KR970030587A - 마이크로 콘택트핀의 구조와 이를 이용한 프로브 카드 및 그 제조방법 - Google Patents

마이크로 콘택트핀의 구조와 이를 이용한 프로브 카드 및 그 제조방법 Download PDF

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Publication number
KR970030587A
KR970030587A KR1019960055251A KR19960055251A KR970030587A KR 970030587 A KR970030587 A KR 970030587A KR 1019960055251 A KR1019960055251 A KR 1019960055251A KR 19960055251 A KR19960055251 A KR 19960055251A KR 970030587 A KR970030587 A KR 970030587A
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South Korea
Prior art keywords
wafer
piezoelectric element
probe card
under test
forming
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KR1019960055251A
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English (en)
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다카시 와타나베
미나코 요시다
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오우라 히로시
가부시키가이샤 아드반테스트
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Publication of KR970030587A publication Critical patent/KR970030587A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07392—Multiple probes manipulating each probe element or tip individually
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

본 발명은 각 콘택트핀 개별로 탄성 구조를 가진 고밀도 배열이 가능한 콘택트핀의 구조를 실현한다. 이를 위해서, 상하로 움직일 수 있는 빔(beam)(4)의 일단에 도전성을 부여한 마이크로 콘택트핀(5)을 적어도 1극 설치하고, 빔(4) 을 상하로 움직이게 하는 압전 소자(6) 를 형성하여 설치한다.

Description

마이크로 콘택트핀의 구조와 이를 이용한 프로브 카드 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도 1은 본 발명에 의한 전극이 2열 병행으로 배열되어 있는 경우의 3층 실리콘 기판에서 형성한 프로브 카드의 주요부 단면 구조도.

Claims (6)

  1. 전기적 접촉을 행하는 전극과의 콘택트 구조에 있어서, 상하로 움직일 수 있는 빔(4)의 일단에 도전성을 부여한 적어도 1극의 마이크로 콘택트핀(5)과; 상기 빔(4)을 상하로 움직이게 하는 압전 소자(6)를 구비한 것을 특징으로 한 콘택트 구조.
  2. 웨이퍼(1) 상의 피시험 소자 전극(2)과의 전기적 접촉을 행하는 프로브 카드에 있어서, 피시험 소자 전극(2)의 배열에 대응하여 상하로 움직일 수 있는 빔(4)의 일단에 피시험 소자 전극(2)과 콘택트하는 도전성을 부여한 마이크로 콘택트핀(5)과; 상기 빔(4)을 상하로 움직이게 하는 압전 소자(6)를 구비한 것을 특징으로 한 프로브 카드.
  3. 제2항에 있어서, 상기 압전 소자(6)를 구동하는 압전 소자 구동회로(11)와 이 사이의 접속을 프로브 카드 구조내에 형성한 것을 특징으로 하는 프로브 카드.
  4. 웨이퍼(1) 상의 피시험 소자 전극(2)과의 전기적 접촉을 행하는 프로브 카드에 있어서, 웨이퍼(1) 상의 모든 피시험 소자 전극(2)의 배열에 대응하여 상하로 움직일 수 있는 빔(4)의 일단에 피시험 소자 전극(2)과 콘택트하는 도전성을 부여한 웨이퍼(1) 상의 모든 전극 개수의 마이크로 콘택트핀(5)과; 상기 빔(4)을 상하로 움직이게 하는 압전 소자(6)와; 웨이퍼(1) 상의 각 피시험 소자 단위로 마이크로 콘택트핀(5)을 전환하는 MPX 회로(34)를 구비한 것을 특징으로 하는 프로브 카드.
  5. 실리콘 기판에 마스크를 형성하는 단계(단계(201))와; 드라이 에칭에 의해서 선단에 직방체를 가지는 빔(4)을 형성하는 단계(단계(202))와; 이방성 습식 에칭에 의해 피라미드형의 4각뿔돌기로 가공하여, 마이크로콘택트핀(5)을 형성하는 단계(단계(203))와; 마이크로 콘택트핀부를 절연체(31)에 매몰하는 단계와(단계(204)); 로스트 웨이퍼 처리하여, 빔(4)의 두께를 감소시키는 단계와(단계(205)); 스퍼터에 의해 빔부에 압전 소자(6)를 형성하는 단계(단계(206))와; 실리콘재로 이루어진 희생층(32)을 형성한 제2 실리콘 기판을 빔(4)의 이면에 접합하는 단계(단계(207))와; 희생층(32) 및 절연체(31)를 제거하여, 상하로 움직일 수 있는 빔(4)을 형성하는 단계(단계(209))를 포함하는 것을 특징으로 하는 콘택트의 제조방법.
  6. 실리콘기판에 마스크를 형성하는 단계(단계(201))와; 드라이 에칭에 의해 선단에 직방체를 가지는 빔(4)을 형성하는 단계(단계(202))와; 이방성 습식 에칭에 의해 피라미드형의 4각뿔 돌기로 가공하여, 마이크로 콘택트핀(5)을 형성하는 단계(단계(203))와; 마이크로 콘택트핀부를 절연체(31)에 매몰하는 단계(단계(204))와; 로스트웨이퍼 처리하여 빔(4)의 두께를 감소시키는 단계(단계(205))와; 스퍼티에 의해 빔부에 압전 소자(6)를 형성하는 단계(단계(206))와; 실리콘재로 이루어진 희생층(32) 및 바이어홀(9)을 형성한 제2실리콘 기판을 빔(4)의 이면에 접합하는 단계와(단계(207)); MPX(34) 및 바이어 홀을 형성한 제3실리콘기판을 접합하는 단계(단계(208))와; 희생층(32) 및 절연체(31)를 제거하여 상하로 움직일 수 있는 빔(4)을 형성하는 단계(단계(209))를 포함하는 것을 특징으로 하는 콘택트의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960055251A 1995-11-22 1996-11-19 마이크로 콘택트핀의 구조와 이를 이용한 프로브 카드 및 그 제조방법 KR970030587A (ko)

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JP95-328307 1995-11-22
JP32830795A JP3838381B2 (ja) 1995-11-22 1995-11-22 プローブカード

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US (2) US6072190A (ko)
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