JPS5454571A - Wire bonding method of semiconductor device - Google Patents

Wire bonding method of semiconductor device

Info

Publication number
JPS5454571A
JPS5454571A JP12171477A JP12171477A JPS5454571A JP S5454571 A JPS5454571 A JP S5454571A JP 12171477 A JP12171477 A JP 12171477A JP 12171477 A JP12171477 A JP 12171477A JP S5454571 A JPS5454571 A JP S5454571A
Authority
JP
Japan
Prior art keywords
wire bonding
wire
semiconductor device
bonding method
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12171477A
Other languages
Japanese (ja)
Inventor
Haruka Machitori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12171477A priority Critical patent/JPS5454571A/en
Publication of JPS5454571A publication Critical patent/JPS5454571A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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    • H01L2224/0554—External layer
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    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
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Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To perform wire bonding of semiconductor devices through laser radiation.
CONSTITUTION: A wire 4 let out from a capillary 7 is pressed and contacted to the Al vapor deposition wiring of a Si substrate 3 and the wire 4 is radiated with a fine laser beam, whereby it is fused and bonded. Since this method enables high energies to be focused at a minute point, wire bonding may be performed without impairing element characteristics, the need for plating on the surface is eliminated, and the use of inexpensive Al wirings is made possible
COPYRIGHT: (C)1979,JPO&Japio
JP12171477A 1977-10-11 1977-10-11 Wire bonding method of semiconductor device Pending JPS5454571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12171477A JPS5454571A (en) 1977-10-11 1977-10-11 Wire bonding method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12171477A JPS5454571A (en) 1977-10-11 1977-10-11 Wire bonding method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5454571A true JPS5454571A (en) 1979-04-28

Family

ID=14818053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12171477A Pending JPS5454571A (en) 1977-10-11 1977-10-11 Wire bonding method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5454571A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856430A (en) * 1981-09-30 1983-04-04 Nec Corp Manufacture of semiconductor device
WO2006120886A1 (en) * 2005-05-09 2006-11-16 Denso Corporation Semiconductor device having elemental device part and method for manufacturing same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856430A (en) * 1981-09-30 1983-04-04 Nec Corp Manufacture of semiconductor device
WO2006120886A1 (en) * 2005-05-09 2006-11-16 Denso Corporation Semiconductor device having elemental device part and method for manufacturing same
JP2006344934A (en) * 2005-05-09 2006-12-21 Denso Corp Semiconductor device and method for manufacturing same
JP4710700B2 (en) * 2005-05-09 2011-06-29 株式会社デンソー Semiconductor device and manufacturing method thereof

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