GB1368960A - Soldering electrical components to thick film circuits - Google Patents

Soldering electrical components to thick film circuits

Info

Publication number
GB1368960A
GB1368960A GB4849870A GB4849870A GB1368960A GB 1368960 A GB1368960 A GB 1368960A GB 4849870 A GB4849870 A GB 4849870A GB 4849870 A GB4849870 A GB 4849870A GB 1368960 A GB1368960 A GB 1368960A
Authority
GB
United Kingdom
Prior art keywords
glass frit
thick film
palladium
tin
platinum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4849870A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF International UK Ltd
Original Assignee
Lucas Industries Ltd
Joseph Lucas Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Industries Ltd, Joseph Lucas Industries Ltd filed Critical Lucas Industries Ltd
Priority to GB4849870A priority Critical patent/GB1368960A/en
Priority to IT5338571A priority patent/IT939530B/en
Priority to DE19712150818 priority patent/DE2150818A1/en
Priority to FR7136788A priority patent/FR2111315A5/fr
Publication of GB1368960A publication Critical patent/GB1368960A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/248—Finish coating of conductors by using conductive pastes, inks or powders fired compositions for inorganic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

1368960 Soldering JOSEPH LUCAS (INDUSTRIES) Ltd 7 Oct 1971 [13 Oct 1970] 48498/70 Heading B3R In soldering, with a solder containing lead and tin, an electrical component to a fired paste thick film circuit, a surface layer formed from a glass frit in admixture with either platinum or palladium is applied to a terminal region of the circuit and subsequently the component is soldered to the surface layer with the solder. The substrate carrying the thick film circuit may be high alumina ceramic or glass and the terminal region may consist of fired paste containing palladium/gold/glass frit or palladium/ silver/glass frit to which an overlayer of fired platinum and glass frit paste is applied. Instead of the platinum and glass frit overlayer palladium and glass frit may be used. The solders employed may be 60% tin-40% lead or 62% tin-36% lead-2% silver.
GB4849870A 1970-10-13 1970-10-13 Soldering electrical components to thick film circuits Expired GB1368960A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB4849870A GB1368960A (en) 1970-10-13 1970-10-13 Soldering electrical components to thick film circuits
IT5338571A IT939530B (en) 1970-10-13 1971-10-11 METHOD FOR WELDING COMPONENTS ON CIRCUITS AND CIRCUITS SO OBTAINED
DE19712150818 DE2150818A1 (en) 1970-10-13 1971-10-12 LOT OF COMPONENTS ON THICK FILM CIRCUITS
FR7136788A FR2111315A5 (en) 1970-10-13 1971-10-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4849870A GB1368960A (en) 1970-10-13 1970-10-13 Soldering electrical components to thick film circuits

Publications (1)

Publication Number Publication Date
GB1368960A true GB1368960A (en) 1974-10-02

Family

ID=10448842

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4849870A Expired GB1368960A (en) 1970-10-13 1970-10-13 Soldering electrical components to thick film circuits

Country Status (4)

Country Link
DE (1) DE2150818A1 (en)
FR (1) FR2111315A5 (en)
GB (1) GB1368960A (en)
IT (1) IT939530B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4341816A (en) * 1979-08-21 1982-07-27 Siemens Aktiengesellschaft Method for attaching disc- or plate-shaped targets to cooling plates for sputtering systems
FR2844917A1 (en) * 2002-09-20 2004-03-26 Bosch Gmbh Robert Fabrication of an insulating substrate with a conductor coating, for micro-electronic applications calling for high density integration

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5110034A (en) * 1990-08-30 1992-05-05 Quantum Magnetics, Inc. Superconducting bonds for thin film devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4341816A (en) * 1979-08-21 1982-07-27 Siemens Aktiengesellschaft Method for attaching disc- or plate-shaped targets to cooling plates for sputtering systems
FR2844917A1 (en) * 2002-09-20 2004-03-26 Bosch Gmbh Robert Fabrication of an insulating substrate with a conductor coating, for micro-electronic applications calling for high density integration
US7976892B2 (en) 2002-09-20 2011-07-12 Robert Bosch Gmbh Method for producing a conductive coating on an insulating substrate

Also Published As

Publication number Publication date
IT939530B (en) 1973-02-10
DE2150818A1 (en) 1973-07-19
FR2111315A5 (en) 1972-06-02

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee