end effector |
US20060043750A1 (en) * | 2004-07-09 | 2006-03-02 | Paul Wirth | End-effectors for handling microfeature workpieces |
US20070014656A1 (en) * | 2002-07-11 | 2007-01-18 | Harris Randy A | End-effectors and associated control and guidance systems and methods |
JP2004282002A (ja) * | 2003-02-27 | 2004-10-07 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
US7181132B2 (en) | 2003-08-20 | 2007-02-20 | Asm International N.V. | Method and system for loading substrate supports into a substrate holder |
DE10348821B3 (de) * | 2003-10-13 | 2004-12-16 | HAP Handhabungs-, Automatisierungs- und Präzisionstechnik GmbH | Vorrichtung zum Transportieren und Ausrichten von scheibenförmigen Elementen |
US20070020080A1 (en) * | 2004-07-09 | 2007-01-25 | Paul Wirth | Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine |
KR101450820B1 (ko) * | 2008-10-31 | 2014-10-14 | 주식회사 탑 엔지니어링 | 본딩장치의 척스테이지 승강장치 |
JP6099916B2 (ja) * | 2012-09-25 | 2017-03-22 | 株式会社ダイヘン | ワーク搬送ロボット |
CN105655278B (zh) * | 2014-11-11 | 2018-06-19 | 沈阳新松机器人自动化股份有限公司 | 晶圆尺寸可在线调整的预对准装置 |
US10867822B1 (en) | 2019-07-26 | 2020-12-15 | Yaskawa America, Inc. | Wafer pre-alignment apparatus and method |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62162342A (ja) * | 1986-01-13 | 1987-07-18 | Canon Inc | ウエハの位置合せ装置 |
JPS6372138A (ja) * | 1986-09-12 | 1988-04-01 | Metsukusu:Kk | シリコンウエハ−の位置決め装置 |
JPS63182833A (ja) * | 1987-01-26 | 1988-07-28 | Toshiba Corp | 位置決め装置 |
JPS6440739A (en) * | 1987-08-05 | 1989-02-13 | Tochigi Fuji Sangyo Kk | Power transmitter |
JPH034345A (ja) * | 1989-05-31 | 1991-01-10 | Nec Corp | Id部バックアップ機能付ハードディスク装置 |
JPH0736417B2 (ja) * | 1989-10-24 | 1995-04-19 | 株式会社メツクス | ウエハーの位置決め装置 |
US5183378A (en) * | 1990-03-20 | 1993-02-02 | Tokyo Electron Sagami Limited | Wafer counter having device for aligning wafers |
JPH05193633A (ja) * | 1991-12-19 | 1993-08-03 | Shibuya Kogyo Co Ltd | 容器位置決め装置 |
DE69402918T2 (de) * | 1993-07-15 | 1997-08-14 | Applied Materials Inc | Substratfangvorrichtung und Keramikblatt für Halbleiterbearbeitungseinrichtung |
-
1995
- 1995-12-13 KR KR1019950049284A patent/KR0165350B1/ko not_active IP Right Cessation
-
1996
- 1996-07-16 US US08/680,871 patent/US5669752A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR0165350B1 (ko) | 1999-02-18 |
US5669752A (en) | 1997-09-23 |
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Payment date: 20070830 Year of fee payment: 10 |
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