KR970004011A - 반도체기억장치 및 그 제조방법 - Google Patents
반도체기억장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR970004011A KR970004011A KR1019960020031A KR19960020031A KR970004011A KR 970004011 A KR970004011 A KR 970004011A KR 1019960020031 A KR1019960020031 A KR 1019960020031A KR 19960020031 A KR19960020031 A KR 19960020031A KR 970004011 A KR970004011 A KR 970004011A
- Authority
- KR
- South Korea
- Prior art keywords
- manufacturing
- memory device
- semiconductor memory
- semiconductor
- memory
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/05—Making the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/33—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor extending under the transistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/014—Capacitor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/135—Removal of substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/977—Thinning or removal of substrate
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP95-137968 | 1995-06-05 | ||
JP13796895 | 1995-06-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970004011A true KR970004011A (ko) | 1997-01-29 |
KR100322216B1 KR100322216B1 (ko) | 2002-06-22 |
Family
ID=15210955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960020031A KR100322216B1 (ko) | 1995-06-05 | 1996-06-05 | 반도체 기억 장치 및 그 제조 방법 |
Country Status (2)
Country | Link |
---|---|
US (3) | US5776789A (ko) |
KR (1) | KR100322216B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210069982A (ko) | 2019-12-04 | 2021-06-14 | 현대오토솔루션(주) | 서로 다른 물성을 가진 차량용 충격보강재 및 이것의 제조 방법 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6831322B2 (en) * | 1995-06-05 | 2004-12-14 | Fujitsu Limited | Semiconductor memory device and method for fabricating the same |
US5776789A (en) * | 1995-06-05 | 1998-07-07 | Fujitsu Limited | Method for fabricating a semiconductor memory device |
US6191007B1 (en) * | 1997-04-28 | 2001-02-20 | Denso Corporation | Method for manufacturing a semiconductor substrate |
KR100267013B1 (ko) * | 1998-05-27 | 2000-09-15 | 윤종용 | 반도체 장치 및 그의 제조 방법 |
US6423596B1 (en) * | 1998-09-29 | 2002-07-23 | Texas Instruments Incorporated | Method for two-sided fabrication of a memory array |
KR20000027628A (ko) * | 1998-10-28 | 2000-05-15 | 김영환 | 역 스택 캐패시터 셀 구조 에스오아이(soi) 소자 및 제조방법 |
US6465331B1 (en) * | 2000-08-31 | 2002-10-15 | Micron Technology, Inc. | DRAM fabricated on a silicon-on-insulator (SOI) substrate having bi-level digit lines |
JP2002197866A (ja) * | 2000-09-05 | 2002-07-12 | Seiko Epson Corp | 表示用ドライバic |
FR2848724B1 (fr) * | 2002-12-13 | 2005-04-15 | St Microelectronics Sa | Connexions enterrees dans un substrat de circuit integre |
JP4319078B2 (ja) * | 2004-03-26 | 2009-08-26 | シャープ株式会社 | 半導体装置の製造方法 |
US7235838B2 (en) * | 2004-06-30 | 2007-06-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device substrate with embedded capacitor |
US10170668B2 (en) * | 2011-06-21 | 2019-01-01 | Micron Technology, Inc. | Solid state lighting devices with improved current spreading and light extraction and associated methods |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2743391B2 (ja) * | 1988-08-25 | 1998-04-22 | ソニー株式会社 | 半導体メモリの製造方法 |
US4920065A (en) * | 1988-10-31 | 1990-04-24 | International Business Machines Corporation | Method of making ultra dense dram cells |
US5060034A (en) * | 1988-11-01 | 1991-10-22 | Casio Computer Co., Ltd. | Memory device using thin film transistors having an insulation film with si/n composition ratio of 0.85 to 1.1 |
US4988673A (en) * | 1989-08-02 | 1991-01-29 | The United States Of America As Represented By The Secretary Of The Navy | Method for producing silver coated superconducting ceramic powder |
JP2528731B2 (ja) * | 1990-01-26 | 1996-08-28 | 三菱電機株式会社 | 半導体記憶装置およびその製造方法 |
JP3003188B2 (ja) * | 1990-09-10 | 2000-01-24 | ソニー株式会社 | 半導体メモリ及びその製造方法 |
US5057888A (en) * | 1991-01-28 | 1991-10-15 | Micron Technology, Inc. | Double DRAM cell |
JPH06104410A (ja) * | 1991-10-31 | 1994-04-15 | Sony Corp | Soi構造の形成方法 |
JP3322936B2 (ja) * | 1992-03-19 | 2002-09-09 | 株式会社東芝 | 半導体記憶装置 |
KR100289348B1 (ko) * | 1992-05-25 | 2001-12-28 | 이데이 노부유끼 | 절연기판실리콘반도체장치와그제조방법 |
JPH06275803A (ja) * | 1993-03-18 | 1994-09-30 | Hitachi Ltd | 半導体装置及びその製造方法 |
JPH06283683A (ja) * | 1993-03-30 | 1994-10-07 | Sony Corp | 半導体装置およびその製造方法 |
JPH07130871A (ja) * | 1993-06-28 | 1995-05-19 | Toshiba Corp | 半導体記憶装置 |
JPH0729992A (ja) * | 1993-07-13 | 1995-01-31 | Sony Corp | ダイナミックramのメモリセル構造およびその製造方法 |
JP3301170B2 (ja) * | 1993-08-09 | 2002-07-15 | ソニー株式会社 | 半導体装置の製法 |
JPH0786296A (ja) | 1993-09-10 | 1995-03-31 | Toshiba Corp | 高速バイポーラトランジスタの製造方法 |
US5442584A (en) * | 1993-09-14 | 1995-08-15 | Goldstar Electron Co., Ltd. | Semiconductor memory device and method for fabricating the same dynamic random access memory device construction |
JPH0786596A (ja) * | 1993-09-20 | 1995-03-31 | Fujitsu Ltd | 半導体装置およびその製造方法 |
US5776789A (en) * | 1995-06-05 | 1998-07-07 | Fujitsu Limited | Method for fabricating a semiconductor memory device |
-
1996
- 1996-06-04 US US08/660,324 patent/US5776789A/en not_active Expired - Lifetime
- 1996-06-05 KR KR1019960020031A patent/KR100322216B1/ko not_active IP Right Cessation
-
1997
- 1997-11-14 US US08/970,212 patent/US6472703B1/en not_active Expired - Fee Related
-
2002
- 2002-01-17 US US10/003,304 patent/US20020056866A1/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210069982A (ko) | 2019-12-04 | 2021-06-14 | 현대오토솔루션(주) | 서로 다른 물성을 가진 차량용 충격보강재 및 이것의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
US5776789A (en) | 1998-07-07 |
US20020056866A1 (en) | 2002-05-16 |
KR100322216B1 (ko) | 2002-06-22 |
US6472703B1 (en) | 2002-10-29 |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20101223 Year of fee payment: 10 |
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LAPS | Lapse due to unpaid annual fee |