KR970010889B1 - 레이저가공기 및 레이저가공기의 초점설정방법 - Google Patents

레이저가공기 및 레이저가공기의 초점설정방법 Download PDF

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Publication number
KR970010889B1
KR970010889B1 KR1019940701307A KR19940071307A KR970010889B1 KR 970010889 B1 KR970010889 B1 KR 970010889B1 KR 1019940701307 A KR1019940701307 A KR 1019940701307A KR 19940071307 A KR19940071307 A KR 19940071307A KR 970010889 B1 KR970010889 B1 KR 970010889B1
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KR
South Korea
Prior art keywords
processing
focus
lens
workpiece
laser
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1019940701307A
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English (en)
Korean (ko)
Inventor
데쓰야·구보 마나부 오츠키
Original Assignee
미쓰비시덴키 가부시키가이샤
기타오카 다카시
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Publication of KR970010889B1 publication Critical patent/KR970010889B1/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
KR1019940701307A 1993-03-08 1994-03-08 레이저가공기 및 레이저가공기의 초점설정방법 Expired - Fee Related KR970010889B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP93-046633 1993-03-08
JP5046633A JPH06254691A (ja) 1993-03-08 1993-03-08 レーザ加工機およびレーザ加工機の焦点設定方法
PCT/JP1994/000368 WO1994020256A1 (fr) 1993-03-08 1994-03-08 Machine a faisceau laser et procede de focalistion associe

Publications (1)

Publication Number Publication Date
KR970010889B1 true KR970010889B1 (ko) 1997-07-02

Family

ID=12752703

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019940701307A Expired - Fee Related KR970010889B1 (ko) 1993-03-08 1994-03-08 레이저가공기 및 레이저가공기의 초점설정방법
KR1019940701307A Granted KR940703727A (ko) 1993-03-08 1994-03-08 레이저가공기 및 레이저가공기의 초점설정방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1019940701307A Granted KR940703727A (ko) 1993-03-08 1994-03-08 레이저가공기 및 레이저가공기의 초점설정방법

Country Status (7)

Country Link
US (1) US5624587A (enExample)
JP (1) JPH06254691A (enExample)
KR (2) KR970010889B1 (enExample)
CN (1) CN1057721C (enExample)
DE (1) DE4407682C2 (enExample)
TW (1) TW231985B (enExample)
WO (1) WO1994020256A1 (enExample)

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WO2014193134A1 (en) * 2013-05-30 2014-12-04 Eo Technics Co., Ltd. High speed laser processing method and apparatus

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US9022037B2 (en) 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
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JP2006123004A (ja) * 2004-09-29 2006-05-18 Mitsubishi Materials Corp レーザ加工方法及びレーザ加工装置
JP2006167728A (ja) * 2004-12-13 2006-06-29 Yamazaki Mazak Corp レーザ加工機における集光レンズの汚れ検出方法及び装置
JP5393150B2 (ja) 2005-06-23 2014-01-22 トルンプフ ヴェルクツォイクマシーネン ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト レーザビームのフォーカス位置の決定方法
US8135050B1 (en) 2005-07-19 2012-03-13 Raydiance, Inc. Automated polarization correction
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US8189971B1 (en) 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
US7444049B1 (en) 2006-01-23 2008-10-28 Raydiance, Inc. Pulse stretcher and compressor including a multi-pass Bragg grating
US7822347B1 (en) 2006-03-28 2010-10-26 Raydiance, Inc. Active tuning of temporal dispersion in an ultrashort pulse laser system
CN100562877C (zh) * 2006-04-24 2009-11-25 日产自动车株式会社 可照射区域识别方法和装置以及移动路径设定方法
EP1859895A1 (en) * 2006-05-24 2007-11-28 Yamazaki Mazak Corporation Method and device for detecting contaminant on condenser lens in laser processing machine
US8455787B2 (en) * 2007-07-04 2013-06-04 Mitsubishi Electric Corporation Laser processing apparatus, process control apparatus, and processing apparatus
US7903326B2 (en) 2007-11-30 2011-03-08 Radiance, Inc. Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system
US8125704B2 (en) 2008-08-18 2012-02-28 Raydiance, Inc. Systems and methods for controlling a pulsed laser by combining laser signals
US8498538B2 (en) * 2008-11-14 2013-07-30 Raydiance, Inc. Compact monolithic dispersion compensator
WO2012021748A1 (en) 2010-08-12 2012-02-16 Raydiance, Inc. Polymer tubing laser micromachining
US9114482B2 (en) 2010-09-16 2015-08-25 Raydiance, Inc. Laser based processing of layered materials
US20120102831A1 (en) * 2010-11-03 2012-05-03 King Abdul Aziz City For Science And Technology A method for germination of haloxylon persicum
US10239160B2 (en) 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
WO2013121588A1 (ja) * 2012-02-17 2013-08-22 三菱電機株式会社 レーザ加工方法
CN104400227B (zh) * 2014-09-26 2016-02-17 四川汉能光伏有限公司 一种用于激光刻划fto玻璃的加工方法
WO2019093148A1 (ja) * 2017-11-07 2019-05-16 村田機械株式会社 レーザ加工機及び焦点調整方法
JP6753835B2 (ja) * 2017-11-20 2020-09-09 ファナック株式会社 レーザ加工装置
WO2022249352A1 (ja) * 2021-05-26 2022-12-01 ファナック株式会社 レーザ加工機の動作を教示するための教示装置、レーザ加工システム、及び方法
CN117102664B (zh) * 2022-05-16 2025-11-21 浙江正雅齿科股份有限公司 用于切割牙科器械的激光切割机的焦点确定方法、系统
CN115255626B (zh) * 2022-07-14 2026-01-02 武汉逸飞激光股份有限公司 一种实时调整焊接平面至焊接焦距处的方法及装置
CN116203892B (zh) * 2022-12-20 2025-11-21 深圳镁伽科技有限公司 用于加工装置的控制系统和方法、电子设备及存储介质

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WO2014193134A1 (en) * 2013-05-30 2014-12-04 Eo Technics Co., Ltd. High speed laser processing method and apparatus

Also Published As

Publication number Publication date
WO1994020256A1 (fr) 1994-09-15
US5624587A (en) 1997-04-29
JPH06254691A (ja) 1994-09-13
CN1105798A (zh) 1995-07-26
DE4407682A1 (de) 1994-09-15
DE4407682C2 (de) 1999-10-21
KR940703727A (ko) 1994-12-12
CN1057721C (zh) 2000-10-25
TW231985B (enExample) 1994-10-11

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