KR960009112A - 반도체 칩 분리장치 - Google Patents

반도체 칩 분리장치 Download PDF

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Publication number
KR960009112A
KR960009112A KR1019940020721A KR19940020721A KR960009112A KR 960009112 A KR960009112 A KR 960009112A KR 1019940020721 A KR1019940020721 A KR 1019940020721A KR 19940020721 A KR19940020721 A KR 19940020721A KR 960009112 A KR960009112 A KR 960009112A
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KR
South Korea
Prior art keywords
semiconductor chip
ejector
support
semiconductor
separator
Prior art date
Application number
KR1019940020721A
Other languages
English (en)
Inventor
진호태
조정순
강성호
최희국
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019940020721A priority Critical patent/KR960009112A/ko
Priority to JP20358595A priority patent/JPH0878505A/ja
Priority to FR9509979A priority patent/FR2723930A1/fr
Publication of KR960009112A publication Critical patent/KR960009112A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)

Abstract

반도체 칩을 접착 테이프로부터 하부에서 밀어올려 분리시키기 위한 이젝터와, 이젝터를 지지하는 지지대와, 반도체 칩을 상부에서 진공으로 떼어내기 위한 픽업 툴로 구성되어 있는 반도체 칩 분리장치에 있어서; 반도체 칩 분리 공정중에 반도체 칩의 하부에 균열이 발생하는 문제점을 해결하기 위하여, 이젝터의 상부에 다수개의 선단이 둥근 이젝터 핀을 부착하고, 상기 지지대의 상부에는 다수개의 관통공을 형성한 반도체 칩 분리장치를 구현하였다. 따라서, 이 반도체 칩 분리장치는 반도체 칩의 균열이 분제되는 모든 반도체 패키지의 다이 본딩시에 적용될 수 있다.

Description

반도체 칩 분리장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 이 발명에 따른 반도체 칩 분리장치의 일 실시예를 나타낸 단면도.

Claims (3)

  1. 반도체 칩을 접착 테이프로부터 하부에서 밀어올려 분리시키기 위한 이젝터와, 상기 이젝터를 지지하는 지지대와, 상기 반도체 칩을 상부에서 진공으로 떼어내기 위한 픽업 툴로 구성되어 있는 반도체 칩 분리장치에 있어서; 상기 이젝터의 상부에는 다수개의 선단이 둥근 이젝터 핀이 부착되어 있고, 상기 지지대의 상부에는 다수개의 관통공을 형성된 것을 특징으로 하는 반도체 칩 분리장치.
  2. 제1항에 있어서, 상기 이젝터는 적어도 1단계 이상으로 상하 이동하는 것을 특징으로 하는 반도체 칩 분리장치.
  3. 제1항에 있어서, 상기 이젝터 핀 선단의 곡률 반경은 0.20mm 보다 크고 0.50mm 보다 작은 것을 특징으로 하는 반도체 칩 분리장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940020721A 1994-08-23 1994-08-23 반도체 칩 분리장치 KR960009112A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019940020721A KR960009112A (ko) 1994-08-23 1994-08-23 반도체 칩 분리장치
JP20358595A JPH0878505A (ja) 1994-08-23 1995-08-09 半導体チップ分離装置
FR9509979A FR2723930A1 (fr) 1994-08-23 1995-08-22 Appareil destine a separer une plaquette semi-conductrice d'une bande fixee sur une rondelle comprenant la plaquette

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940020721A KR960009112A (ko) 1994-08-23 1994-08-23 반도체 칩 분리장치

Publications (1)

Publication Number Publication Date
KR960009112A true KR960009112A (ko) 1996-03-22

Family

ID=19390889

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940020721A KR960009112A (ko) 1994-08-23 1994-08-23 반도체 칩 분리장치

Country Status (3)

Country Link
JP (1) JPH0878505A (ko)
KR (1) KR960009112A (ko)
FR (1) FR2723930A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100688587B1 (ko) * 2006-02-23 2007-03-02 삼성전자주식회사 반도체 칩 분리 장치 및 반도체 칩의 분리 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100865766B1 (ko) * 2007-07-24 2008-10-29 (주) 에스에스피 반도체 다이 이젝팅 장치
KR100970270B1 (ko) * 2008-05-09 2010-07-16 (주) 엔지온 반도체 장치
US9142434B2 (en) 2008-10-23 2015-09-22 Freescale Semiconductor, Inc. Method for singulating electronic components from a substrate
CN112919040B (zh) * 2021-03-09 2022-02-15 苏州威达智电子科技有限公司 一种适用于触摸板的辅助胶带去除装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0242437A (ja) * 1988-08-02 1990-02-13 Fuji Photo Film Co Ltd ハロゲン化銀カラー写真感光材料
JPH0416302A (ja) * 1990-05-09 1992-01-21 Ishita:Kk 製材装置
JPH0625964U (ja) * 1992-05-25 1994-04-08 ミクロン機器株式会社 通信機能付きコインカウンタ及び有料装置
JP3018769B2 (ja) * 1992-09-03 2000-03-13 富士通株式会社 チップ配列方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100688587B1 (ko) * 2006-02-23 2007-03-02 삼성전자주식회사 반도체 칩 분리 장치 및 반도체 칩의 분리 방법

Also Published As

Publication number Publication date
FR2723930A1 (fr) 1996-03-01
JPH0878505A (ja) 1996-03-22

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