KR960009140A - 분리된 다이 패드를 갖는 반도체 패키지 - Google Patents

분리된 다이 패드를 갖는 반도체 패키지 Download PDF

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Publication number
KR960009140A
KR960009140A KR1019950019636A KR19950019636A KR960009140A KR 960009140 A KR960009140 A KR 960009140A KR 1019950019636 A KR1019950019636 A KR 1019950019636A KR 19950019636 A KR19950019636 A KR 19950019636A KR 960009140 A KR960009140 A KR 960009140A
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KR
South Korea
Prior art keywords
semiconductor package
die pads
separate die
separate
pads
Prior art date
Application number
KR1019950019636A
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English (en)
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KR0148077B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR1019950019636A priority Critical patent/KR0148077B1/ko
Priority to JP7198665A priority patent/JP2951573B2/ja
Priority to US08/512,014 priority patent/US6160307A/en
Publication of KR960009140A publication Critical patent/KR960009140A/ko
Application granted granted Critical
Publication of KR0148077B1 publication Critical patent/KR0148077B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1019950019636A 1994-08-16 1995-07-05 분리된 다이 패드를 갖는 반도체 패키지 KR0148077B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019950019636A KR0148077B1 (ko) 1994-08-16 1995-07-05 분리된 다이 패드를 갖는 반도체 패키지
JP7198665A JP2951573B2 (ja) 1994-08-16 1995-08-03 分離されたダイパッドを有する半導体パッケージ
US08/512,014 US6160307A (en) 1994-08-16 1995-08-07 Semiconductor packages having split die pad

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR94-20086 1994-08-16
KR19940020086 1994-08-16
KR1019950019636A KR0148077B1 (ko) 1994-08-16 1995-07-05 분리된 다이 패드를 갖는 반도체 패키지

Publications (2)

Publication Number Publication Date
KR960009140A true KR960009140A (ko) 1996-03-22
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JP4066644B2 (ja) * 2001-11-26 2008-03-26 株式会社豊田自動織機 半導体装置、半導体装置の配線方法
US7230321B2 (en) * 2003-10-13 2007-06-12 Mccain Joseph Integrated circuit package with laminated power cell having coplanar electrode
US7557433B2 (en) 2004-10-25 2009-07-07 Mccain Joseph H Microelectronic device with integrated energy source
KR100568224B1 (ko) * 2003-11-04 2006-04-07 삼성전자주식회사 테이프 배선 기판 및 그를 포함하는 반도체 장치
JP4705881B2 (ja) * 2006-05-09 2011-06-22 パナソニック株式会社 リードフレーム及びそれを用いた半導体装置
JP2008078445A (ja) * 2006-09-22 2008-04-03 Yamaha Corp リードフレーム
US7834435B2 (en) * 2006-12-27 2010-11-16 Mediatek Inc. Leadframe with extended pad segments between leads and die pad, and leadframe package using the same
US8124461B2 (en) 2006-12-27 2012-02-28 Mediatek Inc. Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
JP2008218776A (ja) * 2007-03-06 2008-09-18 Renesas Technology Corp 半導体装置
US8067825B2 (en) * 2007-09-28 2011-11-29 Stats Chippac Ltd. Integrated circuit package system with multiple die
US9118324B2 (en) * 2008-06-16 2015-08-25 Silicon Works Co., Ltd. Driver IC chip and pad layout method thereof
KR100992415B1 (ko) * 2008-06-16 2010-11-05 주식회사 실리콘웍스 드라이버 집적회로 칩의 패드 배치 구조
US8569872B2 (en) * 2008-07-01 2013-10-29 Stats Chippac Ltd. Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation
WO2023157604A1 (ja) * 2022-02-15 2023-08-24 ローム株式会社 半導体装置および半導体装置の実装構造体

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KR0148077B1 (ko) 1998-08-01
JP2951573B2 (ja) 1999-09-20
US6160307A (en) 2000-12-12
JPH0870059A (ja) 1996-03-12

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