KR960008501B1 - Image projection method, semiconductor device manufacturing method using the same and projection exposure apparatus for semiconductor device manufacture - Google Patents

Image projection method, semiconductor device manufacturing method using the same and projection exposure apparatus for semiconductor device manufacture Download PDF

Info

Publication number
KR960008501B1
KR960008501B1 KR92013847A KR920013847A KR960008501B1 KR 960008501 B1 KR960008501 B1 KR 960008501B1 KR 92013847 A KR92013847 A KR 92013847A KR 920013847 A KR920013847 A KR 920013847A KR 960008501 B1 KR960008501 B1 KR 960008501B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
exposure apparatus
same
device manufacturing
image projection
Prior art date
Application number
KR92013847A
Other languages
English (en)
Other versions
KR930005116A (ko
Inventor
Akiyoshi Szuki
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of KR930005116A publication Critical patent/KR930005116A/ko
Application granted granted Critical
Publication of KR960008501B1 publication Critical patent/KR960008501B1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591Testing optical components
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/46Systems using spatial filters
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/50Optics for phase object visualisation
    • G02B27/52Phase contrast optics
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/701Off-axis setting using an aperture
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70108Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70133Measurement of illumination distribution, in pupil plane or field plane
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70283Mask effects on the imaging process

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR92013847A 1991-08-02 1992-07-31 Image projection method, semiconductor device manufacturing method using the same and projection exposure apparatus for semiconductor device manufacture KR960008501B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-194132 1991-08-02
JP3194132A JPH0536586A (ja) 1991-08-02 1991-08-02 像投影方法及び該方法を用いた半導体デバイスの製造方法

Publications (2)

Publication Number Publication Date
KR930005116A KR930005116A (ko) 1993-03-23
KR960008501B1 true KR960008501B1 (en) 1996-06-26

Family

ID=16319444

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92013847A KR960008501B1 (en) 1991-08-02 1992-07-31 Image projection method, semiconductor device manufacturing method using the same and projection exposure apparatus for semiconductor device manufacture

Country Status (5)

Country Link
US (2) US5608575A (ko)
EP (2) EP0526242B1 (ko)
JP (1) JPH0536586A (ko)
KR (1) KR960008501B1 (ko)
DE (2) DE69230443T2 (ko)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3165711B2 (ja) * 1991-08-02 2001-05-14 キヤノン株式会社 像投影方法及び該方法を用いた半導体デバイスの製造方法
JPH0547628A (ja) * 1991-08-09 1993-02-26 Canon Inc 像投影方法及びそれを用いた半導体デバイスの製造方法
JPH0567558A (ja) * 1991-09-06 1993-03-19 Nikon Corp 露光方法
NL194929C (nl) * 1992-10-20 2003-07-04 Samsung Electronics Co Ltd Projectiebelichtingssysteem.
US5729331A (en) * 1993-06-30 1998-03-17 Nikon Corporation Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus
JPH07122478A (ja) * 1993-10-27 1995-05-12 Sony Corp パターン投影方法
JP3186011B2 (ja) * 1994-06-24 2001-07-11 キヤノン株式会社 投影露光装置及びデバイス製造方法
JP3046270U (ja) * 1995-01-31 1998-03-06 康司 栗原 十字ピン型アンカー
JPH0950958A (ja) * 1995-05-29 1997-02-18 Nikon Corp 照明光学装置及びそれを備えた投影露光装置
DE19548805A1 (de) * 1995-12-27 1997-07-03 Zeiss Carl Fa REMA-Objektiv für Mikrolithographie-Projektionsbelichtungsanlagen
EP0797121B1 (en) * 1996-03-18 2003-06-11 Matsushita Electric Industrial Co., Ltd. Exposure apparatus
JPH09320945A (ja) * 1996-05-24 1997-12-12 Nikon Corp 露光条件測定方法及び露光装置
JPH10153866A (ja) * 1996-11-22 1998-06-09 Nikon Corp 照明装置および該照明装置を備えた露光装置
US7130129B2 (en) 1996-12-21 2006-10-31 Carl Zeiss Smt Ag Reticle-masking objective with aspherical lenses
US6027865A (en) * 1997-02-10 2000-02-22 Texas Instruments Incorporated Method for accurate patterning of photoresist during lithography process
US6563567B1 (en) * 1998-12-17 2003-05-13 Nikon Corporation Method and apparatus for illuminating a surface using a projection imaging apparatus
WO2001020733A1 (fr) * 1999-09-10 2001-03-22 Nikon Corporation Source lumineuse et procede de commande de stabilisation de longueur d'onde, appareil et procede d'exposition, procede de production d'un appareil d'exposition et procede de fabrication d'un dispositif et dispositif associe
US6468815B1 (en) * 2000-01-03 2002-10-22 Advanced Micro Devices, Inc. Overlay radius offset shift engine
US20020041377A1 (en) * 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
DE10031719A1 (de) * 2000-06-29 2002-01-10 Leica Microsystems Beleuchtungseinrichtung und Koordinaten-Meßgerät mit einer Beleuchtungseinrichtung
US7092073B2 (en) 2000-07-07 2006-08-15 Asml Netherlands B.V. Method of illuminating a photomask using chevron illumination
EP1184727A1 (en) * 2000-09-01 2002-03-06 Asm Lithography B.V. Lithographic apparatus
KR100583692B1 (ko) * 2000-09-01 2006-05-25 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치 작동 방법, 리소그래피 장치, 디바이스제조방법, 및 이것에 의해 제조된 디바이스
EP1426826A3 (en) 2002-12-02 2006-12-20 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1426823A1 (en) * 2002-12-02 2004-06-09 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
TWI281099B (en) * 2002-12-02 2007-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
AU2002363884A1 (en) * 2002-12-19 2004-07-14 Carl Zeiss Smt Ag Method and system for measuring the reproduction quality of an optical reproduction system
US7196772B2 (en) * 2003-11-07 2007-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7397535B2 (en) * 2005-12-21 2008-07-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7589832B2 (en) * 2006-08-10 2009-09-15 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device method
JP4635085B2 (ja) 2008-03-03 2011-02-16 株式会社東芝 半導体装置の製造方法
US20090257043A1 (en) * 2008-04-14 2009-10-15 Nikon Corporation Illumination optical system, exposure apparatus, device manufacturing method, and exposure optical system
US9389519B2 (en) * 2010-02-25 2016-07-12 Nikon Corporation Measuring method and measuring apparatus of pupil transmittance distribution, exposure method and exposure apparatus, and device manufacturing method
DE102011003066A1 (de) * 2010-02-26 2011-09-01 Carl Zeiss Smt Gmbh Verfahren zum belastungsgerechten Betrieb einer Projektionsbelichtungsanlage sowie entsprechende Projektionsbelichtungsanlage
US10144969B2 (en) 2011-06-15 2018-12-04 Colgate-Palmolive Company Compositions and methods for diagnosing and monitoring hyperthyroidism in a feline
TWI656409B (zh) * 2015-09-09 2019-04-11 美商克萊譚克公司 基於輔助電磁場之引入之一階散射測量疊加之新方法

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1572805B1 (de) * 1967-08-05 1970-08-27 Philips Patentverwaltung Verfahren zur Bildvervielfachung
IT939738B (it) * 1970-08-12 1973-02-10 Rank Organisation Ltd Dispositivo di illuminazione per la stampa fotolitografica dei componenti di microcircuiti
GB1391270A (en) * 1971-12-08 1975-04-16 Rank Organisation Ltd Photolithography
US3887816A (en) * 1973-04-26 1975-06-03 Litton Medical Products Optical system for x-ray scanning equipment
US4159164A (en) * 1973-10-23 1979-06-26 U.S. Philips Corporation Method of eliminating errors in images derived from patterns which consist of periodically arranged individual images
DE2835363A1 (de) * 1978-08-11 1980-03-13 Siemens Ag Verfahren zum uebertragen von strukturen fuer halbleiterschaltungen
JPS5762052A (en) * 1980-09-30 1982-04-14 Nippon Kogaku Kk <Nikon> Original plate to be projected for use in transmission
US4547037A (en) * 1980-10-16 1985-10-15 Regents Of The University Of Minnesota Holographic method for producing desired wavefront transformations
JPS5825638A (ja) * 1981-08-08 1983-02-15 Canon Inc 露光装置
JPS58147708A (ja) * 1982-02-26 1983-09-02 Nippon Kogaku Kk <Nikon> 照明用光学装置
JPS59100805A (ja) * 1982-12-01 1984-06-11 Canon Inc 物体観察装置
JPS59141226A (ja) * 1983-02-02 1984-08-13 Canon Inc 観察装置
JPS59149317A (ja) * 1983-02-16 1984-08-27 Nippon Kogaku Kk <Nikon> 投影型露光装置のアライメント光学系
JPS6045252A (ja) * 1983-08-23 1985-03-11 Canon Inc 投影露光装置の照明系
US4799791A (en) * 1984-02-13 1989-01-24 Canon Kabushiki Kaisha Illuminance distribution measuring system
JPS6119129A (ja) * 1984-07-05 1986-01-28 Nippon Kogaku Kk <Nikon> 投影光学装置
JPS61210627A (ja) * 1985-03-15 1986-09-18 Canon Inc 有効光源測定用ピンホ−ル板
US5153419A (en) * 1985-04-22 1992-10-06 Canon Kabushiki Kaisha Device for detecting position of a light source with source position adjusting means
US4947030A (en) * 1985-05-22 1990-08-07 Canon Kabushiki Kaisha Illuminating optical device
JPH0616480B2 (ja) * 1985-06-03 1994-03-02 株式会社日立製作所 縮小投影式アライメント方法およびその装置
JPH0782981B2 (ja) * 1986-02-07 1995-09-06 株式会社ニコン 投影露光方法及び装置
JPS62298728A (ja) * 1986-06-18 1987-12-25 Fujitsu Ltd 照度測定装置
JP2571054B2 (ja) * 1987-04-28 1997-01-16 キヤノン株式会社 露光装置及び素子製造方法
US4943733A (en) * 1987-05-15 1990-07-24 Nikon Corporation Projection optical apparatus capable of measurement and compensation of distortion affecting reticle/wafer alignment
US4902899A (en) * 1987-06-01 1990-02-20 International Business Machines Corporation Lithographic process having improved image quality
JPS6461716A (en) * 1987-08-31 1989-03-08 Canon Kk Illuminator
EP0646911A3 (en) * 1988-06-14 1995-08-23 Nec Corp Optical head arrangement.
US4947413A (en) * 1988-07-26 1990-08-07 At&T Bell Laboratories Resolution doubling lithography technique
JP2699433B2 (ja) * 1988-08-12 1998-01-19 株式会社ニコン 投影型露光装置及び投影露光方法
US4924257A (en) * 1988-10-05 1990-05-08 Kantilal Jain Scan and repeat high resolution projection lithography system
US5191374A (en) * 1988-11-17 1993-03-02 Nikon Corporation Exposure control apparatus
US5121160A (en) * 1989-03-09 1992-06-09 Canon Kabushiki Kaisha Exposure method and apparatus
JPH0812843B2 (ja) * 1989-03-15 1996-02-07 日本精工株式会社 光学結像装置及び方法
EP0437376B1 (en) * 1990-01-12 1997-03-19 Sony Corporation Phase shifting masks and methods of manufacture
JP2893778B2 (ja) * 1990-01-17 1999-05-24 キヤノン株式会社 露光装置
US5253040A (en) * 1990-11-09 1993-10-12 Mitsubishi Denki Kabushiki Kaisha Projection aligner
US5144362A (en) * 1990-11-14 1992-09-01 Mitsubishi Denki Kabushiki Kaisha Projection aligner
DE69132120T2 (de) * 1990-11-15 2000-09-21 Nikon Corp Verfahren und Vorrichtung zur Projektionsbelichtung
JP3360686B2 (ja) * 1990-12-27 2002-12-24 株式会社ニコン 照明光学装置および投影露光装置並びに露光方法および素子製造方法
JP2788791B2 (ja) * 1991-01-08 1998-08-20 三菱電機株式会社 フライアイレンズ装置およびそのフライアイレンズ装置を含む照明装置
US5305054A (en) * 1991-02-22 1994-04-19 Canon Kabushiki Kaisha Imaging method for manufacture of microdevices
US5097291A (en) * 1991-04-22 1992-03-17 Nikon Corporation Energy amount control device
US5194345A (en) * 1991-05-14 1993-03-16 Micron Technology, Inc. Method of fabricating phase shift reticles
JPH04369209A (ja) * 1991-06-17 1992-12-22 Nikon Corp 露光用照明装置
JP2924344B2 (ja) * 1991-08-09 1999-07-26 キヤノン株式会社 投影露光装置
US5424803A (en) * 1991-08-09 1995-06-13 Canon Kabushiki Kaisha Projection exposure apparatus and semiconductor device manufacturing method
US5264898A (en) * 1991-08-29 1993-11-23 Mitsubishi Denki Kabushiki Kaisha Projection exposure apparatus
JP2803934B2 (ja) * 1991-12-10 1998-09-24 三菱電機株式会社 投影露光装置及び露光方法
JPH05217855A (ja) * 1992-02-01 1993-08-27 Nikon Corp 露光用照明装置
JP2760931B2 (ja) * 1993-03-10 1998-06-04 株式会社 栗本鐵工所 注液機構付混練機

Also Published As

Publication number Publication date
EP0526242B1 (en) 1995-12-27
EP0614097B1 (en) 1999-12-15
DE69230443T2 (de) 2000-05-18
DE69230443D1 (de) 2000-01-20
EP0614097A1 (en) 1994-09-07
DE69207106T2 (de) 1996-05-15
KR930005116A (ko) 1993-03-23
EP0526242A1 (en) 1993-02-03
DE69207106D1 (de) 1996-02-08
US5608575A (en) 1997-03-04
JPH0536586A (ja) 1993-02-12
US5631773A (en) 1997-05-20

Similar Documents

Publication Publication Date Title
KR960008501B1 (en) Image projection method, semiconductor device manufacturing method using the same and projection exposure apparatus for semiconductor device manufacture
SG40012A1 (en) Projection exposure apparatus and device manufacturing method using the same
EP0509797A3 (en) Projection exposure apparatus
EP0486316A3 (en) Projection exposure method and apparatus
HK55194A (en) Camera apparatus for preventing double exposure
GB2249189B (en) Exposure apparatus
EP0507487A3 (en) Optical projection exposure method and system using the same
EP0484179A3 (en) Wafer holding device in an exposure apparatus
EP0678768A3 (en) Projection setting apparatus and method for manufacturing a microdevice.
EP0643461A3 (en) Method for manufacturing an optical semiconductor device.
EP0422853A3 (en) Apparatus for semiconductor lithography
EP0503472A3 (en) Exposure apparatus and method
EP0494311A4 (en) Method of inspecting semiconductor device, apparatus for inspecting the same, and method of manufacturing the same
EP0342061A3 (en) Projection exposure apparatus
EP0446076A3 (en) Exposure apparatus
EP0516136A3 (en) Semiconductor manufacturing apparatus
GB9401772D0 (en) Apparatus for fabricating semiconductor device andmethod for fabricating semiconductor device
EP0632330A3 (en) A method of forming a photosensitive material and an exposure apparatus used for the method.
EP0489426A3 (en) Projection exposure method
EP0649170A3 (en) Inspection device for semiconductor wafers.
EP0785472A3 (en) Scan type projection exposure apparatus and device manufacturing method using the same
EP0503595A3 (en) Exposure apparatus
GB2244350B (en) Image forming method and apparatus for the same
KR0137309B1 (en) Projection exposure apparatus and method for manufacturing a devcie using the same
EP0481091A4 (en) Method, device and substance for forming picture

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20110524

Year of fee payment: 16

EXPY Expiration of term