KR960706052A - 생사 스크리닝에 의한 미니 점화기의 활성 금속화 방법(Active metal metallization of mini igniters by silk screening) - Google Patents

생사 스크리닝에 의한 미니 점화기의 활성 금속화 방법(Active metal metallization of mini igniters by silk screening)

Info

Publication number
KR960706052A
KR960706052A KR1019960702139A KR19960702139A KR960706052A KR 960706052 A KR960706052 A KR 960706052A KR 1019960702139 A KR1019960702139 A KR 1019960702139A KR 19960702139 A KR19960702139 A KR 19960702139A KR 960706052 A KR960706052 A KR 960706052A
Authority
KR
South Korea
Prior art keywords
braze
pad
ceramic
silver
copper
Prior art date
Application number
KR1019960702139A
Other languages
English (en)
Other versions
KR100231080B1 (ko
Inventor
알. 아셀슨 스코트
Original Assignee
스테판 엘. 보스트
쌩 고벵/노튼 인더스트리얼 세라믹스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스테판 엘. 보스트, 쌩 고벵/노튼 인더스트리얼 세라믹스 코포레이션 filed Critical 스테판 엘. 보스트
Publication of KR960706052A publication Critical patent/KR960706052A/ko
Application granted granted Critical
Publication of KR100231080B1 publication Critical patent/KR100231080B1/ko

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F23COMBUSTION APPARATUS; COMBUSTION PROCESSES
    • F23QIGNITION; EXTINGUISHING-DEVICES
    • F23Q7/00Incandescent ignition; Igniters using electrically-produced heat, e.g. lighters for cigarettes; Electrically-heated glowing plugs
    • F23Q7/22Details
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Resistance Heating (AREA)
  • Ceramic Products (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Air Bags (AREA)

Abstract

본 발명에 따른 세라믹 점화기는 리드 와이어와, 세라믹 기판 및, 약 150 미크론 이하의 두께를 갖는 브레이즈 패드를 포함하며, 상기 리드 와이어 및 세라믹 기판은 브레이즈 패드에 의해 전기 접속부에 위치된다.

Description

생사 스크리닝에 의한 미니 점화기의 활성 금속화 방법(Active metal metallization of mini igniters by silk screening)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 브레이즈 패드에 납땜된 접속 리드를 구비한 적합한 점화기 몸체에 대한 평면도.

Claims (11)

  1. 리드 와이어와; 세라믹 기판 및; 약 150 미크론 이하의 두께를 갖는 브레이즈 패드를 포함하며, 상기 리드 와이어 및 세라믹 기판은 브레이즈 패드에 의해 전기 접속부에 위치되는 것을 특징으로 하는 세라믹 점화기.
  2. 제1항에 있어서, 상기 패드는 약 115 미크론 이하의 두께를 갖는 것을 특징으로 하는 세라믹 점화기.
  3. 제1항에 있어서, 상기 패드는 약 80 미크론 이하의 두께를 갖는 것을 특징으로 하는 세라믹 점화기.
  4. 제1항에 있어서, 상기 패드는 3.6평방 밀리미터 이하의 노출면 영역을 갖는 것을 특징으로 하는 세라믹 점화기.
  5. 제1항에 있어서, 티탄, 지르코늄, 니오븀, 니켈, 팔라듐 및 금으로 이루어진 그룹으로부터 선정된 활성 금속을 포함하는 것을 특징으로 하는 세라믹 점화기.
  6. 제5항에 있어서, 상기 브레이즈 패드는 은, 구리, 인듐, 주석, 아연, 납, 카드뮴 및 인으로 이루어진 그룹으로부터 선정된 하나 이상의 필러 금속을 부가로 포함하는 것을 특징으로 하는 세라믹 점화기.
  7. 제1항에 있어서, 상기 브레이즈 패드는 티탄, 구리 및 은을 포함하는 것을 특징으로 하는 세라믹 점화기.
  8. 전기 전도성 세라믹 기판을 구비하며, 브레이즈 패드를 생성하기 위해 브레이즈 물질을 전기 전도성 세라믹 기판상에 생사 스크리닝하는 단계 및; 전기 리드를 약 500℃ 이상의 온도에서 용해되는 결합물에 의해 브레이즈 패드에 결합하는 단계를 포함하는 것을 특징으로 하는 세라믹 점화기 제조 방법.
  9. 제8항에 있어서, 상기 브레이즈 물질은 타타늄, 지르코늄, 니오븀, 니켈, 팔라듐 및 금으로 이루어진 그룹으로부터 선정된 활성 금속을 포함하는 것을 특징으로 하는 세라믹 점화기 제조 방법.
  10. 제9항에 있어서, 상기 브레이즈 물질은 은, 구리, 인듐, 주석, 아연, 납, 카드뮴 및 인으로 이루어진 그룹으로부터 선정된 하나 이상의 필러 금속을 부가로 포함하는 것을 특징으로 하는 세라믹 점화기 제조 방법.
  11. 제8항에 있어서, 상기 브레이즈 물질은 티타늄, 구리 및 은을 포함하는 것을 특징으로 하는 세라믹 점화기 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960702139A 1993-10-28 1994-10-17 생사 스크리닝에 의한 미니 점화기의 활성 금속화 방법 KR100231080B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US144,078 1993-10-28
US08/144,078 US5705261A (en) 1993-10-28 1993-10-28 Active metal metallization of mini-igniters by silk screening
US144078 1993-10-28
PCT/US1994/011433 WO1995012093A2 (en) 1993-10-28 1994-10-17 Active metal metallization of mini-igniters by silk screening

Publications (2)

Publication Number Publication Date
KR960706052A true KR960706052A (ko) 1996-11-08
KR100231080B1 KR100231080B1 (ko) 1999-11-15

Family

ID=22506951

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960702139A KR100231080B1 (ko) 1993-10-28 1994-10-17 생사 스크리닝에 의한 미니 점화기의 활성 금속화 방법

Country Status (9)

Country Link
US (2) US5705261A (ko)
EP (1) EP0725916B1 (ko)
JP (1) JP3213004B2 (ko)
KR (1) KR100231080B1 (ko)
AU (1) AU1396195A (ko)
CA (1) CA2173739C (ko)
DE (1) DE69411392T2 (ko)
ES (1) ES2119381T3 (ko)
WO (1) WO1995012093A2 (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU695975B2 (en) * 1996-01-26 1998-08-27 Saint-Gobain Industrial Ceramics, Inc. Novel ceramic igniter and method of using same
US5786565A (en) * 1997-01-27 1998-07-28 Saint-Gobain/Norton Industrial Ceramics Corporation Match head ceramic igniter and method of using same
JP3688429B2 (ja) * 1997-04-25 2005-08-31 株式会社東芝 電子部品実装用基板および電子部品実装基板
EP0930282B1 (en) * 1998-01-16 2005-12-07 Denso Corporation Ceramic-metal junction structure and a method for manufacturing the same
JP2000058237A (ja) * 1998-06-05 2000-02-25 Ngk Spark Plug Co Ltd セラミックヒ―タ及びそれを用いた酸素センサ
US6078028A (en) * 1999-02-19 2000-06-20 Saint-Gobain Industrial Ceramics, Inc. Solderless ceramic igniter having a leadframe attachment
DE19956767A1 (de) * 1999-11-25 2001-05-31 Nanogate Gmbh Siliziumcarbid-Element
US6582629B1 (en) 1999-12-20 2003-06-24 Saint-Gobain Ceramics And Plastics, Inc. Compositions for ceramic igniters
AU2002247252A1 (en) * 2001-03-05 2002-09-19 Saint-Gobain Ceramics & Plastics, Inc. Ceramic igniters
JP2005526221A (ja) * 2001-08-18 2005-09-02 サンーゴバン セラミックス アンド プラスティクス,インコーポレイティド 密封した電気接点部分を有するセラミックイグナイター
GB2404128B (en) 2003-07-16 2005-08-24 Kanthal Ltd Silicon carbide furnace heating elements
MXPA06013887A (es) * 2004-05-28 2007-01-26 Saint Gobain Ceramics Sistemas de encendido.
EP1749616A1 (de) * 2005-08-05 2007-02-07 Grillo-Werke AG Verfahren zum Lichtbogen- oder Strahllöten/-schweissen von Werkstücken gleicher oder verschiedener Metalle oder Metalllegierungen mit Zusatzwerkstoffen aus Sn-Basis-Legierungen; Draht bestehend aus einer Zinn-Basis-Legierung
US7696455B2 (en) * 2006-05-03 2010-04-13 Watlow Electric Manufacturing Company Power terminals for ceramic heater and method of making the same
MX2010007140A (es) * 2007-12-29 2010-08-12 Saint Gobain Ceramics Encendedor de ceramica coaxial y metodos de fabricacion.
GB0810406D0 (en) 2008-06-06 2008-07-09 Kanthal Ltd Electrical resistance heating elements
US8158909B2 (en) * 2008-06-12 2012-04-17 Delphi Technologies, Inc. Hot zone igniter
US20100065052A1 (en) * 2008-09-16 2010-03-18 Alexza Pharmaceuticals, Inc. Heating Units
US20120048963A1 (en) 2010-08-26 2012-03-01 Alexza Pharmaceuticals, Inc. Heat Units Using a Solid Fuel Capable of Undergoing an Exothermic Metal Oxidation-Reduction Reaction Propagated without an Igniter
FI3268072T3 (fi) 2015-03-11 2024-01-24 Alexza Pharmaceuticals Inc Antistaattisten materiaalien käyttö ilmatiessä aerosolin lämpökondensaatioprosessissa

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3006069A (en) * 1957-05-23 1961-10-31 Rca Corp Method of sealing a metal member to a ceramic member
US3779804A (en) * 1970-12-30 1973-12-18 Nat Lead Co Electrodes for ceramic bodies
US3875476A (en) * 1974-01-10 1975-04-01 Honeywell Inc Igniter element
US4122771A (en) * 1977-04-13 1978-10-31 General Dynamics Squeegee holder
GB2095905B (en) * 1981-03-27 1985-01-16 Philips Electronic Associated Infra-red radiation imaging devices and methods for their manufacture
JPS58209084A (ja) * 1982-05-28 1983-12-05 株式会社日立製作所 直熱形ヒ−タ材
JPS5978973A (ja) * 1982-10-27 1984-05-08 株式会社日立製作所 導電性セラミツクス
US4544611A (en) * 1982-11-19 1985-10-01 E. I. Du Pont De Nemours And Company Conductive element metallized with a thick film silver composition
US4512871A (en) * 1983-05-09 1985-04-23 Ngk Insulators, Ltd. Oxygen sensor with heater
US5085804A (en) * 1984-11-08 1992-02-04 Norton Company Refractory electrical device
US5045237A (en) * 1984-11-08 1991-09-03 Norton Company Refractory electrical device
JPS6265991A (ja) * 1985-09-13 1987-03-25 株式会社東芝 高熱伝導性セラミツクス基板
JP2573225B2 (ja) * 1987-02-10 1997-01-22 株式会社東芝 電子部品の製造方法
US4818821A (en) * 1988-03-30 1989-04-04 Motorola Inc. Brazed leaded package
US4883745A (en) * 1988-11-07 1989-11-28 Gte Products Corporation Silver-copper-titanium brazing alloy containing crust inhibiting element
CA2053454A1 (en) * 1990-11-13 1992-05-14 Scott R. Axelson Extended life ceramic igniters
US5191508A (en) * 1992-05-18 1993-03-02 Norton Company Ceramic igniters and process for making same
US5367195A (en) * 1993-01-08 1994-11-22 International Business Machines Corporation Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal

Also Published As

Publication number Publication date
WO1995012093A2 (en) 1995-05-04
US5564618A (en) 1996-10-15
DE69411392D1 (de) 1998-08-06
DE69411392T2 (de) 1999-04-08
US5705261A (en) 1998-01-06
CA2173739A1 (en) 1995-05-04
WO1995012093A3 (en) 1995-05-18
EP0725916A1 (en) 1996-08-14
JP3213004B2 (ja) 2001-09-25
ES2119381T3 (es) 1998-10-01
EP0725916B1 (en) 1998-07-01
JPH09504359A (ja) 1997-04-28
CA2173739C (en) 1999-01-05
AU1396195A (en) 1995-05-22
KR100231080B1 (ko) 1999-11-15

Similar Documents

Publication Publication Date Title
KR960706052A (ko) 생사 스크리닝에 의한 미니 점화기의 활성 금속화 방법(Active metal metallization of mini igniters by silk screening)
US4259679A (en) Display devices
EP0935286A4 (en) COPPER CIRCUIT JUNCTION SUBSTRATE AND PROCESS FOR PRODUCING THE SAME
KR950000902A (ko) 고온의 무연 주석 기제 다-성분 납땜 합금
ATE65346T1 (de) Mit lot versehenes kontaktelement.
KR920001701A (ko) 반도체 장치 및 그 제조방법
MY124950A (en) Surface electrode structure on ceramic multi-layer substrate and process for producing the same
US6039238A (en) Electrical connection method
DE69422026T2 (de) Verbesserter halbleiter-brückenzünder
KR900701144A (ko) 핀 그리드 어레이 패키지
US4818821A (en) Brazed leaded package
KR840005266A (ko) 유리 캡슐형 세라믹 커패시터의 금속결합
EP0380289A3 (en) A process of manufacturing a multi-layer ceramic substrate assembly
EP1039527A3 (en) Semiconductor device mounting structure
TW339302B (en) Solder active braze composition, method of forming an electrically conductive trace comprizing it and electronic assembly comprizing it
JPS5660038A (en) Semiconductor device
JPH0529389A (ja) 半導体素子の接続構造
FR2382100A1 (fr) Structure de brasage d'un conducteur sur un dispositif semi-conducteur
JPS61124071A (ja) 電気的接続装置
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
JPS647630A (en) Bonding structure of semiconductor device
JPS56142659A (en) Semiconductor device
JPS61234540A (ja) 半導体装置
JPH02250392A (ja) 配線基板の製造方法
JPS554904A (en) Semi-conductor device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20110228

Year of fee payment: 12

LAPS Lapse due to unpaid annual fee