FR2382100A1 - Structure de brasage d'un conducteur sur un dispositif semi-conducteur - Google Patents

Structure de brasage d'un conducteur sur un dispositif semi-conducteur

Info

Publication number
FR2382100A1
FR2382100A1 FR7805408A FR7805408A FR2382100A1 FR 2382100 A1 FR2382100 A1 FR 2382100A1 FR 7805408 A FR7805408 A FR 7805408A FR 7805408 A FR7805408 A FR 7805408A FR 2382100 A1 FR2382100 A1 FR 2382100A1
Authority
FR
France
Prior art keywords
conductor
semiconductor device
brazing structure
present
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7805408A
Other languages
English (en)
Other versions
FR2382100B1 (fr
Inventor
Shinzo Anazawa
Hideaki Kozu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of FR2382100A1 publication Critical patent/FR2382100A1/fr
Application granted granted Critical
Publication of FR2382100B1 publication Critical patent/FR2382100B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H05K2201/10772—Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne une structure de brasage d'un conducteur sur un dispositif semiconducteur. Selon la présente invention un conducteur de connexion 33 est brasé par un matériau de brasure 4 à une couche métallique 2 sur un substrat 1. Le conducteur 33 comprend une zone recourbée sensiblement à angle droit qui vient s'appliquer sensiblement orthogonalement au plan de la couche conductrice 2. Application à l'amélioration de la résistance mécanique des liaisons entre un dispositif électronique et ses conducteurs d'amenée.
FR7805408A 1977-02-25 1978-02-24 Structure de brasage d'un conducteur sur un dispositif semi-conducteur Granted FR2382100A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977022962U JPS5756527Y2 (fr) 1977-02-25 1977-02-25

Publications (2)

Publication Number Publication Date
FR2382100A1 true FR2382100A1 (fr) 1978-09-22
FR2382100B1 FR2382100B1 (fr) 1984-01-13

Family

ID=12097205

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7805408A Granted FR2382100A1 (fr) 1977-02-25 1978-02-24 Structure de brasage d'un conducteur sur un dispositif semi-conducteur

Country Status (4)

Country Link
US (1) US4340901A (fr)
JP (1) JPS5756527Y2 (fr)
DE (1) DE2807601A1 (fr)
FR (1) FR2382100A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698853A (en) * 1980-01-11 1981-08-08 Hitachi Ltd Structure of lead in semiconductor device
JPS60166150U (ja) * 1984-04-11 1985-11-05 日本碍子株式会社 集積回路装置用リ−ドフレ−ム
JP3117828B2 (ja) * 1992-12-28 2000-12-18 ローム株式会社 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法
JP2005191147A (ja) * 2003-12-24 2005-07-14 Sanyo Electric Co Ltd 混成集積回路装置の製造方法
DE102010053760A1 (de) * 2010-12-02 2012-06-06 Micro-Epsilon Messtechnik Gmbh & Co. Kg Sensor mit einem vorzugsweise mehrschichtigen Keramiksubstrat und Verfahren zu dessen Herstellung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1524758A (fr) * 1966-06-01 1968-05-10 Rca Corp Dispositif semiconducteur et son procédé de fabrication
FR2204895A1 (fr) * 1972-10-31 1974-05-24 Siemens Ag

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT206006B (de) * 1957-07-23 1959-11-10 Telefunken Gmbh Zuleitung zu einer Legierungsstelle einer Kristallode des Legierungstyps
DE1439642A1 (de) * 1963-08-08 1969-01-23 Telefunken Patent Elektrisches Bauelement
US3277232A (en) * 1964-02-21 1966-10-04 Electra Mfg Company Lead construction for miniature electrical circuit elements
US3405382A (en) * 1965-09-13 1968-10-08 Beckman Instruments Inc Terminal and tap connections for resistance element
DE1589543B2 (de) * 1967-09-12 1972-08-24 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement und verfahren zu seiner weichlotkontaktierung
DE1966001C3 (de) * 1967-09-12 1974-06-06 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement. Ausscheidung aus: 1911915
US3681667A (en) * 1969-12-12 1972-08-01 Gen Electric Controlled rectifier and triac with laterally off-set gate and auxiliary segments for accelerated turn on
US3715633A (en) * 1971-07-15 1973-02-06 J Nier Semiconductor unit with integrated circuit
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
JPS5220230B2 (fr) * 1973-06-22 1977-06-02
US4141028A (en) * 1977-08-10 1979-02-20 Rca Corporation Contact clip
US4185317A (en) * 1977-12-22 1980-01-22 Union Carbide Corporation Anode and cathode lead wire assembly for solid electrolytic capacitors

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1524758A (fr) * 1966-06-01 1968-05-10 Rca Corp Dispositif semiconducteur et son procédé de fabrication
FR2204895A1 (fr) * 1972-10-31 1974-05-24 Siemens Ag

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
EXBK/67 *
EXBK/77 *

Also Published As

Publication number Publication date
FR2382100B1 (fr) 1984-01-13
DE2807601A1 (de) 1978-08-31
JPS53118464U (fr) 1978-09-20
US4340901A (en) 1982-07-20
JPS5756527Y2 (fr) 1982-12-04

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