KR960009988B1 - 박판에 대한 점착테이프의 점착 커트장치 - Google Patents

박판에 대한 점착테이프의 점착 커트장치 Download PDF

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Publication number
KR960009988B1
KR960009988B1 KR1019870011224A KR870011224A KR960009988B1 KR 960009988 B1 KR960009988 B1 KR 960009988B1 KR 1019870011224 A KR1019870011224 A KR 1019870011224A KR 870011224 A KR870011224 A KR 870011224A KR 960009988 B1 KR960009988 B1 KR 960009988B1
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KR
South Korea
Prior art keywords
adhesive tape
tape
adhesive
thin plate
cutter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019870011224A
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English (en)
Korean (ko)
Other versions
KR890004388A (ko
Inventor
다까오 마쯔시다
아끼히고 끼라
미노루 아메따니
Original Assignee
닛도 덴기 고오교오 가부시기가이샤
가마이 고로오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛도 덴기 고오교오 가부시기가이샤, 가마이 고로오 filed Critical 닛도 덴기 고오교오 가부시기가이샤
Publication of KR890004388A publication Critical patent/KR890004388A/ko
Application granted granted Critical
Publication of KR960009988B1 publication Critical patent/KR960009988B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1343—Cutting indefinite length web after assembly with discrete article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/525—Operation controlled by detector means responsive to work
    • Y10T83/538—Positioning of tool controlled

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Cutting Devices (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
KR1019870011224A 1987-08-11 1987-10-06 박판에 대한 점착테이프의 점착 커트장치 Expired - Fee Related KR960009988B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP61-81837 1986-04-07
JP62201185A JPS6443458A (en) 1987-08-11 1987-08-11 Stick cutter for tacky tape with respect to thin board
JP87-201185 1987-08-11
JP62-201185 1987-08-11

Publications (2)

Publication Number Publication Date
KR890004388A KR890004388A (ko) 1989-04-21
KR960009988B1 true KR960009988B1 (ko) 1996-07-25

Family

ID=16436756

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870011224A Expired - Fee Related KR960009988B1 (ko) 1987-08-11 1987-10-06 박판에 대한 점착테이프의 점착 커트장치

Country Status (5)

Country Link
US (1) US4865677A (enExample)
EP (1) EP0307509B1 (enExample)
JP (1) JPS6443458A (enExample)
KR (1) KR960009988B1 (enExample)
DE (1) DE3779640T2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7300818B2 (en) 2001-09-27 2007-11-27 Kabushiki Kaisha Toshiba Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer
KR100869174B1 (ko) * 2007-08-20 2008-11-21 김창회 고무판절단기

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04336428A (ja) * 1991-05-13 1992-11-24 Nitto Denko Corp ウエハのテープ貼合わせ剥離装置
KR970002433B1 (ko) * 1993-12-31 1997-03-05 삼성전자 주식회사 마스킹 필름의 부착 방법 및 이에 사용되는 마스킹 필름 부착 장치
JP2666788B2 (ja) * 1995-10-19 1997-10-22 日本電気株式会社 チップサイズ半導体装置の製造方法
JPH1032179A (ja) * 1996-07-15 1998-02-03 Teikoku T-Pingu Syst Kk シリコンウエハー加工用マスキングシートの切断方法
US6838810B1 (en) 1997-03-21 2005-01-04 Chunghwa Picture Tubes, Ltd. Flat-panel display mounting system for portable computer
US6080263A (en) * 1997-05-30 2000-06-27 Lintec Corporation Method and apparatus for applying a protecting film to a semiconductor wafer
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US7492421B1 (en) 1997-07-03 2009-02-17 Lg Display Co., Ltd. Case for liquid crystal display
US6139676A (en) * 1997-08-14 2000-10-31 Microchip Technology Incorporated Apparatus and method for removing semiconductor chips from a diced semiconductor wafer
US6202482B1 (en) * 1998-03-23 2001-03-20 Lehighton Electronics, Inc. Method and apparatus for testing of sheet material
JP3560823B2 (ja) * 1998-08-18 2004-09-02 リンテック株式会社 ウェハ転写装置
US6336787B1 (en) * 1999-10-07 2002-01-08 Mosel Vitelic, Inc. Method for transferring wafers in a semiconductor tape-peeling apparatus
SG92771A1 (en) 2000-12-19 2002-11-19 Chee Peng Neo In-process tape bur monitoring
KR20020061228A (ko) * 2001-01-15 2002-07-24 미크론정공 주식회사 반도체 패키지의 제조방법 및 테이프 라미네이션 장치
JP2002367931A (ja) * 2001-06-07 2002-12-20 Lintec Corp ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法
JP3983053B2 (ja) * 2002-01-17 2007-09-26 日東電工株式会社 保護テープの切断方法およびそれを用いた保護テープ貼付装置
KR100468748B1 (ko) * 2002-07-12 2005-01-29 삼성전자주식회사 프리컷 다이싱 테이프와 범용 다이싱 테이프를 웨이퍼에 마운팅할 수 있는 다이싱 테이프 부착 장비 및 이를포함하는 인라인 시스템
JP2004047823A (ja) * 2002-07-12 2004-02-12 Tokyo Seimitsu Co Ltd ダイシングテープ貼付装置およびバックグラインド・ダイシングテープ貼付システム
SG110108A1 (en) * 2003-09-24 2005-04-28 Nitto Denko Corp Method and apparatus for joining adhesive tape
TW200539357A (en) * 2004-04-28 2005-12-01 Lintec Corp Adhering apparatus and adhering method
US8207748B2 (en) * 2004-08-11 2012-06-26 Lehighton Electronics, Inc. Device and handling system for measurement of mobility and sheet charge density
JP2006100413A (ja) * 2004-09-28 2006-04-13 Tokyo Seimitsu Co Ltd フィルム貼付方法およびフィルム貼付装置
JP2006272505A (ja) * 2005-03-29 2006-10-12 Nitto Denko Corp 保護テープ切断方法およびこれを用いた装置
JP4795743B2 (ja) * 2005-05-19 2011-10-19 リンテック株式会社 貼付装置
ATE541207T1 (de) 2005-11-14 2012-01-15 Lehighton Electronics Inc Messsystem für blattleitfähigkeit/-widerstand
KR101981639B1 (ko) * 2012-11-13 2019-05-27 삼성디스플레이 주식회사 시트 커팅 장치 및 그것을 이용한 시트 커팅 방법
CN105128766B (zh) * 2015-09-02 2018-09-18 宁波宏协承汽车部件有限公司 一种将胶带自动贴在汽车纯押密封条上的装置
CN111377296A (zh) * 2018-12-29 2020-07-07 广东汉能薄膜太阳能有限公司 一种贴胶装置以及贴胶系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207496A (ja) * 1982-05-28 1983-12-02 東京電力株式会社 拡幅自在のシ−ルド掘進機のテ−ルシ−ル装置
GB2128580B (en) * 1982-09-06 1986-07-02 Kulicke & Soffa Handling system for laminar objects
JPS5955702A (ja) * 1982-09-25 1984-03-30 株式会社名南製作所 ベニヤ単板の接合装置
JPS6060800A (ja) * 1983-09-13 1985-04-08 日東電工株式会社 リングと薄板の貼着装置
US4603609A (en) * 1983-10-21 1986-08-05 Disco Abrasive Systems, Ltd. Apparatus for cutting a sheet-like member applied to a surface of a semiconductor wafer
JPS60100450A (ja) * 1983-11-07 1985-06-04 Disco Abrasive Sys Ltd 半導体ウエーハ装着及び切断装置
CA1243417A (en) * 1984-03-16 1988-10-18 Shoji Tanaka Printed circuit board laminating apparatus
GB2159763B (en) * 1984-06-06 1987-11-18 Nitto Electric Ind Co Process for sticking adhesive tape on thin article
JPS61249299A (ja) * 1985-04-25 1986-11-06 日東電工株式会社 薄板保護用フイルムの切抜き方法ならびに装置
JPH0666386B2 (ja) * 1985-06-26 1994-08-24 株式会社日立製作所 ウエハテ−プマウント方法および装置
JPS628966A (ja) * 1985-07-05 1987-01-16 Nitto Electric Ind Co Ltd ウエハとリングフレ−ムの貼り合せ方法ならびに装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7300818B2 (en) 2001-09-27 2007-11-27 Kabushiki Kaisha Toshiba Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer
US7631680B2 (en) 2001-09-27 2009-12-15 Kabushiki Kaisha Toshiba Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer
KR100869174B1 (ko) * 2007-08-20 2008-11-21 김창회 고무판절단기

Also Published As

Publication number Publication date
DE3779640D1 (de) 1992-07-09
DE3779640T2 (de) 1993-01-21
EP0307509A2 (en) 1989-03-22
EP0307509B1 (en) 1992-06-03
KR890004388A (ko) 1989-04-21
JPS6443458A (en) 1989-02-15
JPH0550428B2 (enExample) 1993-07-29
US4865677A (en) 1989-09-12
EP0307509A3 (en) 1990-01-24

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